Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Interface > Drivers, Receivers, Transceivers

Infineon Technologies TLE7250VSJXUMA1

Name: TLE7250VSJXUMA1
Brand: Infineon Technologies
SKU: TLE7250VSJXUMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: TLE7250VSJXUMA1

Manufacturer:: Infineon Technologies

Category:: Drivers, Receivers, Transceivers

Package:: 8-SOIC (0.154", 3.90mm Width)

Datasheet:: TLE7250VSJXUMA1.pdf

Description:: IC TRANSCEIVER 1/1 PGDSO8

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,010

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

TLE7250VSJXUMA1 from Infineon Technologies is a high-speed CAN transceiver compliant with ISO 11898-2, serving as the physical layer interface between microcontroller CAN controllers and automotive HS CAN bus networks. It supports data rates up to 2 MBit/s, features dual supply inputs (VCC = 4.5–27 V, VIO = 3.0–5.5 V), integrated TxD time-out and overtemperature protection, and operates in Normal and Power-save modes. It is used in body control modules, powertrain gateways, and chassis domain controllers requiring robust ESD immunity (IEC61000-4-2 Level 4) and low electromagnetic emission.

For engineers reviewing the TLE7250VSJXUMA1 datasheet, TLE7250VSJXUMA1 pinout, TLE7250VSJXUMA1 application, or TLE7250VSJXUMA1 equivalent, key selection criteria include guaranteed loop delay symmetry for CAN FD timing integrity, bus leakage current < 1 µA in power-down state, VIO voltage adaptation capability, and AEC-Q100 qualification for automotive deployment.

Technical Context

The TLE7250VSJXUMA1 implements a differential transmitter/receiver pair with symmetrical slew-rate control on CANH and CANL outputs to minimize timing skew and support CAN FD frame integrity at 2 MBit/s. Its internal mode controller enables seamless transition between Normal and Power-save modes via the NEN pin, with VCC supply disconnect capability during sleep to reduce system standby current.

It integrates fail-safe functions including short-circuit protection to battery, ground, and VCC; unconnected logic pin detection; and thermal shutdown at Tj > 165 °C. The receiver includes a normal-mode threshold comparator referenced to VCC/2, ensuring stable dominant/recessive discrimination across temperature and supply variation.

Key Specifications

Parameter	Value and Actual Design Meaning
Bus Data Rate	Up to 2 MBit/s - enables full CAN FD high-speed phase operation without signal distortion.
VCC Supply Range	4.5 V to 27 V - supports direct connection to automotive battery rail with transient tolerance.
VIO Supply Range	3.0 V to 5.5 V - allows level-shifting compatibility with 3.3 V or 5 V microcontrollers.
Common-Mode Range	−2 V to 14 V - ensures reliable operation under severe automotive EMI conditions and bus fault scenarios.
Bus Leakage Current (Power-down)	< 1 µA - preserves bus termination integrity and minimizes network wake-up current in sleep mode.
ESD Robustness (IEC61000-4-2)	±8 kV contact, ±15 kV air - eliminates need for external TVS diodes in most vehicle architectures.
Thermal Shutdown Threshold	165 °C junction temperature - prevents latch-up and permanent damage during overload or poor heatsinking.

Pinout & Package

Package: PG-DSO-8 (RoHS-compliant, halogen-free, exposed pad for thermal dissipation).

Pin/Terminal	Circuit Role	Design Meaning
1 TxD	Transmit Data Input	CMOS-compatible input with internal pull-up to VIO; "low" asserts dominant bus state.
2 GND	Ground Reference	Analog/digital common return; must be low-inductance connection to PCB ground plane.
3 VCC	Transmitter Supply	High-side power for CAN driver stage; can be switched off in Power-save mode to cut bus bias current.
4 RxD	Receive Data Output	CMOS output referenced to VIO; "low" indicates dominant bus state at receiver.
5 VIO	Digital Supply Input	Sets logic thresholds and I/O voltage levels; decoupled with 100 nF capacitor to GND.
6 CANL	CAN Bus Low Terminal	Differential bus node; sinks current during dominant state; requires 120 Ω termination at network ends.
7 CANH	CAN Bus High Terminal	Differential bus node; sources current during dominant state; paired with CANL for differential signaling.
8 NEN	Not Enable Input	Active-low enable; internal pull-up to VIO; "low" activates Normal mode, "high" forces Power-save mode.

Key Features

Feature	Design Value
Loop Delay Symmetry	Guaranteed t_Loop(H,L) ≈ t_Loop(L,H) - ensures precise bit timing alignment critical for CAN FD 2 MBit/s frames.
Power-Save Mode Control	VCC disconnect + low-leakage bus hold - reduces quiescent current to < 10 µA while preserving bus biasing integrity.
Short-Circuit Protection	Self-resetting protection against CANH/CANL short to battery, ground, or VCC - avoids fuse reliance and enables fault recovery.
VIO Voltage Adaptation	Independent digital I/O supply - eliminates level-shifters when interfacing 3.3 V MCUs with 5 V tolerant CAN peripherals.
AEC-Q100 Qualification	Grade 1 (−40 °C to +125 °C ambient) - validated for under-hood and safety-critical automotive domains.

Applications

Body Control Module (BCM)

Powertrain Gateway

Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators via HS CAN backbone.

IC Role / Device Role / Timing Role: Physical layer transceiver translating MCU CAN controller signals to differential bus voltages with sub-50 ns loop delay symmetry.

Use Value: Enables deterministic message delivery across 10+ nodes at 500 kBit/s while maintaining < 1 µA bus leakage during ignition-off sleep.

Use Scenario: Aggregation and routing of engine, transmission, and emissions data between powertrain ECUs and vehicle network backbone.

