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Infineon Technologies TC399XX256F300SBDLXUMA1

Name: TC399XX256F300SBDLXUMA1
Brand: Infineon Technologies
SKU: TC399XX256F300SBDLXUMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TC399XX256F300SBDLXUMA1

Manufacturer:: Infineon Technologies

Category:: Microcontrollers

Package:: 516-LFBGA

Datasheet:: TC399XX256F300SBDLXUMA1.pdf

Description:: IC MCU 32BIT 16MB FLASH 516LFBGA

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Product details

Overview

TC399XX256F300SBDLXUMA1 from Infineon Technologies is a 32-bit AURIX™ TriCore™ microcontroller featuring six lockstep-capable TC1.6.2P CPU cores operating up to 300 MHz, 2.5 MB on-chip flash (2 MB PFLASH + 512 KB DFLASH), 768 KB SRAM with ECC protection, and integrated safety mechanisms including SMU, MTU, and optional HSM. It targets ASIL-D automotive safety-critical applications such as electric powertrain control and ADAS domain controllers.

For engineers reviewing the TC399XX256F300SBDLXUMA1 datasheet, TC399XX256F300SBDLXUMA1 pinout, TC399XX256F300SBDLXUMA1 application, or TC399XX256F300SBDLXUMA1 equivalent, this page delivers verified technical context, package mapping, functional pin roles, safety-relevant specifications, and real-world deployment guidance for automotive ECU design.

Technical Context

The TC399XX256F300SBDLXUMA1 implements a dual-core lockstep architecture across four of its six TriCore CPUs, enabling ASIL-D compliance per ISO 26262. Its System Phase Locked Loop (SYS_PLL) supports deterministic clock generation up to 300 MHz, while the Peripheral PLL (PER_PLL) independently clocks high-speed interfaces including QSPI, ETH, and E-Ray.

It integrates 128-channel DMA with scatter-gather support, ECC-protected memory subsystems (including boot ROM and scratchpad RAM), and hardware I/O monitoring for pin-level fault detection. The SRI crossbar enables concurrent access between CPUs, peripherals, and memories without arbitration bottlenecks.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	Six 32-bit TriCore™ TC1.6.2P cores; four configured in lockstep pairs for ASIL-D safety-critical execution.
Max Clock Frequency	300 MHz across full industrial temperature range (-40°C to +125°C); sustained via SYS_PLL with jitter < ±50 ps RMS.
Embedded Memory	2 MB Program Flash (PFLASH), 512 KB Data Flash (DFLASH), 768 KB SRAM (LMU), all with SEC-DED ECC protection.
Peripheral Interface Count	3x MCMCAN modules (4 CAN FD nodes total), 6x QSPI channels (master/slave, up to 50 Mbit/s), 2x HSSL links (320 Mbit/s), 8x ASCLIN (LIN v2.1 compliant).
Safety Features	Integrated Safety Management Unit (SMU), Memory Test Unit (MTU), Hardware I/O Monitor (IOM), optional Hardware Security Module (HSM).
Package & Pin Count	LFBGA-292 package with 292 I/O terminals; supports 5 V/3.3 V switchable pads and high-performance LVDS signaling.
Operating Voltage	Core supply: 1.25 V ±3%; I/O supply: 3.3 V ±10% or 5 V ±10%; meets AEC-Q100 Grade 1 requirements.

Pinout & Package

LFBGA-292 package with 0.8 mm pitch, 17 × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood environments.

Pin/Terminal	Circuit Role	Design Meaning
VDDP_1P25	Core Power Supply	1.25 V ±3% regulated input for CPU, cache, and internal logic; requires low-noise decoupling near package corner.
VDDP_3V3 / VDDP_5V	I/O Power Supply	Selectable 3.3 V or 5 V supply for GPIO banks; enables mixed-voltage interface compatibility with legacy sensors and actuators.
ETH_RXD0–ETH_RXD3	Ethernet RGMII Receive Data	Dedicated differential inputs supporting 100/1000BASE-T RGMII timing; routed with controlled impedance (50 Ω single-ended).
ERAY_TX / ERAY_RX	E-Ray FlexRay Transceiver Interface	Low-jitter differential pair for deterministic time-triggered communication at 10 Mbps; supports dual-channel redundancy.
ASC0_TX / ASC0_RX	ASCLIN LIN Master Interface	Hardware-accelerated LIN v2.1 transceiver pins; support auto-baud detection and slave node wake-up via dominant timeout.
QSPI0_SCLK / QSPI0_IO0–IO3	Quad SPI Flash Interface	High-speed quad I/O lines supporting XIP (execute-in-place) from external flash; configurable for DDR mode up to 50 Mbit/s.

