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Infineon Technologies TC397XP256F300SBDKXUMA1
- Part No.:
- TC397XP256F300SBDKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC397XP256F300SBDKXUMA1.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,595
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Product details
Overview
TC397XP256F300SBDKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with six lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 2.5 MB on-chip flash (2 MB PFLASH + 512 KB DFLASH), 768 KB SRAM (ECC-protected), and integrated hardware safety features including SMU, MTU, and optional HSM. It targets automotive ADAS and powertrain control where functional safety up to ASIL-D is required.
For engineers reviewing the TC397XP256F300SBDKXUMA1 datasheet, TC397XP256F300SBDKXUMA1 pinout, TC397XP256F300SBDKXUMA1 application, or TC397XP256F300SBDKXUMA1 equivalent, this device delivers deterministic real-time execution, dual-core lockstep redundancy, CAN FD and Ethernet (RGMII) connectivity, and full ISO 26262-compliant safety mechanisms for safety-critical ECU designs.
Technical Context
The TC397XP256F300SBDKXUMA1 implements a heterogeneous multi-core architecture: four TriCore CPUs operate in lockstep pairs (2×2) for ASIL-D compliance, while two additional cores run independently for application tasks. Its System Phase Locked Loop (SYS_PLL) supports precise clock generation up to 300 MHz with jitter < ±50 ps RMS over temperature.
It integrates three MCMCAN modules (12 CAN FD channels total), one RGMII Ethernet MAC with IEEE 1588 timestamping support, and eight ASCLIN interfaces with LIN v2.1 compliance. Memory subsystem includes ECC-protected PFLASH/DFLASH, LMU SRAM, and scratchpad RAMs with configurable retention modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Six 32-bit TriCore™ TC1.6.2P cores; four configured in lockstep pairs for ASIL-D fault tolerance |
| Max Clock Frequency | 300 MHz across full industrial temperature range (–40°C to +125°C ambient) |
| Flash Memory | 2 MB program flash (PFLASH) + 512 KB data flash (DFLASH) with ECC, wear-leveling, and EEPROM emulation capability |
| RAM | 768 KB on-chip SRAM (LMU), all ECC-protected; plus dedicated DSPR/PSPR scratchpads per core |
| Communication Interfaces | 3× MCMCAN (12 CAN FD channels), 1× RGMII Ethernet MAC, 8× ASCLIN (LIN v2.1), 6× QSPI, 2× HSSL, 4× MSC |
| Safety Features | Integrated Safety Management Unit (SMU), Memory Test Unit (MTU), Hardware I/O Monitor (IOM), optional HSM for secure boot and crypto offload |
| Package | LFBGA-292 (15 × 15 mm, 0.8 mm pitch), RoHS-compliant, lead-free, open market version |
Pinout & Package
LFBGA-292 package with 15 × 15 mm body, 0.8 mm ball pitch, and standard JEDEC MO-277 compliant footprint. Thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Digital Power Supply (1.3 V) | Supplies core logic and CPU domains; requires low-noise regulation and local decoupling |
| VDDP_3P3 | I/O Power Supply (3.3 V) | Drives all general-purpose I/O banks; supports 5 V-tolerant operation on select pins |
| OSC_IN / OSC_OUT | External Crystal Oscillator Interface | Accepts 20–40 MHz crystal for primary clock source; internal oscillator provides backup |
| ETH_TXD0–3 / ETH_RXD0–3 | Ethernet RGMII Data Lines | Direct connection to PHY without external level-shifting; supports 100/1000 Mbps with IEEE 1588 timestamping |
| CAN0_TX / CAN0_RX | CAN FD Transceiver Interface | Differential signaling pair for first MCMCAN channel; compatible with ISO 11898-2:2016 physical layer |
| TRST_N | JTAG Debug Reset Input | Asynchronous active-low reset for debug interface; independent of system reset controller |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Configuration | Two independent lockstep pairs (4 cores) enable ASIL-D compliance per ISO 26262 Part 5, with automatic error detection and fail-safe response |
| Hardware Security Module (HSM) | Optional embedded HSM supports AES-128/256, SHA-256, RSA-2048, secure boot, key provisioning, and cryptographic service isolation |
| Memory Protection Unit (MPU) | Per-core MPU enforces memory access permissions and prevents unauthorized code/data access across safety partitions |
| On-Chip Flash Programming | Field-upgradable via CAN FD or Ethernet; supports background programming with zero downtime using dual-bank PFLASH architecture |
| Real-Time Debug Support | Multi-core trace via DAP interface with cycle-accurate instruction trace, data trace, and cross-triggering between cores |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire Control Unit |
|---|---|
|
Use Scenario: Real-time torque calculation and motor current control in steer-by-wire systems with dual-redundant sensor inputs. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep core validation and hardware watchdog supervision. Use Value: Sub-10 µs interrupt latency and deterministic execution ensure immediate response to torque anomalies, meeting ISO 26262 ASIL-D timing constraints. |
Use Scenario: Coordinating hydraulic pressure modulation and wheel-speed-based brake actuation in x-by-wire braking systems. IC Role / Device Role / Timing Role: Dual-lockstep safety controller managing CAN FD communication with ABS/ESP ECUs and performing real-time pressure loop control. Use Value: Integrated SMU and MTU enable continuous self-test of memory and peripherals without software overhead, satisfying ASIL-D diagnostic coverage requirements. |
| ADAS Domain Controller | Engine Control Unit (ECU) |
|
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for adaptive cruise control and automatic emergency braking. IC Role / Device Role / Timing Role: High-bandwidth inter-processor communication via HSSL links to companion radar processors; RGMII interface to vision processing SoC. Use Value: 320 Mbit/s HSSL throughput enables synchronized timestamped data exchange, critical for time-coherent sensor fusion. |
