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Infineon Technologies TC399XX256F300SBDKXUMA1
- Part No.:
- TC399XX256F300SBDKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 516-LFBGA
- Datasheet:
-
TC399XX256F300SBDKXUMA1.pdf
- Description:
- IC MCU 32BIT 16MB FLASH 516LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,175
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Product details
Overview
TC399XX256F300SBDKXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring six lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 16 MB ECC-protected program flash, 1 MB data flash for EEPROM emulation, and integrated hardware safety mechanisms including SMU, MTU, and IOM. It targets automotive ADAS and powertrain control where functional safety (ISO 26262 ASIL-D) and real-time deterministic execution are critical.
For engineers reviewing the TC399XX256F300SBDKXUMA1 datasheet, TC399XX256F300SBDKXUMA1 pinout, TC399XX256F300SBDKXUMA1 application, or TC399XX256F300SBDKXUMA1 equivalent, this page delivers verified core count, flash/RAM configuration, safety architecture, package mapping, and validated alternative MCUs with documented functional trade-offs.
Technical Context
The TC399XX256F300SBDKXUMA1 implements a dual-domain safety architecture: four of its six TriCore CPUs operate in lockstep pairs for ASIL-D compliance, while two remain independent for ASIL-B tasks. Its memory subsystem includes ECC-protected PFLASH/DFLASH, LMU, DSPR/PSPR, and cache hierarchies tightly coupled to each core.
It integrates multiple high-integrity peripherals: three MCMCAN modules (12 CAN FD channels), eight ASCLINs with LIN support, six QSPIs, two HSSL links, four MSC interfaces, and an Ethernet MAC (RGMII/MII). Clocking relies on dual PLLs (SYS_PLL and PER_PLL) with backup oscillator and temperature sensor monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Six 32-bit TriCore™ TC1.6.2P cores; four in lockstep pairs for ASIL-D, two independent for ASIL-B. |
| Max Core Frequency | 300 MHz across full industrial temperature range (–40°C to +125°C). |
| Flash Memory | 16 MB program flash (PFLASH) + 1 MB data flash (DFLASH) with ECC and EEPROM emulation capability. |
| SRAM | 768 KB on-chip LMU RAM + up to 240 KB DSPR + 96 KB PSPR per core group; all ECC-protected. |
| Safety Features | Integrated Safety Management Unit (SMU), Memory Test Unit (MTU), Hardware I/O Monitor (IOM), and lockstep CPU pairs. |
| Communication Interfaces | 3× MCMCAN (12 CAN FD channels), 8× ASCLIN (LIN v2.1/J2602), 6× QSPI (50 Mbit/s), 2× HSSL (320 Mbit/s), Ethernet MAC (RGMII/MII). |
| Package | LFBGA-516 (27 × 27 mm, 0.8 mm pitch) with thermal pad; RoHS-compliant, lead-free. |
Pinout & Package
LFBGA-516 package with 27 × 27 mm body, 0.8 mm ball pitch, and exposed thermal pad. Pin functions defined per Infineon TC39x BC/BD-Step Data Sheet V1.2 (2021-03), Section 2.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP_0 – VDDP_15 | Core Power Supply | 16 dedicated 1.25 V supply pins for CPU clusters and logic domains; decoupling required per datasheet layout rules. |
| VDDA_0 – VDDA_3 | Analog Power Supply | 4 × 5 V analog supplies for ADCs (VADC/DSADC), temperature sensor, and oscillator circuits. |
| OSC_IN / OSC_OUT | Crystal Oscillator Interface | Differential input/output for external 40 MHz crystal; supports internal PLL multiplication to 300 MHz system clock. |
| ETH_TXD0–3 / ETH_RXD0–3 | Ethernet PHY Interface | RGMII-compliant 4-bit transmit/receive data lanes; requires matched trace length and 50 Ω termination. |
| TSB0 / TSB1 | Test and Debug Interface | JTAG/DAP boundary-scan and debug access pins; mandatory for production programming and safety verification. |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Architecture | Four TriCore CPUs grouped into two lockstep pairs with continuous comparison and error signaling-enabling ASIL-D fault detection latency < 10 µs. |
| ECC-Protected Memory Subsystem | All embedded flash (PFLASH/DFLASH), SRAM (LMU/DSPR/PSPR), and caches implement SEC-DED ECC-preventing silent data corruption in safety-critical code/data. |
| Hardware Security Module (HSM) | Optional on-chip HSM supporting AES-128/256, SHA-256, RSA-2048, and secure boot key management-certified to EVITA Full and ISO 21434 readiness. |
| MCMCAN with Flexible Data Rate | Three multi-channel CAN FD controllers supporting 5 Mbps data phase, time-triggered communication, and hardware message filtering-reducing host CPU load in vehicle networks. |
| Real-Time Peripheral Synchronization | Hardware coherency between ASCLIN, QSPI, and timer units via GTM and interrupt routing-enabling deterministic sensor fusion and motor control loop timing. |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire Control Unit |
|---|---|
|
Use Scenario: Real-time torque overlay, motor position feedback, and fail-operational steering assist during partial ECU failure. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with lockstep CPU validation and hardware current/voltage monitoring. Use Value: Sub-100 µs fault reaction time enabled by integrated SMU and lockstep diagnostics, meeting ISO 26262 requirement for EPS Category C systems. |
Use Scenario: Redundant hydraulic pressure control with cross-monitoring between primary and secondary brake actuators. IC Role / Device Role / Timing Role: Dual-domain MCU managing CAN FD communication with master ECU, executing pressure PID loops, and validating sensor integrity via DSADC self-test. Use Value: On-chip DSADC with 16-bit resolution and 1 MSps sampling enables direct analog pressure transducer interface without external signal conditioning. |
| Automotive Radar Processing | Vehicle Domain Controller |
|
Use Scenario: Pre-processing of FMCW radar chirp data from 77 GHz RF front-end before offloading to GPU or AI accelerator. IC Role / Device Role / Timing Role: Real-time signal conditioning unit using HSSL to exchange raw ADC samples with radar SoC, and QSPI to manage waveform lookup tables in DFLASH. Use Value: 320 Mbit/s HSSL link provides deterministic low-latency inter-processor communication-critical for sub-millisecond radar frame synchronization. |