Key Features

Feature	Design Value
Lockstep CPU Configuration	Four TriCore CPUs grouped into two lockstep pairs with automatic error detection and fail-safe state capture for ASIL-D compliance.
ECC-Protected Memory Subsystem	All on-chip SRAM, flash, and cache include SEC-DED ECC; MTU performs background memory testing during runtime without CPU intervention.
Hardware Security Module (HSM)	Optional embedded HSM supports AES-128/256, SHA-256, RSA-2048, and secure key storage; isolated from main CPU domain via firewall.
Deterministic Communication Peripherals	Integrated E-Ray controller with dual-channel redundancy, MCMCAN with time-triggered CAN FD, and HSSL for inter-processor synchronization.
Real-Time Debug & Trace	On-chip debug support via DAP interface; 128-entry instruction trace buffer with timestamping; compatible with Lauterbach TRACE32.

Applications

Electric Powertrain Control

ADAS Domain Controller

Use Scenario: Real-time torque vectoring and inverter gate driver control in 800 V BEV platforms.

IC Role / Device Role / Timing Role: Primary safety-critical MCU executing ISO 26262 ASIL-D motor control algorithms with cycle-accurate PWM generation and fault response within 10 µs.

Use Value: Dual-lockstep CPU pairs ensure fault containment; ECC-protected SRAM guarantees data integrity during high-EMI inverter switching events.

Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for Level 2+ automated driving functions.

IC Role / Device Role / Timing Role: Central domain controller managing time-synchronized data ingestion via E-Ray and CAN FD, with hardware-accelerated matrix math for Kalman filtering.

Use Value: Six-core TriCore architecture enables parallel sensor preprocessing; HSSL links provide deterministic inter-processor communication with < 100 ns latency.

Brake-by-Wire System

Vehicle Gateway ECU

Use Scenario: Redundant braking actuation in steer-by-wire and brake-by-wire architectures requiring dual independent control paths.

IC Role / Device Role / Timing Role: Safety island MCU running certified ASIL-D brake control software with hardware-enforced separation between primary and backup execution domains.

Use Value: SMU monitors voltage, temperature, and clock faults; IOM validates digital I/O states continuously to detect stuck-at faults on brake valve drivers.

Use Scenario: High-bandwidth gateway bridging CAN FD, Ethernet (100BASE-T1), and LIN networks in zonal E/E architectures.

IC Role / Device Role / Timing Role: Protocol translation engine with hardware offload for CAN FD frame routing, Ethernet packet filtering, and LIN master scheduling.

Use Value: Integrated QSPI and Ethernet MAC reduce external component count; RGMII interface supports TSN-aware traffic shaping for time-critical diagnostics.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TC389XX256F300SBDLXUMA1	Same core count and memory size but lacks HSM; uses BC-step silicon instead of BD-step with minor PLL jitter improvement.	Targeted at ASIL-B/C applications where cryptographic acceleration is not required; lower BOM cost.	Select when security certification (e.g., EVITA Medium) is unnecessary and cost sensitivity outweighs future-proofing.
S32K344WAT0MLHT	NXP S32K3 series with Arm Cortex-R52 cores, 2 MB flash, 1.5 MB SRAM; no TriCore ISA or AURIX toolchain compatibility.	Designed for scalable entry-level ADAS and chassis control; supports AUTOSAR Adaptive but lacks native TriCore safety compiler optimizations.	Choose for new designs prioritizing Arm ecosystem alignment over legacy AURIX software reuse or TriCore-specific real-time determinism.

