My Inquiry
My Account
Infineon Technologies TLE62592GXUMA1
- Part No.:
- TLE62592GXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Drivers, Receivers, Transceivers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TLE62592GXUMA1.pdf
- Description:
- IC TRANSCEIVER 1/1 PGDSO83
- Quantity:
- Payment:
- Shipping:
Inventory:1,501
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLE62592GXUMA1 from Infineon Technologies is a single-wire LIN transceiver IC designed for automotive and industrial local interconnect networks. It serves as the physical layer interface between a microcontroller's LIN protocol controller and the bus line, supporting up to 20 kBaud data rate, integrated bus short-to-GND protection, and sleep-mode current control via INH output - deployed in body control modules and door actuator nodes.
For engineers reviewing the TLE62592GXUMA1 datasheet, TLE62592GXUMA1 pinout, TLE62592GXUMA1 application, or TLE62592GXUMA1 equivalent, key selection criteria include bus fault resilience (–20 V to 40 V bus voltage tolerance), EN-controlled normal/sleep mode transition, RxD wake-up flag behavior, and compatibility with LIN 1.2 and ISO 9141-2 physical layers.
Technical Context
The TLE62592GXUMA1 implements a Smart Power Technology (SPT®) monolithic architecture integrating bipolar/CMOS logic with DMOS power stages. Its receiver includes a filtered input stage with dominant-state detection, while the driver supports recessive pull-up (30 kΩ internal) and dominant low-drive capability on the BUS pin.
Sleep mode is entered by pulling EN low, disabling internal regulators and reducing quiescent current; wake-up is triggered by bus activity, asserting INH high and holding RxD LOW until full initialization completes. Bus short-to-GND protection activates only when INH controls external termination, limiting leakage during vehicle park state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bus Voltage Range | –20 V to 40 V (supports load dump, reverse battery, and cold-crank conditions without external protection) |
| Data Rate | Up to 20 kBaud (meets LIN 1.2 timing requirements for dominant/recessive transitions) |
| Sleep Current | < 10 µA typical (enables ultra-low-power node operation in parked-vehicle scenarios) |
| Thermal Shutdown | 150 °C activation with 10 K hysteresis (prevents latch-up during sustained overtemperature events) |
| INH Output Drive | 20 mA sink/source (directly controls external LDO enable input without buffer transistor) |
| Internal Pull-up | 30 kΩ on BUS and TxD pins (reduces BOM count; enables master/slave node flexibility) |
| ESD Robustness | ±4 kV HBM on VS/BUS pins (meets ISO 10605 automotive ESD immunity requirements) |
Pinout & Package
P-DSO-8-3 (8-pin plastic dual small outline package, 3.9 mm body width, 1.27 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (RxD) | Receive data output | Open-drain output with internal pull-up; held LOW during bus wake-up event to signal microcontroller |
| 2 (EN) | Enable input | Active-HIGH logic input with 30 kΩ internal pull-down; controls normal/sleep mode entry/exit |
| 3 (VCC) | 5 V supply input | Regulated 5 V rail for internal logic; requires external 100 nF decoupling capacitor |
| 4 (TxD) | Transmit data input | Active-LOW input with internal pull-up; driven LOW by MCU to assert dominant bus state |
| 5 (GND) | Ground reference | Common return path for VCC, VS, and BUS; must be low-inductance connection in PCB layout |
| 6 (BUS) | Single-wire bus I/O | Bi-directional open-drain node with 30 kΩ internal pull-up; connects directly to LIN bus line |
| 7 (VS) | Battery supply input | Direct connection to vehicle battery (6–35 V); powers internal DMOS driver stage |
| 8 (INH) | Inhibit output | Open-drain output that goes HIGH on bus wake-up to enable external voltage regulator |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bus Short-to-GND Protection | Activates only when INH drives external termination; eliminates parasitic drain during vehicle park state |
| Wake-up Flag via RxD | RxD held LOW until full initialization completes - provides unambiguous hardware wake-up indication to MCU |
| Smart Power Technology (SPT®) | Monolithic integration of CMOS control + DMOS power devices enables robust 40 V bus tolerance and thermal shutdown |
| Configurable Termination Control | INH output allows dynamic enable/disable of external 1 kΩ master termination resistor via external MOSFET switch |
| ISO 9141-2 Compatibility | Supports diagnostic communication modes using same physical layer - enables dual-protocol gateway designs |
Applications
| Body Control Module (BCM) | Door Actuator Node |
|---|---|
Use Scenario: Centralized control of interior lighting, window lifts, and mirror adjustment in passenger vehicles. IC Role / Device Role / Timing Role: LIN physical layer transceiver interfacing MCU to distributed slave nodes over single-wire bus. Use Value: Enables deterministic 20 kBaud communication with <10 µA sleep current, meeting OEM park-mode current budgets. | Use Scenario: Local motor control and position feedback in power door lock and window lift assemblies. IC Role / Device Role / Timing Role: Slave-side LIN transceiver handling command reception and status reporting via BUS pin. Use Value: Integrated 30 kΩ pull-up and bus short-to-GND protection eliminate need for external resistors and prevent battery drain during vehicle off-state. |
| Roof Module Gateway | Seat Control Unit |