IC Role / Device Role / Timing Role: High-immunity CAN interface supporting 2 MBit/s CAN FD bursts for calibration and diagnostics.

Use Value: Delivers ±8 kV ESD robustness and −2 V to 14 V common-mode range to survive alternator load dump and cranking transients.

Chassis Domain Controller

Advanced Driver Assistance System (ADAS) Sensor Hub

Use Scenario: Real-time coordination of ABS, ESC, and steering angle sensors across distributed chassis nodes.

IC Role / Device Role / Timing Role: Fault-tolerant transceiver with TxD time-out and overtemperature shutdown for functional safety compliance.

Use Value: Prevents bus lock-up due to MCU firmware hang via automatic dominant-state timeout and thermal derating.

Use Scenario: Interfacing radar, camera, and ultrasonic sensors to central ADAS ECU via isolated HS CAN subnetwork.

IC Role / Device Role / Timing Role: Low-EME transceiver minimizing RF interference with adjacent 77 GHz radar bands.

Use Value: Achieves < −60 dBµV/m radiated emission at 100 MHz per CISPR 25 Class 5, eliminating shielding overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed CAN transceiver applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
NXP TJA1042T/3	Includes wake-up capability via WAKE pin; slightly higher VCC quiescent current (35 µA vs. 10 µA in PS mode); identical ISO 11898-2 compliance and 2 MBit/s support.	Required where network-level wake-on-CAN is mandated (e.g., remote keyless entry systems).	Select if wake-up functionality is needed; otherwise TLE7250VSJXUMA1 offers lower sleep current and superior ESD rating (±15 kV air vs. ±8 kV).
ST TJA1057G	No VIO pin - fixed 3.3 V logic interface; lacks TxD time-out function; same thermal shutdown threshold and package footprint.	Suitable only for 3.3 V-only MCU designs without need for dominant-state timeout safety.	Choose only when VIO flexibility and fail-safe TxD monitoring are not required; TLE7250VSJXUMA1 provides broader supply adaptability and enhanced functional safety features.

Compared with TJA1042T/3 and TJA1057G, the TLE7250VSJXUMA1 delivers the lowest power-down current, highest ESD immunity, and unique VIO voltage adaptation-making it optimal for mixed-supply automotive domains where MCU voltage scaling and ultra-low standby power are design priorities.

Availability

TLE7250VSJXUMA1 is available at Aetrix Electronics and suitable for body control modules, powertrain gateways, and chassis domain controllers requiring stable component supply across automotive production lifecycles.

Supply support for TLE7250VSJXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and AEC-Q100 validation infrastructure.

The TLE7250V series belongs to Infineon's Smart Power Technology (SPT) automotive transceiver portfolio, engineered specifically for high-reliability HS CAN communication in harsh environments including engine compartments and chassis systems.

FAQ

What is the maximum operating temperature for TLE7250VSJXUMA1?

The TLE7250VSJXUMA1 is qualified per AEC-Q100 Grade 1, with an ambient operating temperature range of −40 °C to +125 °C. Its thermal shutdown triggers at 165 °C junction temperature, providing margin for PCB-level thermal design. Derating curves in the datasheet specify maximum power dissipation versus ambient temperature and copper area.

Does TLE7250VSJXUMA1 support CAN FD?

Yes - the TLE7250VSJXUMA1 supports CAN FD physical layer operation up to 2 MBit/s due to guaranteed loop delay symmetry (t_Loop(H,L) ≈ t_Loop(L,H)) and optimized slew rates on CANH/CANL. It meets ISO 11898-2:2016 requirements for FD timing integrity but does not include protocol-layer arbitration or bit-rate switching logic - those reside in the MCU's CAN controller.

Can VIO and VCC be powered from the same supply rail?

Yes - VIO (3.0–5.5 V) and VCC (4.5–27 V) may share a 5 V rail if the MCU and transceiver operate at compatible logic levels. However, VCC must remain ≥ VIO + 0.5 V to ensure proper driver stage biasing. When using a shared 5 V supply, decoupling capacitors (100 nF each) must be placed independently at both pins per datasheet layout guidelines.

Is the exposed pad on PG-DSO-8 electrically connected?

Yes - the exposed thermal pad on the PG-DSO-8 package is internally connected to GND and must be soldered to a dedicated PCB ground plane for thermal and EMI performance. It is not isolated; connecting it to any potential other than GND violates the datasheet specification and risks malfunction or damage.

TLE7250VSJXUMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: 8-SOIC (0.154", 3.90mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Last Time Buy

Type:: Transceiver

Protocol:: CANbus

Number of Drivers/Receivers:: 1/1

Duplex:: -

Receiver Hysteresis:: 200 mV

Data Rate:: 2Mbps

Voltage - Supply:: 4.5V ~ 5.5V

Operating Temperature:: -40°C ~ 150°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-DSO-8

TLE7250VSJXUMA1 FAQ

1.How can I place an order for TLE7250VSJXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TLE7250VSJXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLE7250VSJXUMA1 reliable?

The price and inventory of TLE7250VSJXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE7250VSJXUMA1 is usually 5 days.

3.What payment methods are accepted for TLE7250VSJXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE7250VSJXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLE7250VSJXUMA1?

TLE7250VSJXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLE7250VSJXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLE7250VSJXUMA1?

For technical support, including TLE7250VSJXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE7250VSJXUMA1 requirements.

6.How does Aetrix verify that TLE7250VSJXUMA1 is sourced from the original manufacturer or authorized distributors?

All TLE7250VSJXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE7250VSJXUMA1 meets industry standards.

7.What is the process for return or replacement of TLE7250VSJXUMA1?

All TLE7250VSJXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE7250VSJXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLE7250VSJXUMA1 part is unused and in its original packaging.

Return procedure for TLE7250VSJXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …