My Inquiry
My Account
Infineon Technologies TLE72592GUXUMA1
- Part No.:
- TLE72592GUXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Drivers, Receivers, Transceivers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TLE72592GUXUMA1.pdf
- Description:
- IC TRANSCEIVER FULL 1/1 PGDSO816
- Quantity:
- Payment:
- Shipping:
Inventory:4,069
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLE72592GUXUMA1 from Infineon Technologies is an AEC-Q100 qualified LIN transceiver for automotive in-vehicle networks, functioning as the physical layer interface between microcontrollers and single-wire LIN buses. It supports data rates up to 10.4 kBaud, complies with LIN 1.3/2.0/2.1 and SAE J2602, operates from 5 V to 27 V supply, and draws <8 µA quiescent current in Sleep mode while retaining bus and local wake-up capability.
For engineers reviewing the TLE72592GUXUMA1 datasheet, TLE72592GUXUMA1 pinout, TLE72592GUXUMA1 application, or TLE72592GUXUMA1 equivalent, key selection criteria include LIN bus voltage tolerance (VBAT-compatible), dual logic-level I/O (3.3 V/5 V), integrated overtemperature and undervoltage protection, and master/slave node configurability via external termination.
Technical Context
The TLE72592GUXUMA1 implements a bipolar-CMOS-DMOS Smart Power Technology (SPT®) architecture enabling robust LIN physical layer signaling with programmable slew-rate control (Low Slope and Flash modes), integrated bus short-to-GND/VBAT protection, and precise dominant/recessive state translation per LIN 2.1 specification. Its receiver includes noise-filtering circuitry to meet >200 V/µs EMI immunity requirements.
Mode control is managed via EN pin (active-high enable) and monitored by INH output (VS-referenced), allowing coordinated power sequencing with external regulators and bus termination. Wake-up detection occurs on both LIN bus activity (dominant edge) and dedicated WK pin (negative-edge triggered), with RxD indicating wake source via logic level.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 5 V to 27 V - supports 12 V and 24 V automotive battery nets without external regulation |
| Max Data Rate | 10.4 kBaud - meets full LIN 2.1 timing budget including propagation delay and sampling margin |
| Sleep Current | <8 µA - enables compliance with ISO 11898-4 low-power network standby requirements |
| ESD Robustness | ±8 kV HBM - exceeds IEC61000-4-2 Level 4 for direct discharge into BUS/RxD/TxD pins |
| Logic Compatibility | 3.3 V and 5 V I/O - interfaces directly with mixed-voltage MCU domains without level shifters |
| Bus Fault Protection | Short-to-GND and short-to-VBAT - prevents latch-up and enables fail-safe operation during wiring faults |
| Thermal Shutdown | 160 °C activation - protects against thermal runaway in enclosed junction box environments |
Pinout & Package
Package: PG-DSO-8 (RoHS-compliant, surface-mount, 8-pin SOIC with exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RxD | Receiver Data Output | Active-low LIN bus signal replica; requires external pull-up to MCU VIO for wake indication and recessive-state logic high |
| EN | Enable Input | Active-high digital control; internal pull-down ensures default sleep mode at power-up |
| WK | Local Wake Input | Active-low, negative-edge triggered; internal pull-up enables wake from MCU GPIO without external components |
| TxD | Transmit Data Input | Active-low input; dominant state driven by strong internal pull-down (>1.5 mA) after WK wake, weak pull-down (350 kΩ) after bus wake |
| GND | Ground Reference | Primary return path for all analog and digital circuitry; connects to system chassis ground |
| BUS | LIN Bus Interface | Single-wire bidirectional I/O with integrated termination; drives dominant (GND) or recessive (VS) states per LIN spec |
| VS | Battery Supply Input | Direct connection to vehicle battery rail; powers internal regulator and output stage; supports load dump transients |
| INH | Inhibit Output | VS-referenced open-drain output; controls external LDO or master termination resistor; active-high in Normal/Standby |
Key Features
| Feature | Design Value |
|---|---|
| Low-Slope & Flash Mode Selection | Configurable slew rate reduces electromagnetic emission (EME) across 150 kHz–108 MHz band without compromising timing integrity |
| Integrated Bus Short Protection | Automatically limits current and disables driver during BUS-to-GND or BUS-to-VBAT faults, preventing damage and system reset |
| Dual-Voltage Logic Interface | 3.3 V/5 V compatible RxD/TxD pins eliminate need for external level translators in mixed-signal automotive ECUs |
| Wake Source Discrimination | RxD logic level indicates wake origin (bus vs. WK pin), enabling MCU firmware to execute appropriate recovery sequence |
| AEC-Q100 Qualified | Qualified to Grade 1 (-40 °C to +125 °C ambient), validated for 1000+ thermal cycles and 1000 h HTOL stress |
Applications
| Body Control Module (BCM) | Seat Position Memory System |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting via LIN subnetwork. IC Role / Device Role / Timing Role: Physical layer transceiver interfacing 8-bit MCU to LIN bus; handles dominant/recessive bit timing per SAE J2602. Use Value: Ultra-low sleep current (<8 µA) extends battery life during vehicle off-state; bus short protection prevents module failure due to wiring harness faults. |
Use Scenario: LIN-connected seat ECU stores and recalls driver position settings using potentiometer feedback and motor control. IC Role / Device Role / Timing Role: Bidirectional LIN interface translating MCU UART frames to physical bus signals with ±10% baud tolerance. Use Value: 3.3 V/5 V I/O compatibility allows direct connection to legacy 5 V MCUs and newer low-voltage sensors; ESD robustness ensures reliability in high-friction cabin environments. |
| Climate Control Actuator | Steering Column Switch Interface |
