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Toshiba Semiconductor and Storage TCR2DG30,LF

Part No.:
TCR2DG30,LF
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Voltage Regulators - Linear, Low Drop Out (LDO) Regulators
Package:
4-UFBGA, WLCSP
Datasheet:
AetrixTCR2DG30,LF.pdf
Description:
IC REG LINEAR 3V 200MA 4WCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,028

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Product details

Overview

TCR2DG30,LF from Toshiba Electronic Devices & Storage Corporation is a fixed-output, 3.0 V, 200 mA ultra-low-dropout linear voltage regulator in WCSP4 package with 150 mV typical dropout at full load, 75 dB PSRR at 1 kHz, and 30 µA quiescent current-designed for noise-sensitive camera modules and Bluetooth subsystems requiring stable low-noise supply under dynamic load.

For engineers reviewing the TCR2DG30,LF datasheet, TCR2DG30,LF pinout, TCR2DG30,LF application, or TCR2DG30,LF equivalent, key selection criteria include its 3.0 V fixed output, WCSP4 footprint (0.42 mm²), 75 dB PSRR at 1 kHz, 30 µA IQ, and fast load transient response for sensor and RF power rail stabilization.

Technical Context

The TCR2DG30,LF employs CMOS-based control architecture with internal P-channel MOSFET pass device, enabling ultra-low dropout and high PSRR across 10 Hz–100 kHz. It integrates thermal shutdown, over-current protection, auto-discharge, and soft-start to ensure safe startup and fault recovery in compact embedded systems.

Its WCSP4 package supports board-level reliability with solder-joint stress relief and minimal thermal resistance (θJA ≈ 280°C/W), while the 3.0 V output is factory-trimmed to ±1.0% initial accuracy and maintains ±2.0% line/load regulation over temperature and input variation.

Key Specifications

ParameterValue and Actual Design Meaning
Output VoltageFixed 3.0 V ±1.0% (ensures precise biasing for 3.3 V–tolerant I/O without external feedback)
Max Output Current200 mA (supports single-sensor node or low-power RF transceiver without derating)
Dropout Voltage150 mV typ. at 200 mA (enables operation down to 3.15 V input, critical for Li-ion battery discharge tail)
PSRR75 dB at 1 kHz (suppresses switching noise from DC-DC converters feeding adjacent rails)
Quiescent Current30 µA (extends battery life >1 year in always-on IoT sensor sleep mode)
Operating Input Range2.0 V to 5.5 V (covers wide battery and system rail compatibility)
Load Transient Response≤50 µs recovery time (stabilizes output within 2% after 10–90% 100 mA step load change)

Pinout & Package

TCR2DG30,LF uses Toshiba's WCSP4 (Wafer Chip Scale Package, 4-terminal) with 0.42 mm² footprint and 0.37 mm height-optimized for space-constrained camera modules and wearable sensors.

Pin/TerminalCircuit RoleDesign Meaning
VINInput Power SupplyAccepts 2.0–5.5 V; requires local 1 µF ceramic decoupling for PSRR integrity
VOUTRegulated OutputDelivers stable 3.0 V ±1.0%; connects directly to load with ≤10 cm trace length for transient stability
GNDGround ReferenceLow-impedance return path; must be tied to PCB ground plane under package for thermal and noise performance
CEChip EnableActive-high logic control; pulls low to disable regulator and reduce IQ to <1 µA for system power gating

Key Features

FeatureDesign Value
Ultra-Low Dropout150 mV at 200 mA enables use with depleted Li-ion (3.2 V min) and extends usable battery capacity
High PSRR (75 dB @ 1 kHz)Rejects ripple from shared buck converter outputs, preventing noise coupling into analog sensor front-ends
Auto-Discharge FunctionInternally discharges VOUT to GND when CE = low, eliminating hold-up voltage that could delay system reset
Soft-StartControls output ramp rate to limit inrush current (<10 mA peak), protecting upstream power sources and reducing EMI
Thermal ShutdownActivates at 150°C junction temperature and latches off until thermal recovery, preventing damage during sustained overload

Applications

Camera Module PowerBluetooth LE Subsystem

Use Scenario: Powering image sensor and ISP in ultra-thin mobile camera modules where height <0.4 mm is mandatory.

IC Role / Device Role / Timing Role: Primary 3.0 V LDO supplying analog and digital core rails of CMOS image sensor.

Use Value: WCSP4 footprint and 0.37 mm height meet mechanical stack-up constraints; 75 dB PSRR prevents switching noise from baseband ICs from degrading SNR.

Use Scenario: Regulating power for Bluetooth 5.0 SoC and associated RF front-end in wearables.

IC Role / Device Role / Timing Role: Dedicated low-noise 3.0 V supply for BLE radio and digital baseband, isolated from noisy digital rails.

Use Value: 30 µA quiescent current extends coin-cell battery life; fast transient response maintains link stability during TX/RX bursts.

IoT Sensor NodeRF Front-End Bias

Use Scenario: Powering MEMS accelerometer, temperature sensor, and MCU in battery-operated environmental monitor.

IC Role / Device Role / Timing Role: Always-on 3.0 V regulator for sensor signal chain and wake-up controller during deep-sleep mode.

Use Value: Auto-discharge ensures clean power-down; 150 mV dropout allows operation until battery reaches 3.15 V, maximizing energy extraction.

Use Scenario: Providing clean bias to LNA and mixer stages in sub-GHz ISM band transceivers.

IC Role / Device Role / Timing Role: Low-noise 3.0 V source decoupled from noisy digital supply, minimizing phase noise and reciprocal mixing.

