Qorvo TGS2355-SM EVB

Overview

TGS2355-SM EVB from Qorvo is an evaluation board designed to characterize and validate the TGS2355-SM 0.5–6 GHz, 100 W GaN SPDT reflective switch in real RF system conditions. It supports pulsed RF input up to 50.5 dBm (≈112 W), delivers <1.1 dB insertion loss and >40 dB isolation, and enables rapid prototyping for radar and EW front-end switching stages.

For engineers reviewing the TGS2355-SM EVB datasheet, pinout, applications, or equivalent options, this board provides calibrated RF paths, thermal management guidance, DC blocking integration, and verified layout stack-up (Rogers RO6202) - all critical for high-power GaN switch validation and system-level linearity testing.

Technical Context

The TGS2355-SM EVB implements a fully populated, impedance-matched test fixture for the TGS2355-SM GaN MMIC, featuring three 50 Ω DC-coupled SMA connectors (RFC, RF1, RF2), dual control voltage access (VC1/VC2), and ground-via optimized thermal pads. It replicates production-relevant mounting conditions including 12-mil AlN QFN base attachment and 0.8-mil Diemat 6030 epoxy bonding.

Designed per Qorvo's recommended PCB stack-up (1 oz Cu / RO6202 / 1 oz Cu, 0.020″ dielectric), the board supports accurate small-signal and large-signal characterization - including P0.1dB compression, IM3/IM5 linearity, harmonic suppression, and temperature-dependent switching performance - across −40°C to +85°C ambient.

Key Specifications

Availability

TGS2355-SM EVB is available at Aetrix Electronics and suitable for radar transceiver development, electronic warfare subsystem validation, and high-power RF test instrumentation requiring stable component supply and traceable reference hardware.

Supply support for TGS2355-SM EVB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Qorvo is a U.S.-based RF semiconductor company specializing in gallium nitride (GaN), silicon carbide (SiC), and RF solutions for defense, aerospace, and infrastructure markets.

The TGS2355-SM EVB belongs to Qorvo's high-power GaN evaluation platform family, engineered to accelerate deployment of wideband, high-efficiency RF switches in mission-critical radar and EW systems.

FAQ

What is the primary purpose of the TGS2355-SM EVB?

The TGS2355-SM EVB is a dedicated evaluation platform for the TGS2355-SM GaN SPDT switch, enabling engineers to verify RF performance - including insertion loss, isolation, compression, and harmonics - under realistic pulsed and CW conditions. It provides calibrated interconnects, thermal management, and layout fidelity to de-risk integration of the TGS2355-SM into final systems.

Does the TGS2355-SM EVB support both pulsed and continuous-wave (CW) RF testing?

Yes, the TGS2355-SM EVB supports both pulsed and CW operation of the TGS2355-SM device. Its Rogers RO6202 substrate, optimized via pattern, and thermal pad design accommodate the TGS2355-SM's rated 100 W pulsed input (50.5 dBm) and 47 dBm CW input at +85°C ambient - as validated in Qorvo's datasheet Rev. E test conditions.

Are DC blocking capacitors included on the TGS2355-SM EVB?

No, DC blocking capacitors are not mounted on the TGS2355-SM EVB by default. Per Qorvo's datasheet (page 6), external DC blocking capacitors are required on all RF ports (RFC, RF1, RF2) when using the TGS2355-SM EVB - a design choice that preserves flexibility for user-selected capacitor type, voltage rating, and frequency response matching.

Can the TGS2355-SM EVB be used to evaluate SPST configurations of the TGS2355-SM?

Yes, the TGS2355-SM EVB supports SPST configuration of the TGS2355-SM. As specified in the datasheet's Application Circuit section, one unused RF switched port (RF1 or RF2) can be terminated with a 50 Ω load - and the board's layout includes designated 0402 footprint locations adjacent to each RF port for surface-mount termination resistors.

What soldering profile is recommended for reworking or assembling components on the TGS2355-SM EVB?

The TGS2355-SM EVB uses standard FR4-compatible materials and accepts lead-free reflow profiles with a peak temperature of 260°C. However, Qorvo explicitly states that solder rework of the TGS2355-SM MMIC itself is not recommended due to its air-cavity QFN package and sensitivity to thermal stress - so any assembly must follow the recommended profile strictly and avoid localized heating of the IC site.