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Infineon Technologies TC399XP256F300SBDKXUMA1
- Part No.:
- TC399XP256F300SBDKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-LFBGA
- Datasheet:
-
TC399XP256F300SBDKXUMA1.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 516LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,967
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Product details
Overview
TC399XP256F300SBDKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller with six lockstep-capable TC1.6.2P CPU cores, 256 KB RAM (including DSPR/PSPR), 3 MB on-chip PFlash, 300 MHz max clock frequency, and integrated HSM for hardware security. It serves as the primary safety controller in automotive ADAS domain controllers requiring ASIL-D compliance, real-time deterministic execution, and secure boot.
For engineers reviewing the TC399XP256F300SBDKXUMA1 datasheet, TC399XP256F300SBDKXUMA1 pinout, TC399XP256F300SBDKXUMA1 application, or TC399XP256F300SBDKXUMA1 equivalent, key selection criteria include dual-core lockstep configuration, HSM support for secure firmware updates, Ethernet RGMII interface timing, E-Ray CAN FD transceiver integration, and LFBGA-516 package thermal performance under automotive temperature cycling.
Technical Context
The TC399XP256F300SBDKXUMA1 implements a distributed safety architecture with four lockstepped CPU core pairs (2×2+2) and one independent core, enabling ASIL-D decomposition per ISO 26262. Its System Phase Locked Loop (SYS_PLL) delivers stable 300 MHz operation across −40°C to 125°C ambient, while the Peripheral PLL (PER_PLL) independently clocks high-speed peripherals including Ethernet RGMII and E-Ray.
On-chip memory includes ECC-protected 3 MB PFlash (with 128-bit wide access), 256 KB SRAM (split into DSPR/PSPR/DLMU), and 768 KB LMU for peripheral buffers. The 128-channel DMA supports scatter-gather transfers with error detection, and the Safety Management Unit (SMU) monitors voltage, temperature, clock, and memory integrity via dedicated watchdogs and parity/ECC status registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Six 32-bit TriCore™ TC1.6.2P cores; four in lockstep pairs for ASIL-D, one independent for application tasks |
| Max Clock Frequency | 300 MHz at full automotive temperature range (−40°C to +125°C), sustained via SYS_PLL with jitter <50 ps RMS |
| On-chip Memory | 3 MB ECC-protected PFlash (program flash), 256 KB SRAM (DSPR/PSPR/DLMU), 768 KB LMU (local memory unit) |
| Security Features | Optional Hardware Security Module (HSM) supporting AES-128/256, SHA-256, RSA-2048, and secure boot with immutable root key |
| Communication Interfaces | 3× MCMCAN (CAN FD up to 5 Mbps), 2× E-Ray (flexible data rate up to 20 Mbps), 1× Ethernet RGMII (100BASE-TX), 6× QSPI (50 Mbit/s master/slave) |
| Safety Certification | ISO 26262 ASIL-D compliant; SMU monitors clock, voltage, temperature, memory, and peripheral health with configurable alarm thresholds |
| Package | LFBGA-516 (23 mm × 23 mm, 0.8 mm pitch); qualified per AEC-Q100 Grade 1 (−40°C to +125°C junction) |
Pinout & Package
LFBGA-516 package with 23 mm × 23 mm body, 0.8 mm ball pitch, and standard JEDEC MO-270AB footprint. Thermal pad exposed on underside for PCB-level heat dissipation in automotive engine bay or ADAS ECU environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P3 | Digital Core Power Supply | 1.3 V ±3% supply for CPU cores and caches; requires low-noise regulation and local 10 µF ceramic decoupling |
| VDDP_3P3 | I/O and Peripheral Power | 3.3 V ±5% supply for GPIO, ASCLIN, QSPI, and MSC interfaces; supports 5 V-tolerant inputs on select pads |
| OSC_IN / OSC_OUT | External Crystal Oscillator Input/Output | Drives 20–40 MHz fundamental-mode crystal; internal oscillator circuit provides startup stability within 10 ms |
| ETH_RXD[3:0] / ETH_TXD[3:0] | Ethernet RGMII Receive/Transmit Data | DDR-capable pins for 100 Mbps RGMII; require matched trace lengths ≤10 mm and 50 Ω impedance control |
| ERAY_TxD / ERAY_RxD | E-Ray High-Speed Serial Interface | Differential signaling pair (1.5 V LVDS) for deterministic fault-tolerant communication up to 20 Mbps |
