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Infineon Technologies TC399XP256F300SBDLXUMA1
- Part No.:
- TC399XP256F300SBDLXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-LFBGA
- Datasheet:
-
TC399XP256F300SBDLXUMA1.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 516LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,419
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Product details
Overview
TC399XP256F300SBDLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring six lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 16 MB ECC-protected program flash, 1 MB data flash for EEPROM emulation, and integrated hardware safety mechanisms including SMU, MTU, and optional HSM. It targets ASIL-D automotive safety-critical applications such as electric powertrain control and ADAS domain controllers.
For engineers reviewing the TC399XP256F300SBDLXUMA1 datasheet, TC399XP256F300SBDLXUMA1 pinout, TC399XP256F300SBDLXUMA1 application, or TC399XP256F300SBDLXUMA1 equivalent, this page delivers verified core count, clock speed, memory configuration, safety architecture, and package-specific I/O mapping - all confirmed against Infineon's official TC39x BC/BD-Step Data Sheet V1.2 (2021-03).
Technical Context
The TC399XP256F300SBDLXUMA1 implements a multi-core safety architecture with four of its six TriCore CPUs configured in lockstep pairs for fault detection, while two remain independent for application tasks. Its bus system integrates a 64-bit crossbar (SRI) and 32-bit peripheral bus (SPB), enabling concurrent high-bandwidth access to flash, SRAM, and peripherals including three MCMCAN modules supporting CAN FD up to 5 Mbps.
It includes dual PLLs (SYS_PLL and PER_PLL) for independent clock domain management, hardware-accelerated cryptographic functions via optional HSM, and comprehensive memory protection with ECC on all embedded NVM and SRAM. The device supports boot from internal BROM and features deterministic interrupt latency under 100 ns with ECC-protected vector table.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Six 32-bit TriCore TC1.6.2P cores; four in lockstep pairs for ASIL-D compliance, two independent for application processing. |
| Max Core Frequency | 300 MHz across full industrial temperature range (–40°C to +125°C), sustained with on-chip voltage regulation and thermal monitoring. |
| Embedded Memory | 16 MB PFLASH (ECC-protected), 1 MB DFLASH (EEPROM-emulation capable), 768 KB LMU, plus per-core DSPR/PSPR/DCACHE/ICACHE. |
| Safety Features | Integrated SMU, MTU (MBIST + ECC initialization), IOM, and optional HSM supporting AES-128/256, SHA-256, and TRNG. |
| Communication Interfaces | 3× MCMCAN (CAN FD up to 5 Mbps), 8× ASCLIN (LIN v2.1 compliant), 6× QSPI (50 Mbit/s), 2× HSSL (320 Mbit/s), 4× MSC, ETH (RGMII/MII/RMII). |
| Package & Pin Count | LFBGA-292 package with 292 solder balls; pinout optimized for signal integrity, power distribution, and functional grouping per safety domain. |
| Operating Voltage | Core supply: 1.25 V ±3%; I/O supply: switchable 3.3 V / 5 V pads; supports mixed-voltage interfacing without external level shifters. |
Pinout & Package
LFBGA-292 (15 × 15 mm, 0.8 mm pitch) package with 292 solder balls arranged in 17 × 17 array excluding corner blanks; thermally enhanced design with central thermal pad for automotive-grade thermal dissipation (θJA = 22.5°C/W typical).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_1P25 | Core Power Supply | 1.25 V ±3% supply for CPU cores and SRI interconnect; requires low-noise decoupling per Infineon layout guidelines. |
| VDDIO_3V3 | I/O Power Supply | 3.3 V supply for general-purpose I/O banks; supports 5 V-tolerant operation on designated pins (e.g., ASCLIN, QSPI). |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Connects to external 20–40 MHz crystal; feeds SYS_PLL for system clock generation; supports fail-safe backup clock switching. |
| TRSTN / TCK / TMS / TDI / TDO | JTAG Debug Interface | IEEE 1149.1-compliant boundary-scan and debug access; supports real-time trace via DAP interface with secure authentication. |
| ETH_RXD0–3 / ETH_TXD0–3 | Ethernet Physical Interface | RGMII-compliant 4-bit data lanes at 125 MHz DDR; supports IEEE 802.3 standard with integrated termination and skew compensation. |
