Qorvo TGL2767
- Part No.:
- TGL2767
- Manufacturer:
- Qorvo
- Category:
- Attenuators
- Package:
- Die
- Datasheet:
-
TGL2767.pdf
- Description:
- 2-25 GHZ V VARIABLE ATTN, DIE
- Quantity:
- Payment:

- Shipping:

Inventory:2,572
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Product details
Overview
TGL2767 from Qorvo is a GaAs pHEMT-based voltage-variable RF attenuator operating from 2–25 GHz, delivering >20 dB attenuation range with <2 dB insertion loss in the reference state, and fully matched to 50 Ω for radar, EW, and satellite communication front-ends.
For engineers reviewing the TGL2767 datasheet, pinout, applications, or equivalent options, this device requires attention to control voltage (0–1.5 V), reference voltage (1.5 V), thermal resistance (40 °C/W), IIP3 performance across attenuation states, and die-level mounting constraints for RF stability and reliability.
Technical Context
The TGL2767 implements a monolithic GaAs pHEMT architecture optimized for broadband analog attenuation control without internal biasing circuitry-requiring external VS = 1.5 V and VC ≤ VS for linear attenuation response. Its 4-terminal configuration separates RF path (pins 1 & 4) from dual-voltage control (pins 2 & 3), enabling precise gain management in signal chains where dynamic range and harmonic suppression are critical.
Performance remains stable across –40 to +85 °C ambient, with input/output return loss >12 dB over full band and IIP3 exceeding 38 dBm at 0 dB attenuation (2 GHz, 10 MHz tone spacing). Thermal design must account for θJC = 40 °C/W and mandatory AuSn solder reflow per assembly notes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2–25 GHz - supports single-component coverage of S-, C-, X-, Ku-, K-, and Ka-band systems without band switching. |
| Attenuation Range | 20 dB - enables precise RF power leveling across wide dynamic ranges in receiver AGC and transmitter output control loops. |
| Reference State IL | <2.0 dB - minimizes signal degradation when maximum system gain is required, preserving SNR in low-noise paths. |
| Control Voltage | 0.0–1.5 V - compatible with standard DAC outputs and low-voltage analog controllers without level-shifting circuitry. |
| IIP3 (0 dB Att.) | >38 dBm @ 2 GHz - maintains linearity under high-input conditions typical in radar pulse amplification and broadband instrumentation. |
| Thermal Resistance θJC | 40.0 °C/W - dictates minimum heatsinking requirements when dissipating up to 1 W under high-power RF operation. |
| Die Size | 1.17 × 0.98 × 0.10 mm - ultra-compact bare-die form factor requiring precision flip-chip or epoxy-mount assembly on RF substrates. |
Pinout & Package
Package: Bare die (1.17 × 0.98 mm, 0.10 mm thick), gold metallization, backside ground, RoHS-compliant, lead-free/halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | RF Input | 50 Ω AC-coupled RF port; requires external DC blocking and impedance-matched microstrip launch for minimal mismatch. |
| 2 | VC | Control voltage input (0–1.5 V); sets attenuation level relative to VS; sensitive to noise-requires local decoupling. |
| 3 | VS | Reference voltage (1.5 V fixed or adjustable); establishes baseline FET threshold compensation across process variation. |
| 4 | RF Output | 50 Ω AC-coupled RF port; output return loss >12 dB ensures minimal reflection into downstream stages like mixers or ADC drivers. |
Key Features
| Feature | Design Value |
|---|---|
| Monolithic GaAs pHEMT Process | QPHT15 0.15 µm process delivers consistent high-frequency performance and thermal stability across wafer lots. |
| 50 Ω Matched Ports | Eliminates need for external matching networks-reducing board area, insertion loss, and tuning complexity in multi-GHz designs. |
| Wideband Linearity Control | IIP3 >22 dBm maintained across 5–20 dB attenuation states, enabling predictable distortion behavior in variable-gain receivers. |
| Low-Temp Coefficient Attenuation | Relative attenuation drift < ±0.5 dB over –40 to +85 °C, supporting stable gain control in unheated outdoor radar enclosures. |
| ESD-Robust Die Handling | HBM Class 1A rating with strict AuSn-only soldering protocol ensures yield integrity during automated die attach processes. |
Applications
| Commercial Radar Systems | Military Electronic Warfare |
|---|---|
|
Use Scenario: Pulse compression and clutter rejection in automotive and weather radar transceivers operating at 77 GHz (fundamental + harmonics). IC Role / Device Role / Timing Role: Front-end RF attenuator in LNA bypass path and transmit power control loop. Use Value: 20 dB range enables adaptive blanking of strong near-field reflections while maintaining <2 dB IL for weak target detection sensitivity. |
Use Scenario: Wideband jammer front-end where rapid, repeatable attenuation adjustment counters frequency-hopping threats. IC Role / Device Role / Timing Role: Core analog gain-control element in broadband RF cancellation and null-steering architectures. Use Value: 2–25 GHz coverage allows single-part replacement across multiple threat bands without hardware redesign or calibration rework. |
| Satellite Communication Terminals | Millimeter-Wave Test Instrumentation |
|
Use Scenario: Uplink power conditioning in phased-array SATCOM terminals operating across Ka-band (26.5–40 GHz) using harmonic content. IC Role / Device Role / Timing Role: Closed-loop output power stabilizer preceding power amplifier driver stage. Use Value: IIP3 >30 dBm at 20 dB attenuation prevents intermodulation distortion from degrading EVM in 256-QAM waveforms. |