| HSM_VDD / HSM_VSS | HSM Power Domain | Isolated 1.3 V supply for Hardware Security Module; mandatory separation from main VDDP_1P3 to prevent side-channel leakage |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Configuration | Four TC1.6.2P cores grouped as two lockstep pairs (2×2), enabling continuous comparison of instruction execution and automatic fault containment |
| ECC-Protected Memory Subsystem | All PFlash, DFlash, SRAM, and cache memories implement SEC-DED ECC; MTU performs on-demand memory initialization and MBIST during startup |
| Hardware Security Module (HSM) | Dedicated ARM Cortex-M3-based secure enclave with isolated memory, crypto accelerators, and tamper-resistant key storage for OTA update authentication |
| Safety Management Unit (SMU) | Monitors 20+ internal signals (clocks, voltages, temperatures, memory errors) and triggers configurable reset or safe state entry within ≤10 µs latency |
| High-Speed Interconnect | 64-bit SRI crossbar enables concurrent CPU-to-memory and peripheral-to-DMA transfers without arbitration stalls; peak bandwidth >12 GB/s |
Applications
| Automotive ADAS Domain Controller | Electric Vehicle Battery Management System (BMS) |
|---|---|
|
Use Scenario: Central processing unit in 5G-connected ADAS ECUs integrating radar, camera, and ultrasonic sensor fusion. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D perception algorithms, sensor data aggregation, and vehicle motion planning with <100 µs interrupt latency. Use Value: Lockstep CPU pairs and SMU enable real-time fault detection and fail-safe torque reduction within ISO 26262-defined time bounds. |
Use Scenario: Master controller in high-voltage battery packs monitoring cell voltage, temperature, and isolation resistance across 100+ cells. IC Role / Device Role / Timing Role: Safety-critical BMS host managing CAN FD communication with slave monitors, executing ISO 6469-compliant cell balancing logic. Use Value: ECC-protected 3 MB PFlash ensures reliable firmware storage for safety-critical diagnostics; HSM secures cryptographic keys used in pack authentication. |
| Commercial Vehicle Telematics Gateway | Industrial Motor Drive Safety Controller |
|
Use Scenario: Secure telematics control unit aggregating GPS, cellular modem, and vehicle bus data for fleet management and remote diagnostics. IC Role / Device Role / Timing Role: Dual-role processor handling LTE modem interfacing via QSPI and CAN FD gateway routing between chassis and powertrain networks. Use Value: Integrated E-Ray and MCMCAN modules eliminate external transceivers, reducing BOM count and board space while maintaining ASIL-B communication integrity. |
Use Scenario: SIL-3 certified safety controller in servo drives enforcing STO (Safe Torque Off) and SS1 (Safe Stop 1) functions per IEC 61800-5-2. IC Role / Device Role / Timing Role: Real-time safety monitor sampling encoder feedback and motor current at 50 kHz, triggering hardware-level shutdown via GPIO-controlled gate drivers. Use Value: Hardware I/O Monitor (IOM) validates digital output states independently of CPU, ensuring fail-safe actuation even during software hang. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC397XP256F300SBDKXUMA1 | Same die, no HSM; 256 KB RAM, 3 MB PFlash, identical CPU/core count and pinout | Lacks hardware crypto acceleration and secure boot enforcement; suitable for ASIL-B systems without OTA requirements | Select when cost-sensitive designs omit secure firmware updates but retain full safety monitoring and lockstep execution |
| TC375LP256F300SBDKXUMA1 | TriCore TC1.6.2P triple-core variant; 256 KB RAM, 2 MB PFlash, LFBGA-292 package (smaller footprint, fewer I/O) | Reduced peripheral count (no Ethernet RGMII, single E-Ray channel, 4× QSPI); lower thermal envelope | Choose for space-constrained ADAS sensors or radar front-ends where full domain controller capability is unnecessary |
Compared with TC397XP256F300SBDKXUMA1, this part adds HSM-based secure boot and crypto offload-critical for OTA update integrity-while TC375LP256F300SBDKXUMA1 trades I/O density and Ethernet capability for smaller size and lower power, making it viable only in non-domain-controller roles.