Use Scenario: Closed-loop combustion control with cylinder-specific ignition timing, fuel injection, and knock detection. IC Role / Device Role / Timing Role: Real-time engine management controller running deterministic control loops at 10 kHz sampling rate with DSADC-based knock sensing. Use Value: On-chip DSADC with 16-bit resolution and 2 MSps sampling enables high-fidelity knock envelope analysis without external signal conditioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integrity automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC387QP256F300SBDKXUMA1 | Same core count and frequency but lacks HSM; reduced DFLASH (256 KB vs. 512 KB); no RGMII Ethernet | Suitable for ASIL-B/C applications without secure boot or Ethernet connectivity needs | Select when cryptographic services and gigabit networking are not required, reducing BOM cost and complexity |
| TC375LP256F300SBDKXUMA1 | Triple-core variant (3× TC1.6.2P), no lockstep configuration; 1.5 MB PFLASH; no HSM; LFBGA-196 package | Targeted at ASIL-B powertrain or chassis modules with lower safety integrity requirements | Choose for cost-sensitive applications requiring real-time performance but not ASIL-D certification path |
Compared with TC387QP256F300SBDKXUMA1 and TC375LP256F300SBDKXUMA1, the TC397XP256F300SBDKXUMA1 uniquely combines six-core lockstep, full ASIL-D safety infrastructure, RGMII Ethernet, and 512 KB DFLASH-making it the only option among the three qualified for domain controllers requiring both functional safety and secure high-speed interconnect.
Availability
TC397XP256F300SBDKXUMA1 is available at Aetrix Electronics and suitable for electric power steering, brake-by-wire systems, and ADAS domain controllers requiring stable component supply, long-term lifecycle support, and automotive-grade traceability.
Supply support for TC397XP256F300SBDKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, headquartered in Munich with global R&D and manufacturing operations.
The TC39x series belongs to Infineon's AURIX™ family-designed specifically for safety-critical automotive applications such as powertrain, chassis, and ADAS, with built-in hardware mechanisms to meet ISO 26262 ASIL-D requirements.
FAQ
What is the maximum junction temperature rating for TC397XP256F300SBDKXUMA1?
The TC397XP256F300SBDKXUMA1 is rated for operation up to 150°C junction temperature, validated per AEC-Q100 Grade 1 qualification (–40°C to +125°C ambient). Thermal design must maintain Tj ≤ 150°C under worst-case power dissipation, with derating applied above 125°C ambient per datasheet Section 3.4.
Does TC397XP256F300SBDKXUMA1 support JTAG debugging in production mode?
Yes-JTAG debugging remains accessible via TRST_N and TDI/TDO/TCK/TMS pins even in secured production mode, provided the DBG_DIS fuse is unprogrammed. When DBG_DIS is set, only secure debug via DAP interface with authenticated access is permitted, preserving intellectual property while enabling field diagnostics.
How many CAN FD channels does TC397XP256F300SBDKXUMA1 support?
The TC397XP256F300SBDKXUMA1 integrates three MCMCAN modules, each supporting up to four CAN FD nodes, for a total of 12 concurrent CAN FD channels. Each channel operates at data rates up to 5 Mbit/s and supports ISO 11898-1:2015 frame formats with flexible data-length coding.
Is external RAM required for typical TC397XP256F300SBDKXUMA1 applications?
No-768 KB on-chip LMU SRAM (all ECC-protected), plus per-core DSPR/PSPR scratchpads totaling 2.4 MB, eliminates need for external RAM in most ASIL-D applications. External memory interface (EBU) is optional and used only for specialized expansion such as large lookup tables or firmware staging buffers.
TC397XP256F300SBDKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 6-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
- Peripherals:
- DMA, I2S, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1M x 8
- RAM Size:
- 6.75M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 76 SAR, Sigma-Delta
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC397XP256F300SBDKXUMA1 FAQ
1.How can I place an order for TC397XP256F300SBDKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC397XP256F300SBDKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC397XP256F300SBDKXUMA1 reliable?
The price and inventory of TC397XP256F300SBDKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC397XP256F300SBDKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC397XP256F300SBDKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC397XP256F300SBDKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC397XP256F300SBDKXUMA1?
TC397XP256F300SBDKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC397XP256F300SBDKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC397XP256F300SBDKXUMA1?
For technical support, including TC397XP256F300SBDKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC397XP256F300SBDKXUMA1 requirements.
6.How does Aetrix verify that TC397XP256F300SBDKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC397XP256F300SBDKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC397XP256F300SBDKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC397XP256F300SBDKXUMA1?
All TC397XP256F300SBDKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC397XP256F300SBDKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC397XP256F300SBDKXUMA1 part is unused and in its original packaging.
Return procedure for TC397XP256F300SBDKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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