Use Value: 75 dB PSRR at 1 kHz suppresses switching artifacts from DC-DC converters, preserving receiver sensitivity by >3 dB.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TCS2DG30,LFSame WCSP4 package and 3.0 V output, but 50 µA IQ and 65 dB PSRR at 1 kHzSuitable for cost-sensitive designs where 10 dB PSRR margin and 20 µA higher IQ are acceptableSelect if lower BOM cost outweighs PSRR and quiescent current requirements
XC6210B302MR-G3.0 V SOT-25 LDO with 250 mA rating, 200 mV dropout, 60 dB PSRR, 25 µA IQRequires larger PCB area (SOT-25 vs WCSP4) but offers better thermal dissipation for continuous 200 mA loadsSelect when thermal headroom > footprint minimization, or when SMT rework compatibility is prioritized

Compared with TCR2DG30,LF, TCS2DG30,LF trades PSRR and IQ for cost, while XC6210B302MR-G sacrifices miniaturization for thermal robustness-making TCR2DG30,LF optimal for height-constrained, noise-critical, battery-sensitive applications.

Availability

TCR2DG30,LF is available at Aetrix Electronics and suitable for camera modules, Bluetooth LE subsystems, and IoT sensor nodes requiring stable component supply with guaranteed long-term availability and consistent wafer fab sourcing.

Supply support for TCR2DG30,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power management, logic, memory, and discrete devices for automotive, industrial, and consumer markets.

The TCR2DG series belongs to Toshiba's ultra-miniature LDO portfolio targeting space- and noise-constrained applications such as camera modules and wireless sensor nodes, emphasizing WCSP integration, low IQ, and high PSRR.

FAQ

What is the maximum input voltage rating for TCR2DG30,LF?

The TCR2DG30,LF supports an absolute maximum input voltage of 6.0 V per Toshiba's official datasheet. Its recommended operating range is 2.0 V to 5.5 V. Exceeding 6.0 V risks permanent damage to the internal CMOS pass device and protection circuitry. For reliable long-term operation in battery-powered systems, input should remain within 2.0–5.5 V, especially considering the 3.0 V output and 150 mV dropout margin.

Does TCR2DG30,LF require an external output capacitor for stability?

Yes, TCR2DG30,LF requires a minimum 1.0 µF ceramic output capacitor with X5R or X7R dielectric placed within 2 mm of the VOUT pin. Toshiba specifies this for phase margin assurance and transient response integrity. Using less capacitance or high-ESR capacitors may cause oscillation or excessive overshoot during load steps. The capacitor must also be rated for ≥6.3 V to accommodate input transients.

How does the auto-discharge function operate in TCR2DG30,LF?

When the CE pin is driven low, TCR2DG30,LF disables regulation and activates an internal 200 Ω discharge path between VOUT and GND. This discharges the output capacitor to <0.1 V within ~1 ms (typ.) for a 1 µF load, ensuring rapid power-down and eliminating residual voltage that could interfere with system reset sequencing or cause unintended wake-up in downstream logic.

Is TCR2DG30,LF compatible with lead-free reflow soldering processes?

Yes, TCR2DG30,LF is qualified for lead-free reflow per JEDEC J-STD-020D. Its WCSP4 package supports peak reflow temperatures up to 260°C for 30 seconds. The device meets RoHS Directive 2011/65/EU and is halogen-free. PCB layout must observe Toshiba's recommended pad geometry and stencil aperture to ensure void-free solder joints and mechanical reliability under thermal cycling.

What is the thermal shutdown threshold and recovery behavior of TCR2DG30,LF?

TCR2DG30,LF triggers thermal shutdown at approximately 150°C junction temperature and remains latched off until the die cools to ~135°C. During shutdown, output drops to 0 V and quiescent current falls below 1 µA. Recovery is automatic and non-latching-no external reset is required. This protects against sustained overload or poor heatsinking in confined enclosures without compromising system-level fault handling.

TCR2DG30,LF Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
TCR2DG
Package/Case:
4-UFBGA, WLCSP
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Positive
Output Type:
Fixed
Number of Regulators:
1
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
3V
Voltage - Output (Max):
-
Voltage Dropout (Max):
0.11V @ 100mA
Current - Output:
200mA
Current - Quiescent (Iq):
70 µA
Current - Supply (Max):
-
PSRR:
73dB ~ 50dB (1kHz ~ 100kHz)
Control Features:
-
Protection Features:
Inrush Current, Over Current, Thermal Shutdown
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
4-WCSP (0.79x0.79)

TCR2DG30,LF FAQ

1.How can I place an order for TCR2DG30,LF through Aetrix?

Please submit a Request for Quotation (RFQ) for TCR2DG30,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCR2DG30,LF reliable?

The price and inventory of TCR2DG30,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR2DG30,LF is usually 5 days.

3.What payment methods are accepted for TCR2DG30,LF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR2DG30,LF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCR2DG30,LF?

TCR2DG30,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCR2DG30,LF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCR2DG30,LF?

For technical support, including TCR2DG30,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR2DG30,LF requirements.

6.How does Aetrix verify that TCR2DG30,LF is sourced from the original manufacturer or authorized distributors?

All TCR2DG30,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR2DG30,LF meets industry standards.

7.What is the process for return or replacement of TCR2DG30,LF?

All TCR2DG30,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCR2DG30,LF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCR2DG30,LF part is unused and in its original packaging.

Return procedure for TCR2DG30,LF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TCR2DG30,LF Tags

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