Infineon Technologies TC397XP256F300SBDLXUMA1

Overview

TC397XP256F300SBDLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with six lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 2.5 MB on-chip flash (2 MB PFLASH + 512 KB DFLASH), 768 KB SRAM (ECC-protected), and integrated HSM for secure boot and cryptographic acceleration. It targets automotive ASIL-D safety-critical control units such as electric powertrain inverters and ADAS domain controllers.

For engineers reviewing the TC397XP256F300SBDLXUMA1 datasheet, TC397XP256F300SBDLXUMA1 pinout, TC397XP256F300SBDLXUMA1 application, or TC397XP256F300SBDLXUMA1 equivalent, key selection considerations include dual-core lockstep configuration, hardware safety monitoring (SMU/MTU/IOM), CAN FD + Ethernet TSN readiness, and HSM-based secure firmware update capability.

Technical Context

The TC397XP256F300SBDLXUMA1 implements a heterogeneous multi-core architecture: four TriCore CPUs operate in lockstep pairs (2×2) for ASIL-D compliance, while two additional cores run independently for application-layer tasks. All cores share a 64-bit SRI crossbar interconnect and access ECC-protected memory subsystems including 2 MB program flash, 512 KB data flash, and 768 KB SRAM.

It integrates safety-critical peripherals including three MCMCAN modules (each supporting 2 CAN FD channels), one 100BASE-T1 Ethernet MAC with TSN support, eight ASCLIN interfaces with LIN v2.1, and six QSPI masters/slaves - all monitored by the Safety Management Unit (SMU) and validated via built-in MBIST and memory initialization logic.

Key Specifications

Pinout & Package

LFBGA-292 package (15 mm × 15 mm, 2.0 mm ball pitch) with thermal pad; RoHS-compliant, lead-free, halogen-free. Designed for automotive PCB assembly with reflow profile compatibility per J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Compared with TC397XP256F300SBDLXUMA1, the TC397XP256F300SBDLKXUMA1 offers higher thermal robustness for under-hood use, while the TC387QP256F300SBDLKXUMA1 reduces BOM cost and complexity by removing HSM and Ethernet - making it suitable only for lower-ASIL domains.

Availability

TC397XP256F300SBDLXUMA1 is available at Aetrix Electronics and suitable for electric powertrain inverters, ADAS domain controllers, brake-by-wire ECUs, and chassis domain controllers requiring stable component supply across automotive production lifecycles.

Supply support for TC397XP256F300SBDLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and wafer fabs in Dresden and Villach.

This device belongs to the AURIX™ TC3xx family - engineered specifically for ISO 26262 ASIL-D automotive safety applications, emphasizing functional safety, real-time determinism, and hardware-enforced security isolation.

FAQ

What is the maximum operating temperature range for TC397XP256F300SBDLXUMA1?

The TC397XP256F300SBDLXUMA1 is rated for operation from −40°C to 125°C ambient temperature, validated per AEC-Q100 Grade 1 requirements. Its thermal design supports sustained 300 MHz core frequency across this full range, with internal temperature sensor accuracy of ±2.5°C referenced to die junction.

Does TC397XP256F300SBDLXUMA1 support CAN FD and classical CAN simultaneously?

Yes - each of its three MCMCAN modules supports dual-channel operation: one channel can run CAN FD (up to 5 Mbps) while the other runs classical CAN (1 Mbps), enabling mixed-network legacy migration. All six CAN channels are independently configurable with programmable bit timing and flexible message RAM allocation.

How is the Hardware Security Module (HSM) isolated from the main TriCore cores?

The HSM is implemented as a physically separate Cortex-M7 subsystem with dedicated ROM, RAM, bus interface, and cryptographic accelerators. It communicates with main cores only via mailbox registers over a protected AXI bridge; no shared memory or direct instruction access is permitted, satisfying EVITA Medium and ISO/SAE 21434 hardware separation requirements.

Can TC397XP256F300SBDLXUMA1 execute code directly from external QSPI flash?

Yes - the QSPI interface supports Execute-in-Place (XIP) mode with configurable cache line prefetch and wait-state insertion. Up to 64 MB of external flash can be memory-mapped into the address space, with ECC protection applied to fetched instructions via the instruction cache parity logic.