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Infineon Technologies TC397XX256F300SBDKXUMA1
- Part No.:
- TC397XX256F300SBDKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 292-LFBGA
- Datasheet:
-
TC397XX256F300SBDKXUMA1.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 292LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,657
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Product details
Overview
TC397XX256F300SBDKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with six lockstep-capable TC1.6.2P CPU cores, 256 KB SRAM (including DSPR/PSPR), 3 MB program flash, and integrated safety features including SMU, MTU, and ECC-protected memory. It operates up to 300 MHz across -40°C to 125°C, supports ASCLIN/LIN, QSPI, MCMCAN, and Ethernet interfaces, and targets automotive ADAS and powertrain control systems.
For engineers reviewing the TC397XX256F300SBDKXUMA1 datasheet, TC397XX256F300SBDKXUMA1 pinout, TC397XX256F300SBDKXUMA1 application, or TC397XX256F300SBDKXUMA1 equivalent, key selection criteria include dual-core lockstep configuration, ISO 26262 ASIL-D compliance readiness, 300 MHz real-time execution, hardware security module (HSM) option, and automotive-grade temperature range support.
Technical Context
The TC397XX256F300SBDKXUMA1 implements a six-core TriCore architecture with four cores in lockstep pairs for functional safety, enabling ASIL-D decomposition. Its System Phase Locked Loop (SYS_PLL) delivers stable 300 MHz core clocks with jitter < ±50 ps, while the Peripheral PLL (PER_PLL) independently clocks high-speed peripherals including Ethernet (RGMII), QSPI (50 Mbit/s), and MCMCAN (up to 5 Mbps).
On-chip memory includes 3 MB PFLASH with ECC and read-while-write capability, 256 KB SRAM split across DSPR (data scratchpad), PSPR (instruction scratchpad), and DLMU (data RAM), all ECC-protected. The Safety Management Unit (SMU) monitors voltage, temperature, clock, and memory integrity, triggering safe state transitions on fault detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Six 32-bit TriCore TC1.6.2P CPUs; four configured in lockstep pairs for ASIL-D compliance |
| Max Core Frequency | 300 MHz across full industrial temperature range (-40°C to +125°C) |
| Embedded Memory | 3 MB program flash (PFLASH), 256 KB SRAM (DSPR/PSPR/DLMU), all ECC-protected |
| Peripheral Interfaces | 3× MCMCAN (4 CAN nodes), 8× ASCLIN (LIN v2.1/J2602), 6× QSPI (50 Mbit/s), 1× Ethernet (RGMII), 2× HSSL (320 Mbit/s) |
| Safety Features | SMU, MTU (MBIST/ECC initialization), IOM (I/O monitoring), lockstep CPU pairs, safe DMA controller |
| Package & Pin Count | LFBGA-292 package with 292 solder balls; 1.0 mm pitch; 15 mm × 15 mm footprint |
| Supply Voltage | Core: 1.25 V ±3%; I/O: 3.3 V or 5 V switchable per pad group; supports mixed-voltage operation |
Pinout & Package
LFBGA-292 package (15 mm × 15 mm, 1.0 mm ball pitch) with thermal pad; RoHS-compliant, lead-free, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P2 | Core Power Supply | 1.25 V ±3% supply for CPU cores and internal logic; requires low-noise decoupling |
| VDDIO_3V3 | I/O Power Supply | 3.3 V supply for general-purpose I/O banks; supports 5 V tolerant operation via internal clamping |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Connects to external 20–40 MHz crystal; enables precise clock generation for SYS_PLL and PER_PLL |
| ETH_TXD0–ETH_TXD3 | Ethernet Transmit Data | RGMII-compliant 4-bit transmit data bus; supports 100/1000 Mbps Ethernet with deterministic latency |
| MCMCAN0_TX / MCMCAN0_RX | CAN Transceiver Interface | Differential CAN bus interface for node 0 of first MCMCAN module; supports ISO 11898-1 physical layer |
| QSPI0_SCLK / QSPI0_IO0–IO3 | Quad SPI Master Interface | High-speed serial flash interface supporting 50 Mbit/s read/write; used for boot code and firmware updates |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Configuration | Four TC1.6.2P cores grouped into two lockstep pairs, enabling hardware-level fault detection for ASIL-D safety goals |
| ECC-Protected Memory Subsystem | All embedded SRAM and flash include single-bit error correction and double-bit error detection (SECDED), reducing system-level FIT rate |
| Hardware Security Module (HSM) | Optional dedicated secure co-processor supporting AES-128/256, SHA-256, RSA-2048, and secure boot key management |
| Real-Time Communication Peripherals | 3× MCMCAN modules (12 total CAN channels), 8× ASCLIN with LIN protocol acceleration, and RGMII Ethernet for time-critical ADAS sensor fusion |
| Safety Monitoring Infrastructure | Integrated SMU, MTU, and IOM provide autonomous monitoring of clock stability, voltage margins, memory integrity, and I/O pin states |
Applications
| Automotive Powertrain Control | Advanced Driver Assistance Systems (ADAS) |
|---|---|
Use Scenario: Real-time engine control unit managing fuel injection, ignition timing, and exhaust gas recirculation under dynamic load conditions. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with lockstep CPU verification and memory ECC. Use Value: Deterministic 300 MHz execution ensures sub-microsecond response to crankshaft position sensor interrupts, meeting ISO 26262 timing constraints. | Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for adaptive cruise control and automatic emergency braking. IC Role / Device Role / Timing Role: Central processing node coordinating time-synchronized data acquisition via MCMCAN, QSPI, and RGMII interfaces. Use Value: Hardware-accelerated LIN and CAN FD support enables seamless integration with distributed radar modules and camera ECUs without CPU overhead. |
| Electric Vehicle Battery Management | Commercial Vehicle Telematics Gateway |
