Qorvo TGS2352-2 EVB

Overview

TGS2352-2 EVB from Qorvo is an evaluation board designed to characterize and validate the TGS2352-2 GaN-on-SiC SPDT RF switch - a 0.5–12 GHz, 20 W high-power reflective switch with <1 dB insertion loss and 35 dB typical isolation. It supports bias control at 0/−40 V, features microstrip routing on RO4350B substrate, and enables rapid prototyping for radar and EW front-end designs.

For engineers reviewing the TGS2352-2 EVB datasheet, TGS2352-2 EVB layout, TGS2352-2 EVB mounting procedure, or TGS2352-2 EVB RF performance validation, this board provides calibrated 50 Ω microstrip interfaces, Southwest Microwave 1092-02A-5 end-launch connectors, and verified thermal assembly guidance for GaN die integration.

Technical Context

The TGS2352-2 EVB implements a controlled-impedance RF test platform for the bare-die TGS2352-2 SPDT switch, using 0.010″ Rogers RO4350B (ε_r = 3.48) with 0.5 oz copper layers. Its layout accommodates the 1.11 × 1.61 mm GaN die and supports dual-side biasing via bond pads 2/7 (VC2) and 3/6 (VC1).

Designed for high-frequency validation, the board maintains consistent 50 Ω microstrip geometry from J1 (RF In) to J2 (RF Out1) and J3 (RF Out2), with optimized transitions for the Southwest Microwave 1092-02A-5 end-launch connector. Thermal management relies on AuSn solder attachment to a Cu-Mo carrier, matching the die's CTE requirements.

Key Specifications

Availability

TGS2352-2 EVB is available at Aetrix Electronics and suitable for radar transceiver development, electronic warfare subsystem validation, and high-frequency test instrument design requiring stable component supply and traceable GaN evaluation hardware.

Supply support for TGS2352-2 EVB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Qorvo is a U.S.-based RF semiconductor company specializing in gallium nitride (GaN) and silicon carbide (SiC) power amplifiers, switches, and front-end modules for defense, aerospace, and infrastructure applications.

The TGS2352-2 EVB belongs to Qorvo's high-frequency GaN switch evaluation platform family, engineered to accelerate qualification of broadband, high-power RF switches in mission-critical RF systems.

FAQ

What is the purpose of the TGS2352-2 EVB?

The TGS2352-2 EVB is a dedicated evaluation board for the TGS2352-2 GaN SPDT switch, enabling RF performance characterization, bias sequencing validation, and thermal interface testing. It provides calibrated 50 Ω microstrip paths, end-launch connectors, and mechanical mounting guidance - all aligned to the TGS2352-2 die's operational requirements and absolute maximum ratings.

Which RF connectors are used on the TGS2352-2 EVB?

The TGS2352-2 EVB uses Southwest Microwave model 1092-02A-5 end-launch connectors, specifically selected and optimized for impedance-matched transitions from the PCB to the TGS2352-2 die's RF ports. These connectors support reliable RF measurements from 0.5 to 12 GHz and are integral to the board's published insertion loss and isolation data.

Does the TGS2352-2 EVB support both RF path configurations of the TGS2352-2?

Yes, the TGS2352-2 EVB supports both RF path states defined in the TGS2352-2 function table: RF In → RF Out1 (VC1 = 0 V, VC2 = −40 V) and RF In → RF Out2 (VC1 = −40 V, VC2 = 0 V). The board's J1, J2, and J3 labeling and microstrip routing preserve signal integrity for either configuration without modification.

What solder process is required for attaching the TGS2352-2 die to the EVB?

The TGS2352-2 EVB requires AuSn (80/20) solder with strict thermal control: exposure above 300°C must not exceed 3–4 minutes. This matches the TGS2352-2 die's assembly specification and prevents intermetallic degradation or die fracture. Reducing-atmosphere reflow and flux-free processing are mandatory per Qorvo's handling guidelines for the TGS2352-2.

Is the TGS2352-2 EVB RoHS compliant and ESD-safe?

Yes, the TGS2352-2 EVB complies with EU RoHS Directive 2011/65/EU (as amended by 2015/863/EU), including lead-free, halogen-free, antimony-free, TBBP-A–free, PFOS–free, and SVHC–free construction. It is also rated ESD-sensitive per JEDEC JS-001 (HBM Class 1A), requiring grounded handling and ionized air during assembly and testing of the TGS2352-2 die.