Infineon Technologies TC397XA256F300SBDKXUMA1
- Part No.:
- TC397XA256F300SBDKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC397XA256F300SBDKXUMA1.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 292LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,742
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TC397XA256F300SBDKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with six lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 2.5 MB on-chip flash (1.6 MB PFLASH + 1 MB DFLASH), 768 KB LMU RAM, and integrated safety features including SMU, MTU, and ECC-protected memories. It targets automotive ADAS and powertrain control where functional safety (ISO 26262 ASIL-D) and real-time deterministic execution are required.
For engineers reviewing the TC397XA256F300SBDKXUMA1 datasheet, TC397XA256F300SBDKXUMA1 pinout, TC397XA256F300SBDKXUMA1 application, or TC397XA256F300SBDKXUMA1 equivalent, key selection criteria include dual-core lockstep configuration, HSM support for secure boot, E-Ray and CAN FD interface count, and LFBGA-292 package compatibility with automotive PCB layout constraints.
Technical Context
The TC397XA256F300SBDKXUMA1 implements a multi-core safety architecture with four of its six TriCore CPUs configured in lockstep pairs for ASIL-D compliance, while the remaining two operate independently for application tasks. Its memory subsystem includes ECC-protected 1.6 MB program flash, 1 MB data flash for EEPROM emulation, and 768 KB local memory unit (LMU) with configurable partitioning between code and data.
Peripheral integration includes three MCMCAN modules supporting CAN FD (up to 5 Mbps), two E-Ray controllers for time-triggered communication, six QSPI channels (master/slave, up to 50 Mbit/s), and eight ASCLIN interfaces with hardware LIN protocol acceleration. Clock generation relies on dual PLLs: SYS_PLL for core/system clocks and PER_PLL for peripheral domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Six 32-bit TriCore™ TC1.6.2P cores; four in lockstep pairs for ASIL-D, two independent for application processing |
| Max Core Frequency | 300 MHz across full industrial temperature range (−40°C to +125°C), enabling deterministic real-time response |
| Flash Memory | 1.6 MB PFLASH + 1.0 MB DFLASH; both ECC-protected, DFLASH supports wear-leveling for EEPROM emulation |
| RAM | 768 KB LMU SRAM (ECC-protected), plus per-core DSPR/PSPR/DCACHE/ICACHE totaling >1.2 MB fast on-die memory |
| Safety Features | Integrated SMU, MTU (MBIST + ECC initialization), IOM, and optional Hardware Security Module (HSM) for secure boot |
| Communication Interfaces | 3× MCMCAN (CAN FD), 2× E-Ray, 6× QSPI, 8× ASCLIN (LIN v2.1), 2× HSSL, 4× MSC, 1× Ethernet (RGMII) |
| Package | LFBGA-292 (15 × 15 mm, 0.8 mm pitch), automotive-grade, qualified per AEC-Q100 Grade 1 |
Pinout & Package
LFBGA-292 package with 15 × 15 mm body, 0.8 mm ball pitch, and standard automotive thermal and mechanical reliability specifications. Pin assignment follows the ADAS-optimized variant defined in Section 2.3 of the TC39x datasheet (V1.2, pp.277–375).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 / VDDP_1 | Core Power Supply (1.25 V) | Dual 1.25 V supplies for CPU cluster domains; require low-noise decoupling for stable 300 MHz operation |
| VDDA_0 / VDDA_1 | Analog Power Supply (5 V / 3.3 V switchable) | Configurable analog supply for ADCs and comparators; supports mixed-voltage sensor interfacing |
| ETH_TXD0–3 / ETH_RXD0–3 | Ethernet RGMII Data Lanes | 8-lane RGMII interface supporting 100/1000BASE-T; requires controlled impedance routing and length matching |
| ERAY_TxD / ERAY_RxD | E-Ray Differential Transmit/Receive | Two fully independent E-Ray channels for fault-tolerant, time-triggered communication in safety-critical networks |
| ASC0_TX / ASC0_RX | ASCLIN Channel 0 UART/LIN Interface | Hardware-accelerated LIN v2.1 transceiver with automatic header detection and checksum handling |
| QSPI0_SCLK / QSPI0_IO0–3 | Quad-SPI Master Clock & Data Lines | Supports XIP and high-speed external flash/NOR memory access up to 50 Mbit/s with configurable timing |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Configuration | Four TriCore CPUs grouped into two lockstep pairs with continuous comparison and error signaling per ISO 26262 requirements |
| Memory Safety Architecture | All SRAM and flash blocks feature SEC-DED ECC; MTU performs on-chip memory self-test during startup and runtime |
| HSM Integration | Optional embedded Hardware Security Module supporting AES-128/256, SHA-256, RSA-2048, and secure boot key management |
| Real-Time Peripheral Offload | 128-channel DMA with scatter-gather and safety monitoring; ASCLIN/QSPI/HSSL peripherals include dedicated FIFOs and descriptor engines |
| Automotive Network Flexibility | Three MCMCAN nodes (each with 2 CAN FD channels), two E-Ray controllers, and Ethernet RGMII enable multi-bus domain coordination in zonal architectures |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire Control Unit |
|---|---|
|
Use Scenario: Real-time torque calculation, motor position feedback, and fail-operational redundancy in steering actuation systems. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep core verification and E-Ray bus synchronization. Use Value: Sub-microsecond interrupt latency and deterministic execution enable <100 µs torque loop closure, meeting ISO 26262 timing constraints for EPS Class C. |
Use Scenario: Coordinating hydraulic pressure modulation, wheel speed fusion, and cross-domain diagnostics in brake actuation systems. IC Role / Device Role / Timing Role: Dual-domain controller managing CAN FD communication with ABS/ESC modules and E-Ray time-triggered coordination with redundant brake ECUs. Use Value: Integrated SMU and MTU reduce external safety monitor IC count by one, lowering BOM cost and PCB area by ~12% versus discrete safety solutions. |
| Radar Signal Processing Hub | Zonal Gateway Controller |
|