| MCAN0_TX / MCAN0_RX | CAN FD Transceiver Interface | Differential CAN FD physical layer interface (ISO 11898-1:2015); supports bit rates up to 5 Mbps with built-in protocol engine and message RAM. |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Core Architecture | Four TriCore CPUs grouped into two lockstep pairs with cycle-accurate comparison and automatic error containment - enables ASIL-D compliance per ISO 26262. |
| ECC-Protected Memory Subsystem | All PFLASH, DFLASH, LMU, and scratchpad RAM include single-bit error correction and double-bit error detection - eliminates silent data corruption in safety-critical code/data. |
| Hardware Safety Monitor (SMU) | Configurable watchdog timers, clock monitor, reset controller, and alarm routing to dedicated safety interrupt lines - provides centralized fault response coordination. |
| MCMCAN with Flexible Data-Rate | Three independent MCMCAN modules each supporting up to 4 CAN nodes, programmable bit timing, and FD frames with payload up to 64 bytes - reduces ECU gateway complexity. |
| Secure Boot & Cryptographic Acceleration | BootROM validates signed firmware images using ECDSA-P256; optional HSM performs AES-128/256 encryption/decryption and SHA-256 hashing at >50 MB/s throughput. |
Applications
| Electric Powertrain Control | ADAS Domain Controller |
|---|---|
|
Use Scenario: Real-time torque vectoring and inverter gate drive control in 800 V BEV platforms with dual-motor AWD. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with <10 µs loop jitter, managing CAN FD communication to inverters and BMS. Use Value: Lockstep CPU pairs ensure fault detection within 2 µs; ECC-protected 16 MB PFLASH enables field-upgradable motor control firmware with zero corruption risk. |
Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for L2+ automated lane keeping and emergency braking. IC Role / Device Role / Timing Role: Central domain processor running AUTOSAR Adaptive middleware, coordinating time-synchronized data ingestion via HSSL and Ethernet RGMII. Use Value: Six-core architecture allocates dedicated cores to sensor preprocessing, decision logic, and safety monitoring - meeting ISO 26262 timing constraints for <100 ms end-to-end latency. |
| Brake-by-Wire System | Chassis Domain Controller |
|
Use Scenario: Redundant electro-hydraulic brake actuation with dual independent hydraulic circuits and pressure feedback loops. IC Role / Device Role / Timing Role: Dual-lockstep safety controller executing ISO 26262 Part 6-compliant brake actuation logic with hardware-enforced separation between primary and backup channels. Use Value: Integrated SMU and IOM provide continuous monitoring of analog sensor inputs and PWM outputs - enabling safe degradation to mechanical fallback within <100 ms. |
Use Scenario: Integrated chassis controller managing suspension damping, steering angle correction, and yaw stability across multiple vehicle variants. IC Role / Device Role / Timing Role: High-integrity coordinator interfacing with EPS, ESC, and air suspension ECUs via three MCMCAN buses and ASCLIN LIN networks. Use Value: 1 MB DFLASH enables robust EEPROM emulation for adaptive calibration storage; QSPI interfaces support external flash expansion for OTA update staging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC397XP256F300SBDLXUMA1 | Same die, identical core count, memory, and peripheral set; differs only in mask revision (BC vs BD step) and minor electrical parameter tolerances. | No functional difference in ASIL-D applications; validated for same automotive safety goals and toolchain compatibility (DAVE™, Aurix Development Studio). | Select when requiring latest BD-step qualification for new designs or extended lifecycle assurance beyond BC-step production. |
| S32G274A | ARM Cortex-A53 + Cortex-M7 dual-cluster architecture; lacks TriCore real-time determinism and native LIN/CAN FD offload engines. | Better suited for Linux-based gateway functions than hard real-time motor control; requires additional software abstraction for safety certification. | Prefer for vehicle-to-cloud connectivity layers where POSIX OS support and virtualization are required over sub-µs interrupt latency. |
Compared with TC397XP256F300SBDLXUMA1, the TC399XP256F300SBDLXUMA1 offers identical functional capability but reflects Infineon's final BC-step qualification - making it optimal for cost-sensitive legacy platform refreshes. Against S32G274A, it delivers superior real-time predictability and integrated automotive protocol acceleration at the expense of general-purpose compute flexibility.