Use Scenario: Aggregation of sunroof, ambient lighting, and rain sensor signals into main vehicle network. IC Role / Device Role / Timing Role: Master-node LIN transceiver driving bus with 1 kΩ external termination and reverse-polarity diode. Use Value: INH-controlled voltage regulator sequencing ensures synchronized power-up across multiple subsystems during ignition-on. | Use Scenario: Position sensing, heater control, and memory function management in power-adjustable seats. IC Role / Device Role / Timing Role: Slave transceiver with wake-up capability via bus activity, reducing reliance on MCU polling. Use Value: RxD wake-up flag and thermal shutdown (150 °C) ensure reliable operation in confined, thermally stressed cabin environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LIN transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLIN1029DRBR | Higher ESD rating (±8 kV HBM), integrated 12 V LDO, no INH output | Requires external wake-up logic; better suited for new designs needing higher EMC robustness | Select when system-level ESD testing exceeds ±4 kV or LDO integration reduces BOM count |
| MC33661DTBR2G | Supports LIN 2.2A, lower sleep current (3 µA), no bus short-to-GND feature | Lacks park-mode battery protection; requires external circuitry for GND-short mitigation | Select when lowest possible sleep current is critical and bus fault management is handled externally |
Compared with TLIN1029DRBR and MC33661DTBR2G, the TLE62592GXUMA1 uniquely combines bus short-to-GND protection with INH-driven voltage regulator control - enabling zero-maintenance park-mode operation without added discrete components.
Availability
TLE62592GXUMA1 is available at Aetrix Electronics and suitable for body control modules, door actuator nodes, roof module gateways, and seat control units requiring stable component supply under AEC-Q100 Grade 1 qualification.
Supply support for TLE62592GXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and qualification infrastructure.
The TLE62592GXUMA1 belongs to Infineon's automotive LIN transceiver product line, engineered specifically for cost-sensitive, high-reliability single-wire networking in harsh-temperature and high-voltage automotive environments.
FAQ
What is the purpose of the INH pin on the TLE62592GXUMA1?
The INH (Inhibit) pin is an open-drain output that goes HIGH upon bus wake-up, enabling external voltage regulators to power up associated circuitry. It allows coordinated power sequencing between the transceiver and downstream logic, eliminating unnecessary standby current draw when the system is parked.
How does the bus short-to-GND protection work in practice?
This feature disables the internal 30 kΩ BUS pull-up when the device is in sleep mode *and* the external 1 kΩ master termination is connected to INH instead of VS. It prevents continuous current flow through the termination path during vehicle park state, avoiding battery discharge over extended periods.
Can the TLE62592GXUMA1 operate without an external 1 kΩ termination resistor?
No - the internal 30 kΩ pull-up alone cannot meet LIN specification timing for dominant-to-recessive transition. An external 1 kΩ resistor at the master node is mandatory for compliant bus signaling; its placement and optional series diode are detailed in the application circuit (Figure 6/7 of datasheet).
Is the TLE62592GXUMA1 qualified for automotive use?
Yes - it is qualified per AEC-Q100 Grade 1 (–40 °C to +125 °C ambient), features thermal shutdown at 150 °C, and supports battery supply voltages from 6 V to 35 V, making it suitable for under-hood and cabin-mounted automotive electronic control units.
TLE62592GXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Transceiver
- Protocol:
- LINbus
- Number of Drivers/Receivers:
- 1/1
- Duplex:
- -
- Receiver Hysteresis:
- -
- Data Rate:
- -
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-8-3
TLE62592GXUMA1 FAQ
1.How can I place an order for TLE62592GXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE62592GXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE62592GXUMA1 reliable?
The price and inventory of TLE62592GXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE62592GXUMA1 is usually 5 days.
3.What payment methods are accepted for TLE62592GXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE62592GXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE62592GXUMA1?
TLE62592GXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE62592GXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE62592GXUMA1?
For technical support, including TLE62592GXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE62592GXUMA1 requirements.
6.How does Aetrix verify that TLE62592GXUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE62592GXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE62592GXUMA1 meets industry standards.
7.What is the process for return or replacement of TLE62592GXUMA1?
All TLE62592GXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE62592GXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE62592GXUMA1 part is unused and in its original packaging.
Return procedure for TLE62592GXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLE62592GXUMA1 Tags
-
ATA6561-GAQW-N
Microchip Technology
-
ATA6561-GBQW-N
Microchip Technology
-
AM26LS32ACDR
Texas Instruments
-
SP485CN-L/TR
MaxLinear, Inc.
-
SP485EN-L/TR
MaxLinear, Inc.
-
SP485EEN-L/TR
MaxLinear, Inc.
-
SP485ECN-L/TR
MaxLinear, Inc.
-
THVD1400DR
Texas Instruments
-
AM26C31IDR
Texas Instruments
-
TLIN1021ADRQ1
Texas Instruments
-
MAX232IDR
Texas Instruments
-
AM26C32IDR
Texas Instruments
Tech Hub
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