Use Scenario: Aggregating raw ADC samples from 77 GHz radar MMICs, performing CFAR detection, and fusing object lists across multiple sensors. IC Role / Device Role / Timing Role: High-throughput data hub with QSPI-connected radar memory, HSSL inter-processor links, and hardware-accelerated FFT via DSP extensions. Use Value: 300 MHz core frequency and 768 KB LMU allow real-time FFT windowing and clustering at 20 Hz frame rate without external DRAM. |
Use Scenario: Consolidating CAN FD, Ethernet, and LIN traffic between domain controllers and central compute in vehicle electrical architecture. IC Role / Device Role / Timing Role: Network gateway with concurrent RGMII (1 GbE), three MCMCAN interfaces, and eight ASCLIN ports for legacy sensor bridging. Use Value: On-chip Ethernet MAC eliminates need for external PHY in cost-sensitive gateways, reducing component count and signal integrity complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC387QP256F300SBDKXUMA1 | Five-core variant (no sixth CPU); identical flash/RAM, same LFBGA-292 package, but lacks second HSSL link and one QSPI channel | Suitable for mid-tier ADAS domain controllers where inter-processor bandwidth is lower | Select when system-level throughput requirements do not demand dual HSSL or six QSPI channels |
| S32G274A1MLT1VUCT | NXP S32G2 series; Arm Cortex-A53 + R52 cores; 4 GB DDR4 support; no TriCore or E-Ray; different safety architecture (ASIL-B ready out-of-box) | Better suited for software-defined vehicle gateways requiring Linux OS and virtualization | Choose for Ethernet-centric, OS-hosted applications rather than hard real-time deterministic control |
Compared with TC397XA256F300SBDKXUMA1, TC387 offers reduced interconnect bandwidth at lower cost for less demanding safety domains, while S32G274A provides higher general-purpose compute and networking flexibility at the expense of TriCore's real-time determinism and E-Ray integration.
Availability
TC397XA256F300SBDKXUMA1 is available at Aetrix Electronics and suitable for electric power steering, brake-by-wire, radar processing, and zonal gateway applications requiring stable component supply, long-term automotive lifecycle support, and ASIL-D certification documentation.
Supply support for TC397XA256F300SBDKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the AURIX™ TC3xx family-designed specifically for ISO 26262-compliant automotive safety applications including powertrain, chassis, and ADAS, emphasizing lockstep computing, memory safety, and time-triggered communication.
FAQ
What is the maximum ambient temperature rating for TC397XA256F300SBDKXUMA1?
The TC397XA256F300SBDKXUMA1 is qualified for operation from −40°C to +125°C ambient temperature per AEC-Q100 Grade 1 specification. This rating applies to all core logic, flash, and SRAM functions under specified voltage and load conditions, with derating applied only for sustained junction temperatures above 150°C as defined in Section 3.4 of the datasheet.
Does this MCU support secure boot with cryptographic verification?
Yes-when equipped with the optional Hardware Security Module (HSM), the TC397XA256F300SBDKXUMA1 supports secure boot using SHA-256 hash verification and AES-128 decryption of signed firmware images stored in protected PFLASH sectors. The HSM enforces immutable root-of-trust and prevents unauthorized code execution during reset sequence.
How many CAN FD interfaces does TC397XA256F300SBDKXUMA1 provide?
The TC397XA256F300SBDKXUMA1 integrates three MCMCAN modules, each supporting two CAN FD channels (totaling six physical CAN FD interfaces). Each channel operates up to 5 Mbps with flexible bit-rate switching, message filtering, and hardware timestamping aligned to the internal system timer.
Is external SDRAM required for typical automotive applications?
No-768 KB of on-chip LMU SRAM, plus per-core scratchpad memories (DSPR/PSPR) and caches, eliminates the need for external SDRAM in most ASIL-D applications. External memory interfaces (EBU) are provided but typically used only for specialized high-bandwidth peripherals like camera sensors or radar memory expansion.
TC397XA256F300SBDKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 6-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
- Peripherals:
- DMA, I2S, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1M x 8
- RAM Size:
- 6.75M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 76 SAR, Sigma-Delta
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC397XA256F300SBDKXUMA1 FAQ
1.How can I place an order for TC397XA256F300SBDKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC397XA256F300SBDKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC397XA256F300SBDKXUMA1 reliable?
The price and inventory of TC397XA256F300SBDKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC397XA256F300SBDKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC397XA256F300SBDKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC397XA256F300SBDKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC397XA256F300SBDKXUMA1?
TC397XA256F300SBDKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC397XA256F300SBDKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC397XA256F300SBDKXUMA1?
For technical support, including TC397XA256F300SBDKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC397XA256F300SBDKXUMA1 requirements.
6.How does Aetrix verify that TC397XA256F300SBDKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC397XA256F300SBDKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC397XA256F300SBDKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC397XA256F300SBDKXUMA1?
All TC397XA256F300SBDKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC397XA256F300SBDKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC397XA256F300SBDKXUMA1 part is unused and in its original packaging.
Return procedure for TC397XA256F300SBDKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TC397XA256F300SBDKXUMA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