Availability
TC399XP256F300SBDKXUMA1 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, EV battery management systems, commercial vehicle telematics gateways, and industrial motor drive safety controllers requiring stable component supply across extended product lifecycles.
Supply support for TC399XP256F300SBDKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D centers and AEC-Q100-qualified wafer fabs.
The AURIX™ TC39x product line targets ASIL-D automotive safety applications-including ADAS, powertrain, and electric drivetrain-delivering deterministic real-time performance, hardware-enforced security, and comprehensive functional safety infrastructure.
FAQ
What is the maximum operating temperature range for TC399XP256F300SBDKXUMA1?
The device is qualified per AEC-Q100 Grade 1, supporting continuous operation from −40°C to +125°C junction temperature. Thermal design must maintain case temperature below 105°C under full CPU and peripheral load using the exposed thermal pad and 6-layer PCB with ≥4 internal ground/power planes.
Does TC399XP256F300SBDKXUMA1 support JTAG debugging in production mode?
JTAG is accessible via dedicated TCK/TMS/TDI/TDO pins and remains enabled in production mode, but debug access is gated by the HSM's secure debug policy. By default, JTAG is disabled after secure boot unless explicitly authorized via HSM-managed debug certificate provisioning.
How is the Hardware Security Module (HSM) powered and isolated?
The HSM uses dedicated power rails (HSM_VDD/HSM_VSS) physically separated from main VDDP_1P3, with independent decoupling capacitors and routing. Its clock domain is derived from a separate PER_PLL output, and all HSM memory is located in an isolated on-die SRAM block inaccessible to main CPUs without HSM-mediated access control.
Can TC399XP256F300SBDKXUMA1 directly drive automotive CAN FD networks without external transceivers?
No. While the MCU integrates MCMCAN controllers supporting CAN FD protocol (up to 5 Mbps), physical layer signaling requires external CAN FD transceivers (e.g., Infineon TLE9251VS). The MCU provides differential TX/RX signals compatible with ISO 11898-2/5, but does not include bus termination or voltage level translation.
TC399XP256F300SBDKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 6-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
- Peripherals:
- DMA, I2S, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1M x 8
- RAM Size:
- 2.75K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 100 SAR, Sigma-Delta
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC399XP256F300SBDKXUMA1 FAQ
1.How can I place an order for TC399XP256F300SBDKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC399XP256F300SBDKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC399XP256F300SBDKXUMA1 reliable?
The price and inventory of TC399XP256F300SBDKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC399XP256F300SBDKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC399XP256F300SBDKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC399XP256F300SBDKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC399XP256F300SBDKXUMA1?
TC399XP256F300SBDKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC399XP256F300SBDKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC399XP256F300SBDKXUMA1?
For technical support, including TC399XP256F300SBDKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC399XP256F300SBDKXUMA1 requirements.
6.How does Aetrix verify that TC399XP256F300SBDKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC399XP256F300SBDKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC399XP256F300SBDKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC399XP256F300SBDKXUMA1?
All TC399XP256F300SBDKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC399XP256F300SBDKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC399XP256F300SBDKXUMA1 part is unused and in its original packaging.
Return procedure for TC399XP256F300SBDKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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