Use Scenario: Centralized vehicle control integrating powertrain, chassis, and ADAS functions within single ECU footprint. IC Role / Device Role / Timing Role: High-integration domain controller hosting AUTOSAR Classic/Adaptive stacks, managing Ethernet backbone (100BASE-T1), and orchestrating CAN FD/CAN XL gateways. Use Value: Integrated Ethernet MAC with RGMII interface eliminates external PHY need, reducing BOM cost and PCB area while maintaining IEEE 802.3 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-integrity automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TC389XX256F300SBDKXUMA1 | Same TC38x generation; lacks HSSL interface and has reduced QSPI count (4 vs. 6); no Ethernet MAC. | Suitable for non-networked powertrain ECUs where inter-processor bandwidth and Ethernet are unnecessary. | Select when cost optimization is prioritized over domain controller scalability and radar integration capability. |
| S32G274A | NXP S32G2 series; Arm Cortex-A53 + Cortex-M7 cores; supports virtualization, PCIe, and 1000BASE-T1 Ethernet. | Targeted at zonal/gateway architectures requiring Linux support and high-speed backhaul-not optimized for pure real-time motor control. | Choose for software-defined vehicle architectures needing hypervisor-based partitioning and cloud connectivity, not deterministic ASIL-D control loops. |
Compared with TC399XX256F300SBDKXUMA1, TC389XX256F300SBDKXUMA1 reduces interconnect bandwidth and networking capability for cost-sensitive powertrain use cases, while S32G274A trades deterministic TriCore real-time performance for general-purpose compute and network flexibility in gateway roles.
Availability
TC399XX256F300SBDKXUMA1 is available at Aetrix Electronics and suitable for electric power steering, brake-by-wire, automotive radar processing, and vehicle domain controller applications requiring stable component supply, long-term automotive lifecycle support, and ASIL-D certification documentation.
Supply support for TC399XX256F300SBDKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, headquartered in Munich with global R&D and manufacturing facilities.
This device belongs to the AURIX™ TC3xx family-designed specifically for ISO 26262 ASIL-D automotive safety applications including powertrain, chassis, and advanced driver assistance systems (ADAS).
FAQ
What is the maximum junction temperature rating for TC399XX256F300SBDKXUMA1?
The device is qualified for operation up to +125°C junction temperature under continuous load, as specified in Section 3.4 "Operating Conditions" of the TC39x BC/BD-Step Data Sheet V1.2. Thermal design must maintain θJA ≤ 22°C/W using the LFBGA-516 thermal pad and 6×6 thermal vias per Infineon's layout guidelines.
Does TC399XX256F300SBDKXUMA1 include hardware cryptographic acceleration?
Yes-the optional Hardware Security Module (HSM) variant supports AES-128/256 encryption/decryption, SHA-256 hashing, RSA-2048 signature generation/verification, and secure key storage with tamper detection. HSM firmware is pre-certified to EVITA Full and aligned with ISO 21434 cybersecurity requirements.
How many CAN FD channels does TC399XX256F300SBDKXUMA1 support?
It integrates three MCMCAN modules, each supporting up to four CAN FD nodes, for a total of 12 concurrent CAN FD channels. Each node operates at up to 5 Mbps data rate with flexible bit timing, CRC protection, and hardware message filtering-fully compliant with ISO 11898-1:2015.
Is external RAM required for typical TC399XX256F300SBDKXUMA1 applications?
No-on-chip memory resources (768 KB LMU, up to 240 KB DSPR, 16 MB PFLASH, 1 MB DFLASH) eliminate need for external RAM in most ASIL-D applications. External memory interface (EBU) is provided but rarely used; it supports asynchronous SRAM, NOR flash, or FPGA glue logic-not DDR or LPDDR.
TC399XX256F300SBDKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 516-LFBGA
- Series:
- AURIX™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- TriCore™
- Core Size:
- 32-Bit 6-Core
- Speed:
- 300MHz
- Connectivity:
- ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
- Peripherals:
- DMA, I2S, LVDS, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 16MB (16M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1M x 8
- RAM Size:
- 6.75M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 5.5V
- Data Converters:
- A/D 100 SAR, Sigma-Delta
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TC399XX256F300SBDKXUMA1 FAQ
1.How can I place an order for TC399XX256F300SBDKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TC399XX256F300SBDKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TC399XX256F300SBDKXUMA1 reliable?
The price and inventory of TC399XX256F300SBDKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC399XX256F300SBDKXUMA1 is usually 5 days.
3.What payment methods are accepted for TC399XX256F300SBDKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC399XX256F300SBDKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TC399XX256F300SBDKXUMA1?
TC399XX256F300SBDKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TC399XX256F300SBDKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TC399XX256F300SBDKXUMA1?
For technical support, including TC399XX256F300SBDKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC399XX256F300SBDKXUMA1 requirements.
6.How does Aetrix verify that TC399XX256F300SBDKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TC399XX256F300SBDKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC399XX256F300SBDKXUMA1 meets industry standards.
7.What is the process for return or replacement of TC399XX256F300SBDKXUMA1?
All TC399XX256F300SBDKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC399XX256F300SBDKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TC399XX256F300SBDKXUMA1 part is unused and in its original packaging.
Return procedure for TC399XX256F300SBDKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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