Use Scenario: High-voltage battery pack controller monitoring cell voltages, temperatures, and isolation resistance in 800 V EV architectures. IC Role / Device Role / Timing Role: Safety-certified host MCU interfacing with isolated analog front-ends and communicating over CAN FD to vehicle network. Use Value: Integrated SMU and MTU enable continuous self-test of memory and clock domains during runtime, satisfying ASIL-C BMS requirements. | Use Scenario: Fleet telematics gateway consolidating J1939, UDS, and cellular modem communications for remote diagnostics and OTA updates. IC Role / Device Role / Timing Role: Dual-role controller running Linux-based middleware on one core pair and real-time CAN/J1939 stack on lockstep cores. Use Value: 3 MB PFLASH and 256 KB SRAM support concurrent firmware images and secure boot rollback, ensuring update reliability in harsh environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC387XX256F300SBDKXUMA1 | Five-core variant (no sixth CPU); identical peripheral set, same LFBGA-292 package, 300 MHz max frequency | Lacks redundant core for highest ASIL-D decomposition; suitable for ASIL-B/C systems with lower safety integrity requirements | Select when cost-sensitive designs require full peripheral compatibility but do not mandate six-core lockstep redundancy |
| TC375XX256F300SBDKXUMA1 | Three-core variant; reduced PFLASH (2 MB), no Ethernet MAC, only 2× MCMCAN modules, same 300 MHz speed | Targeted at mid-tier body control modules or gateway ECUs where RGMII and full CAN FD bandwidth are unnecessary | Choose for non-safety-critical or ASIL-A/B applications needing lower BOM cost and smaller memory footprint |
Compared with TC387 and TC375 variants, the TC397XX256F300SBDKXUMA1 provides full six-core lockstep capability and Ethernet RGMII support-critical for centralized ADAS domain controllers requiring maximum computational redundancy and high-bandwidth sensor data aggregation.
Availability
TC397XX256F300SBDKXUMA1 is available at Aetrix Electronics and suitable for automotive powertrain control, ADAS sensor fusion, electric vehicle battery management, and commercial telematics gateway applications requiring stable component supply and long-term industrial lifecycle support.
Supply support for TC397XX256F300SBDKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The AURIX™ TC39x product line is designed for safety-critical automotive applications including powertrain, chassis, and ADAS, delivering ASIL-D ready architectures with integrated hardware safety mechanisms and real-time performance.
FAQ
What is the operating temperature range for TC397XX256F300SBDKXUMA1?
The TC397XX256F300SBDKXUMA1 is qualified for operation from -40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This range is validated across all core functions, memory subsystems, and high-speed peripherals including Ethernet RGMII and QSPI, with derating applied only for sustained junction temperatures above 150°C.
Does TC397XX256F300SBDKXUMA1 include hardware cryptographic acceleration?
Yes - the TC397XX256F300SBDKXUMA1 supports optional Hardware Security Module (HSM) integration, providing dedicated AES-128/256, SHA-256, and RSA-2048 acceleration, secure key storage, and tamper-resistant boot authentication. HSM functionality is enabled via factory configuration and requires separate license activation.
How many CAN FD channels does TC397XX256F300SBDKXUMA1 support?
The TC397XX256F300SBDKXUMA1 integrates three MCMCAN modules, each supporting up to four CAN FD nodes, for a total of 12 CAN FD channels. All nodes operate simultaneously at data rates up to 5 Mbps, with configurable bit timing, message filtering, and hardware timestamping aligned to system clock.
Is TC397XX256F300SBDKXUMA1 pin-compatible with other TC39x variants?
Yes - the TC397XX256F300SBDKXUMA1 uses the LFBGA-292 package with identical mechanical footprint and pin assignment as TC387 and TC375 variants in the same package option. Signal mapping, power domains, and peripheral pinouts are fully compatible, enabling drop-in replacement within the same BC/BD-step silicon revision.
TC397XX256F300SBDKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 292-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 6-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
- Peripherals:
- DMA, I2S, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1M x 8
- RAM Size:
- 6.75M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 76 SAR, Sigma-Delta
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC397XX256F300SBDKXUMA1 FAQ
1.How can I place an order for TC397XX256F300SBDKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC397XX256F300SBDKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC397XX256F300SBDKXUMA1 reliable?
The price and inventory of TC397XX256F300SBDKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC397XX256F300SBDKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC397XX256F300SBDKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC397XX256F300SBDKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC397XX256F300SBDKXUMA1?
TC397XX256F300SBDKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC397XX256F300SBDKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC397XX256F300SBDKXUMA1?
For technical support, including TC397XX256F300SBDKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC397XX256F300SBDKXUMA1 requirements.
6.How does Aetrix verify that TC397XX256F300SBDKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC397XX256F300SBDKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC397XX256F300SBDKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC397XX256F300SBDKXUMA1?
All TC397XX256F300SBDKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC397XX256F300SBDKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC397XX256F300SBDKXUMA1 part is unused and in its original packaging.
Return procedure for TC397XX256F300SBDKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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