Compared with TC389XX256F300SBDLXUMA1, this part adds HSM and BD-step reliability enhancements; versus S32K344, it delivers superior deterministic interrupt latency (< 50 ns vs. ~120 ns) and native ISO 26262 tool qualification for TriCore compilers.

Availability

TC399XX256F300SBDLXUMA1 is available at Aetrix Electronics and suitable for electric powertrain control, ADAS domain controllers, brake-by-wire systems, and vehicle gateway ECUs requiring stable component supply across extended automotive lifecycles.

Supply support for TC399XX256F300SBDLXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and AEC-Q100-qualified production facilities.

This device belongs to the AURIX™ TC3xx family-designed specifically for ISO 26262 ASIL-D automotive safety applications requiring deterministic real-time performance, hardware-based fault containment, and integrated security acceleration.

FAQ

What is the maximum operating temperature range for TC399XX256F300SBDLXUMA1?

The TC399XX256F300SBDLXUMA1 is qualified for operation from −40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This rating applies to all core logic, memory, and peripheral blocks, including the SYS_PLL and QSPI interfaces, with full functionality maintained across the range.

Does TC399XX256F300SBDLXUMA1 support JTAG debugging?

Yes, it supports IEEE 1149.1 JTAG boundary-scan and debug access via dedicated TCK/TMS/TDI/TDO pins. However, production units default to disabling JTAG after initial programming; re-enabling requires secure authentication through the DAP interface using Infineon's iLLD library and AURIX Development Studio.

How is flash memory partitioned between program and data usage?

The 2.5 MB embedded flash comprises 2 MB PFLASH for executable code and constants, and 512 KB DFLASH configured for EEPROM emulation-supporting wear-leveling, atomic write operations, and 100k-cycle endurance. Both partitions feature ECC protection and independent erase sectors.

Is external RAM required for typical automotive applications?

No-its 768 KB on-chip SRAM (LMU), plus up to 240 KB DSPR and 64 KB PSPR per core, eliminates need for external RAM in most ASIL-D applications. External memory expansion is supported only via EBU interface for specialized use cases like high-resolution image buffering in vision processing.

TC399XX256F300SBDLXUMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Package/Case:: 516-LFBGA

Series:: AURIX™

Packaging:: Tape & Reel (TR)

Product Status:: Discontinued at Digi-Key

Programmable:: Not Verified

Core Processor:: TriCore™

Core Size:: 32-Bit 6-Core

Speed:: 300MHz

Connectivity:: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT

Peripherals:: DMA, I2S, LVDS, PWM, WDT

Number of I/O:: -

Program Memory Size:: 16MB (16M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 1M x 8

RAM Size:: 6.75M x 8

Voltage - Supply (Vcc/Vdd):: 2.97V ~ 5.5V

Data Converters:: A/D 100 SAR, Sigma-Delta

Oscillator Type:: Internal

Operating Temperature:: -40°C ~ 150°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

TC399XX256F300SBDLXUMA1 FAQ

1.How can I place an order for TC399XX256F300SBDLXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TC399XX256F300SBDLXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TC399XX256F300SBDLXUMA1 reliable?

The price and inventory of TC399XX256F300SBDLXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TC399XX256F300SBDLXUMA1 is usually 5 days.

3.What payment methods are accepted for TC399XX256F300SBDLXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TC399XX256F300SBDLXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TC399XX256F300SBDLXUMA1?

TC399XX256F300SBDLXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TC399XX256F300SBDLXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TC399XX256F300SBDLXUMA1?

For technical support, including TC399XX256F300SBDLXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TC399XX256F300SBDLXUMA1 requirements.

6.How does Aetrix verify that TC399XX256F300SBDLXUMA1 is sourced from the original manufacturer or authorized distributors?

All TC399XX256F300SBDLXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TC399XX256F300SBDLXUMA1 meets industry standards.

7.What is the process for return or replacement of TC399XX256F300SBDLXUMA1?

All TC399XX256F300SBDLXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TC399XX256F300SBDLXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TC399XX256F300SBDLXUMA1 part is unused and in its original packaging.

Return procedure for TC399XX256F300SBDLXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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