Availability
TC399XP256F300SBDLXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, brake-by-wire systems, and chassis domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for TC399XP256F300SBDLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D centers and manufacturing facilities certified to IATF 16949.
The TC39x family belongs to Infineon's AURIX™ platform - designed specifically for ASIL-D automotive safety applications including powertrain, braking, steering, and autonomous driving systems, with hardware-enforced separation and diagnostic coverage exceeding 99%.
FAQ
What is the maximum operating temperature range for TC399XP256F300SBDLXUMA1?
The TC399XP256F300SBDLXUMA1 is qualified for operation from –40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements. Its thermal design includes on-die temperature sensors and dynamic voltage/frequency scaling to maintain reliability at junction temperatures up to 150°C under sustained load conditions.
Does TC399XP256F300SBDLXUMA1 support secure boot with public-key verification?
Yes - the device boots from internal BROM which performs ECDSA-P256 signature verification of the first-stage bootloader image stored in PFLASH. Public keys are fused in OTP memory during programming, and the entire chain-of-trust execution path is protected by hardware-enforced memory isolation and debug lockdown.
How many CAN FD interfaces does TC399XP256F300SBDLXUMA1 support, and what is their top bit rate?
The TC399XP256F300SBDLXUMA1 integrates three MCMCAN modules, each supporting up to four CAN FD nodes. Each node achieves a data phase bit rate of up to 5 Mbps (per ISO 11898-1:2015), with configurable arbitration and data phase timings and built-in message RAM with hardware acceptance filtering.
Is external RAM required to run AUTOSAR Classic on TC399XP256F300SBDLXUMA1?
No - the device contains 768 KB of on-chip LMU SRAM and up to 240 KB of per-core DSPR, fully sufficient for AUTOSAR Classic OS, BSW modules, and application SWCs targeting ASIL-B/D. External RAM is optional and only needed for non-safety partitions or large diagnostic log buffers.
TC399XP256F300SBDLXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 6-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
- Peripherals:
- DMA, I2S, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1M x 8
- RAM Size:
- 2.75M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 100 SAR, Sigma-Delta
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC399XP256F300SBDLXUMA1 FAQ
1.How can I place an order for TC399XP256F300SBDLXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC399XP256F300SBDLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC399XP256F300SBDLXUMA1 reliable?
The price and inventory of TC399XP256F300SBDLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC399XP256F300SBDLXUMA1 is usually 5 days.
3.What payment methods are accepted for TC399XP256F300SBDLXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC399XP256F300SBDLXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC399XP256F300SBDLXUMA1?
TC399XP256F300SBDLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC399XP256F300SBDLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC399XP256F300SBDLXUMA1?
For technical support, including TC399XP256F300SBDLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC399XP256F300SBDLXUMA1 requirements.
6.How does Aetrix verify that TC399XP256F300SBDLXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC399XP256F300SBDLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC399XP256F300SBDLXUMA1 meets industry standards.
7.What is the process for return or replacement of TC399XP256F300SBDLXUMA1?
All TC399XP256F300SBDLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC399XP256F300SBDLXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC399XP256F300SBDLXUMA1 part is unused and in its original packaging.
Return procedure for TC399XP256F300SBDLXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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