Qorvo TGP2108-SM EVB

Overview

TGP2108-SM EVB from Qorvo is an evaluation board designed to characterize and validate the TGP2108-SM - a 2.5–4 GHz, 6-bit digital GaAs pHEMT phase shifter in a 5 × 5 mm QFN package - for S-band phased array radar applications. It supports bi-directional RF operation, 0/+3 V to +5 V positive-only control logic, and delivers <2° RMS phase error (2.7–3.7 GHz) and <0.4 dB RMS amplitude error.

For engineers reviewing the TGP2108-SM EVB datasheet, pinout, applications, or equivalent options, this board enables rapid prototyping of beamforming subsystems, verification of phase-state linearity across temperature, and validation of insertion loss and return loss performance in real-world RF front-end layouts using Rogers RO4003C substrate and Southwest Microwave 1092-02A-5 end-launch connectors.

Technical Context

The TGP2108-SM EVB implements a fully assembled, impedance-matched test platform for the TGP2108-SM IC, featuring microstrip 50 Ω transmission lines (0.050" width), optimized via patterns under the DUT slug (Pin 25), and DC-blocked RF input/output ports. It requires no de-coupling network and supports both 3 V and 5 V reference voltage operation per the TGP2108-SM's bias truth table.

Thermal vias beneath the center ground slug are specified as copper-filled, 8-mil diameter, with multiple vias mandated to minimize thermal resistance and inductance. The PCB uses 0.008" thick Rogers RO4003C dielectric and 0.5-oz copper layers, matching the mechanical and RF requirements defined in the TGP2108-SM datasheet Rev. D.

Key Specifications

Availability

TGP2108-SM EVB is available at Aetrix Electronics and suitable for S-band radar development, phased array antenna calibration, RF front-end linearity validation, and GaAs pHEMT phase shifter integration requiring stable component supply and traceable evaluation hardware.

Supply support for TGP2108-SM EVB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Qorvo is a U.S.-based semiconductor company specializing in RF solutions for defense, aerospace, and infrastructure markets, with leadership in GaAs, GaN, and BAW technologies.

The TGP2108-SM EVB belongs to Qorvo's high-frequency phase shifter evaluation platform family, engineered specifically to accelerate design-in and performance verification of digitally controlled beamforming components in military and weather radar systems.

FAQ

What is the primary function of the TGP2108-SM EVB?

The TGP2108-SM EVB is a fully assembled evaluation board for the TGP2108-SM 6-bit digital phase shifter. It enables engineers to measure RF performance-including phase accuracy, insertion loss, return loss, and linearity-under real-world bias and thermal conditions. The TGP2108-SM EVB provides direct access to all control pins and calibrated 50 Ω RF paths, eliminating custom PCB development during early-stage phased array design.

Does the TGP2108-SM EVB support both 3 V and 5 V control logic?

Yes, the TGP2108-SM EVB supports both 3 V and 5 V reference voltage operation, consistent with the TGP2108-SM's specified control voltage range (0/+3 V to +5 V). Test points for REF, 5°, 11°, 22°, 45°, 90°, and 180° pins allow flexible logic-level configuration, and performance plots in the TGP2108-SM datasheet Rev. D confirm RMS phase error <2° and amplitude error <0.4 dB across both voltages.

What RF substrate and connector type are used on the TGP2108-SM EVB?

The TGP2108-SM EVB uses Rogers RO4003C substrate (0.008" thick) with 0.5-oz copper layers and Southwest Microwave 1092-02A-5 end-launch SMA connectors. This combination ensures precise 50 Ω microstrip impedance (0.050" line width), minimal launch discontinuity, and repeatable S-parameter measurements - critical for validating the TGP2108-SM's 2.5–4 GHz small-signal and large-signal behavior.

How is thermal management implemented on the TGP2108-SM EVB?

The TGP2108-SM EVB implements thermal management via copper-filled 8-mil vias under Pin 25 (the exposed ground slug of the TGP2108-SM IC), with ≥12 vias recommended per Qorvo's layout guidance. This structure minimizes thermal resistance and inductance, enabling reliable operation up to +85°C ambient and supporting the TGP2108-SM's rated channel temperature of 85°C at TBASE = 85°C.

Is a de-coupling network required when using the TGP2108-SM EVB?

No, a de-coupling network is not required when using the TGP2108-SM EVB. As confirmed in the TGP2108-SM datasheet Rev. D (page 13), the evaluation board integrates DC-blocking capacitors on both RF input and output paths and is designed for direct connection to 50 Ω signal sources and loads. The TGP2108-SM EVB's layout eliminates the need for external bias tees or decoupling circuits during standard characterization.