Infineon Technologies TLE7250XSJXUMA1

Overview

TLE7250XSJXUMA1 from Infineon Technologies is a high-speed CAN transceiver compliant with ISO 11898-2, serving as the physical layer interface between CAN protocol controllers and automotive HS CAN buses. It supports data rates up to 2 MBit/s, features VIO voltage adaptation (2.5–5.5 V), operates across VCC = 4.5–5.5 V, and delivers <1 µA bus leakage in power-down mode. It is deployed in body control modules, powertrain gateways, and chassis domain controllers requiring robust ESD immunity and fail-safe operation.

For engineers reviewing the TLE7250XSJXUMA1 datasheet, TLE7250XSJXUMA1 pinout, TLE7250XSJXUMA1 application, or TLE7250XSJXUMA1 equivalent, key selection criteria include guaranteed loop delay symmetry for CAN FD timing integrity, receive-only mode enablement via RM pin, short-circuit protection on CANH/CANL, and AEC-Q100 qualification for under-hood deployment.

Technical Context

The TLE7250XSJXUMA1 implements a differential driver/receiver pair with symmetrical slew-rate control on CANH and CANL outputs to minimize electromagnetic emission (EME) and ensure precise loop delay matching (<50 ns skew). Its dual-supply architecture separates digital logic (VIO) from bus driver (VCC), enabling interoperability with mixed-voltage microcontrollers.

It supports three operational states: Normal mode (full transmit/receive), Receive-only mode (TxD disabled, RM = low), and Power-down (high-impedance bus, <1 µA leakage). Fail-safe functions include TxD time-out (prevents bus lock-up), overtemperature shutdown (>150 °C), and undervoltage detection on both VCC and VIO rails.

Key Specifications

Pinout & Package

Package: PG-DSO-8 (RoHS-compliant, halogen-free, exposed thermal pad for PCB heat sinking).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed CAN transceiver applications.

Compared with MAX3051ESA+ and TJA1042TK/3, the TLE7250XSJXUMA1 uniquely combines CAN FD-ready loop delay symmetry, sub-µA power-down leakage, and AEC-Q100 Grade 1 qualification-making it the only choice for automotive domain controllers requiring simultaneous high-speed determinism and ultra-low sleep power.

Availability

TLE7250XSJXUMA1 is available at Aetrix Electronics and suitable for body control modules, powertrain gateways, and chassis domain controllers requiring stable component supply across automotive production lifecycles.

Supply support for TLE7250XSJXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and AEC-Q100 validation infrastructure.

The TLE7250X series belongs to Infineon's automotive Smart Power Technology (SPT) portfolio, engineered specifically for harsh-environment CAN physical layer interfaces in engine, chassis, and body electronics.

FAQ

Is TLE7250XSJXUMA1 pin-compatible with TLE7250XLE?

Yes - both share identical pin assignment and function mapping across PG-DSO-8 (TLE7250XSJXUMA1) and PG-TSON-8 (TLE7250XLE) packages. Mechanical footprint differs, but electrical interface, timing, and registerless configuration are fully interchangeable. Thermal pad connection rules and decoupling requirements remain identical.

Does TLE7250XSJXUMA1 support CAN FD SIC (Signal Improvement Capability)?

No - it is a classical HS CAN transceiver compliant with ISO 11898-2, not ISO 11898-5. While its <50 ns loop delay symmetry and controlled slew rates enable reliable 2 MBit/s FD data phase operation, it lacks integrated SIC equalization or advanced filtering required for extended FD arbitration phases beyond 5 MBit/s.

What is the purpose of the exposed thermal pad (PAD) on the PG-DSO-8 package?

The exposed thermal pad is electrically connected to GND and serves as the primary thermal conduction path to the PCB. It must be soldered directly to a dedicated GND copper pour with ≥4 thermal vias (0.3 mm diameter) to an inner GND plane. Floating or unconnected pads cause junction temperature rise exceeding AEC-Q100 limits during sustained 2 MBit/s operation.

Can RM pin be left floating in normal operation?

No - RM has an internal pull-down resistor to GND, but leaving it floating risks noise-induced mode switching. For guaranteed Normal mode, RM must be actively driven low (≤0.4 V) or tied to GND via ≤10 kΩ resistor. Floating increases susceptibility to EMI-triggered false receive-only activation, disrupting bus arbitration.