Use Scenario: Signal generator output leveling and vector network analyzer receiver protection in lab-grade 5G/mmWave test sets. IC Role / Device Role / Timing Role: Precision programmable attenuator in calibrated RF signal path between source and DUT. Use Value: <2 dB IL and >12 dB return loss ensure traceable amplitude accuracy and minimal measurement uncertainty below ±0.15 dB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar voltage-variable RF attenuator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| QPL9547 | 0.5–6 GHz range, 30 dB range, integrated bias tee, 3.5 mm × 2.5 mm QFN package. | Limited to sub-6 GHz; unsuitable for Ka-band or radar harmonics above 10 GHz. | Select when board space permits larger package and bandwidth needs are below 6 GHz with simplified DC biasing. |
| PE43711 | DC–6 GHz, 31.5 dB range, SPI interface, 4 × 4 mm QFN, built-in DAC and serial control. | Digital control only; no analog VC/VS interface; incompatible with analog AGC loops requiring continuous voltage sweep. | Choose for digitally controlled test equipment where firmware integration outweighs analog flexibility and bandwidth. |
Compared with QPL9547 and PE43711, the TGL2767 uniquely supports 2–25 GHz analog attenuation with die-level integration, making it irreplaceable in compact, high-frequency systems requiring direct voltage control and minimal parasitic loading-no alternative matches its combination of bandwidth, linearity, and form factor.
Availability
TGL2767 is available at Aetrix Electronics and suitable for commercial radar systems, military electronic warfare platforms, satellite communication terminals, and millimeter-wave test instrumentation requiring stable component supply across extended temperature and frequency ranges.
Supply support for TGL2767 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Qorvo is a U.S.-based RF semiconductor company specializing in high-performance GaAs, GaN, and BAW technologies for defense, aerospace, and wireless infrastructure markets.
The TGL2767 belongs to Qorvo's high-frequency analog RF front-end product line, engineered specifically for wideband, high-linearity, die-level integration in radar, EW, and SATCOM systems demanding minimal footprint and thermal overhead.
FAQ
What is the recommended control voltage range for the TGL2767?
The TGL2767 requires VC between 0.0 V and 1.5 V, with VS fixed at 1.5 V and VC ≤ VS. Exceeding ±3.0 V on either VC or VS risks permanent damage per absolute maximum ratings. Operation within 0–1.5 V ensures monotonic 20 dB attenuation sweep with <0.1 dB hysteresis across temperature.
Can the TGL2767 be used above 25 GHz?
No-the TGL2767 is characterized and specified only from 2–25 GHz. Performance beyond 25 GHz is not guaranteed; insertion loss rises sharply and return loss degrades above 25 GHz per datasheet S-parameter plots. For Ka-band fundamental use, consider Qorvo's TGL2220 series instead.
Is the TGL2767 supplied as a packaged IC or bare die?
The TGL2767 is supplied as a bare die (1.17 × 0.98 mm) with gold bond pads and backside ground. It is not offered in a surface-mount package. Customers must integrate it using flip-chip, epoxy mount, or wire-bond assembly onto RF substrates such as Rogers RO4003C, per Qorvo's EVB layout guidelines.
What is the thermal resistance and maximum channel temperature of the TGL2767?
The TGL2767 has a junction-to-case thermal resistance (θJC) of 40.0 °C/W when mounted to a CuMo carrier plate at 85 °C base temperature. Its maximum rated channel temperature is 125 °C. Sustained operation above this limit accelerates aging; median lifetime drops below 2.4E+7 hours per reliability data.
Does the TGL2767 require external matching components?
No-the TGL2767 is fully matched to 50 Ω at both RF input (pin 1) and RF output (pin 4), eliminating the need for external matching networks. However, AC coupling capacitors are required on both RF ports per datasheet application circuit, and proper microstrip launch design is essential to preserve broadband return loss >12 dB.
TGL2767 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Qorvo
- Package/Case:
- Die
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Attenuation Value:
- 20dB
- Frequency Range:
- 2 GHz ~ 25 GHz
- Power (Watts):
- 1W
- Impedance:
- 50 Ohms
- Grade:
- -
- Qualification:
- -
TGL2767 FAQ
1.How can I place an order for TGL2767 through Aetrix?
Please submit a Request for Quotation (RFQ) for TGL2767 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TGL2767 reliable?
The price and inventory of TGL2767 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TGL2767 is usually 5 days.
3.What payment methods are accepted for TGL2767?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TGL2767 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TGL2767?
TGL2767 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TGL2767 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TGL2767?
For technical support, including TGL2767 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TGL2767 requirements.
6.How does Aetrix verify that TGL2767 is sourced from the original manufacturer or authorized distributors?
All TGL2767 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TGL2767 meets industry standards.
7.What is the process for return or replacement of TGL2767?
All TGL2767 units undergo pre-shipment inspection (PSI). If there is an issue with TGL2767, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TGL2767 part is unused and in its original packaging.
Return procedure for TGL2767:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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