Use Scenario: LIN slave node controlling HVAC blend door actuators, fan speed, and temperature sensor reporting. IC Role / Device Role / Timing Role: LIN transceiver providing galvanically isolated bus communication with master head unit; supports flash programming mode for firmware updates. Use Value: Low-slope mode minimizes conducted emissions near sensitive RF receivers (e.g., AM/FM radio); thermal shutdown prevents overheating in confined dash cavities. |
Use Scenario: LIN interface between multifunction steering wheel switches and body domain controller for cruise control, audio, and phone commands. IC Role / Device Role / Timing Role: High-immunity transceiver receiving switch status over long harness runs; filters EMI from adjacent 12 V power lines. Use Value: ±8 kV HBM ESD rating withstands repeated human contact discharge; local WK pin enables immediate response to button press without waiting for bus traffic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LIN transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLIN1029DRBR | Lower max supply (18 V), no INH output, integrated 1 kΩ bus termination, 5.5 V logic only | Targeted for compact 12 V-only nodes; lacks master-node control capability via INH | Select when board space is constrained and master termination is handled externally or not required |
| SN65HVDA100QDRQ1 | Higher data rate (20 kBaud), wider temp range (–40 °C to +150 °C), no sleep mode, 5 V logic only | Used in engine bay applications requiring extended temperature operation; consumes >100 µA in standby | Select for under-hood locations where thermal performance outweighs low-power requirements |
Compared with TLIN1029DRBR and SN65HVDA100QDRQ1, the TLE72592GUXUMA1 uniquely balances ultra-low sleep current, VS-referenced INH control for master node design, and dual-voltage logic-making it optimal for body electronics where power budget, wiring fault resilience, and mixed-voltage MCU integration are critical.
Availability
TLE72592GUXUMA1 is available at Aetrix Electronics and suitable for body control modules, seat memory systems, climate actuators, and steering column interfaces requiring stable component supply across automotive production lifecycles.
Supply support for TLE72592GUXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with core expertise in Smart Power Technology (SPT®) and AEC-Q100 qualification.
The TLE72592GUXUMA1 belongs to Infineon's automotive LIN transceiver product line, designed specifically for cost-sensitive, low-power, and high-reliability body electronics networks operating in harsh automotive environments.
FAQ
What LIN protocol versions does the TLE72592GUXUMA1 support?
The TLE72592GUXUMA1 fully complies with LIN specifications 1.3, 2.0, and 2.1, as well as SAE J2602-2. It supports all mandatory electrical characteristics-including dominant/recessive voltage thresholds, slew rate limits, and timing tolerances-across the 2.4–10.4 kBaud range defined in these standards.
How does the INH pin function in master node configuration?
The INH pin is a VS-referenced open-drain output that goes HIGH in Normal and Stand-By modes. In master node designs, it drives an external 1 kΩ pull-up resistor to VS or controls an active bus termination circuit, enabling automatic activation of master-side termination only when the transceiver is operational.
Can the TLE72592GUXUMA1 operate with a 3.3 V microcontroller without level shifting?
Yes-the TLE72592GUXUMA1's RxD and TxD pins are explicitly rated for 3.3 V and 5 V logic levels. The RxD output swings rail-to-rail between GND and the MCU's VIO supply, and TxD accepts direct 3.3 V CMOS inputs, eliminating external level translators in mixed-voltage systems.
What happens during a BUS short-to-GND event?
Upon detecting BUS short-to-GND, the TLE72592GUXUMA1 immediately disables its output stage, limits sink current to <100 mA, and maintains functional integrity of the receiver and control logic. The device remains operational and resumes normal bus communication once the fault clears, with no latch-up or reset required.
TLE72592GUXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Type:
- Transceiver
- Protocol:
- LINbus
- Number of Drivers/Receivers:
- 1/1
- Duplex:
- Full
- Receiver Hysteresis:
- 300 mV
- Data Rate:
- 10.4KBd
- Voltage - Supply:
- 7V ~ 27V
- Operating Temperature:
- -40°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-8-16
TLE72592GUXUMA1 FAQ
1.How can I place an order for TLE72592GUXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE72592GUXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE72592GUXUMA1 reliable?
The price and inventory of TLE72592GUXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE72592GUXUMA1 is usually 5 days.
3.What payment methods are accepted for TLE72592GUXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE72592GUXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE72592GUXUMA1?
TLE72592GUXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE72592GUXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE72592GUXUMA1?
For technical support, including TLE72592GUXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE72592GUXUMA1 requirements.
6.How does Aetrix verify that TLE72592GUXUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE72592GUXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE72592GUXUMA1 meets industry standards.
7.What is the process for return or replacement of TLE72592GUXUMA1?
All TLE72592GUXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE72592GUXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE72592GUXUMA1 part is unused and in its original packaging.
Return procedure for TLE72592GUXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLE72592GUXUMA1 Tags
-
ATA6561-GAQW-N
Microchip Technology
-
ATA6561-GBQW-N
Microchip Technology
-
AM26LS32ACDR
Texas Instruments
-
SP485CN-L/TR
MaxLinear, Inc.
-
SP485EN-L/TR
MaxLinear, Inc.
-
SP485EEN-L/TR
MaxLinear, Inc.
-
SP485ECN-L/TR
MaxLinear, Inc.
-
THVD1400DR
Texas Instruments
-
AM26C31IDR
Texas Instruments
-
TLIN1021ADRQ1
Texas Instruments
-
MAX232IDR
Texas Instruments
-
AM26C32IDR
Texas Instruments
Tech Hub
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
