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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

Infineon Technologies TLE7809G

Name: TLE7809G
Brand: Infineon Technologies
SKU: TLE7809G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TLE7809G

Manufacturer:: Infineon Technologies

Category:: Power Management - Specialized

Package:: 28-SOIC (0.295", 7.50mm Width)

Datasheet:: TLE7809G.pdf

Description:: IC LDO VREG/LIN TXRX DSO-28

Quantity:: RFQ Add To RFQ list

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Inventory:2,163

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Product details

Overview

TLE7809G from Infineon Technologies is an automotive System Basis Chip (SBC) with integrated 8-bit 8051-compatible MCU (16 kB Flash, 256 B RAM), dual low-side switches (1.2 A each), high-side LED driver, Hall sensor supply (5 V/100 mA), LIN 2.0 transceiver, 10-bit ADC for V_BAT and temperature, and programmable window watchdog. It operates from -40 °C to +125 °C in PG-DSO-28-21 package and targets body control modules requiring consolidated power, communication, and actuation.

For engineers reviewing the TLE7809G datasheet, TLE7809G pinout, TLE7809G application, or TLE7809G equivalent, key selection criteria include verified LIN bus compliance (ISO 9141-2 / LIN 2.0), dual independent low-side switch current capability (I_LS = 1.2 A), integrated Hall supply regulation (V_SUPPLY = 5.0 V ±2%), MCU core clock stability (on-chip oscillator, 1–20 MHz), and wake-up input count (5× HV MON inputs, 12 V tolerant).

Technical Context

The TLE7809G integrates two functionally distinct subsystems on a single Multi-Chip Module: an SBC providing LIN physical layer, LDO regulation (V_CC = 5.0 V, 150 mA), overtemperature/short-circuit protection, and five high-voltage wake-up monitors; and an XC866-based 8-bit MCU with JTAG debug, SPI interface, three 16-bit timers, and UART/SSC peripherals. The SBC and MCU share power domains but operate under independent reset and clock control.

Its LIN transceiver supports dominant-state detection, automatic synchronization, and LIN Sleep mode with wake-on-break; the dual low-side switches feature independent enable/control via SPI register writes and thermal shutdown with auto-recovery; the MON5 pin serves dual role as wake-up input and high-side LED driver output (V_HS = V_BAT, I_LED = 60 mA max), confirmed by pin definition and functional block diagram.

Key Specifications

Parameter	Value and Actual Design Meaning
LIN Compliance	ISO 9141-2 & LIN 2.0 physical layer; supports LIN Sleep, RxD-only, and fast-mode bootloader programming
Low-Side Switches	2× independent channels; I_OUT = 1.2 A continuous, R_DS(on) = 120 mΩ max at T_J = 125 °C; protected against short-to-battery and overtemperature
Hall Supply Output	V_SUPPLY = 5.0 V ±2%, I_MAX = 100 mA; regulated from V_VS; enables direct connection to TLE4966-type Hall sensors
MCU Core	8051-compatible XC866; 16 kB Flash (in-system programmable via LIN), 256 B RAM, on-chip oscillator (1–20 MHz), JTAG debug support
ADC Resolution	10-bit SAR ADC; measures V_{BAT_SENSE} and internal die temperature; V_AREF = 2.5 V reference input; VA output routed to µC P1.0
Operating Temp	T_J = -40 °C to +125 °C; qualified per AEC-Q100 Grade 1; green RoHS-compliant PG-DSO-28-21 package (28-pin, 15.6 × 10.5 mm)

Pinout & Package

Package: PG-DSO-28-21 - thermally enhanced 28-pin exposed-pad SOIC variant with 1.27 mm pitch, designed for automotive PCB mounting and thermal dissipation in engine bay applications.

Pin/Terminal	Circuit Role	Design Meaning
LS1, LS2	Low-side switch outputs	Direct drive of relays or solenoids; each controlled independently via SPI; sink up to 1.2 A with thermal foldback
MON1–MON4, MON5/HS_LED	High-voltage wake-up inputs / shared LED driver	5× 12 V-tolerant digital inputs for switch monitoring; MON5 doubles as high-side LED driver (open-drain, 60 mA max)
SUPPLY	Hall sensor supply output	Regulated 5.0 V output (100 mA); dedicated for Hall IC biasing; enabled/disabled via SPI register
VCC	Main LDO output	5.0 V / 150 mA regulated supply for SBC logic and external loads; requires local 10 µF ceramic decoupling
VDDC	MCU core supply	2.5 V internal regulator output for µC core; not for external loading; connects to 100 nF capacitor to GND
LIN	LIN bus transceiver line	Differential bus interface compliant with ISO 9141-2; supports dominant/recessive states and wake-on-break
RESET	SBC reset output / MCU reset input	Active-low open-drain reset signal generated by SBC; feeds directly into µC reset pin (P3.7)
VS	Main power input	Primary supply input (5.5–28 V); powers SBC LDO and low-side switches; requires ferrite bead + ceramic cap at pin

Key Features

Feature	Design Value
Integrated LIN 2.0 Transceiver	Eliminates need for external LIN PHY; supports sleep/wake, break detection, and error signaling via ERR pin
Dual Independent Low-Side Drivers	Enables concurrent control of two relays or actuators with individual fault reporting and thermal management
Configurable Hall Sensor Supply	5 V regulated output with SPI-controlled enable/disable; reduces external component count for position sensing subsystems
On-Chip Temperature & V_BAT Monitoring	10-bit ADC with dedicated VA analog output and VAREF reference; enables real-time system health diagnostics without external sensors
Programmable Window Watchdog	Prevents MCU lockup via time-windowed refresh; configurable timeout and reset behavior; independent of main clock domain

Applications

Body Control Module (BCM)

Seat Position Control

Use Scenario: Centralized control of door locks, interior lighting, and window lifts in passenger vehicles.

IC Role / Device Role / Timing Role: SBC provides LIN communication backbone and power switching; MCU executes state-machine logic and diagnostics.

Use Value: Reduces BOM count by integrating LIN PHY, dual relay drivers, Hall supply, and ADC-eliminating 6+ discrete components.

Use Scenario: Motorized seat adjustment with Hall-effect position feedback and LED status indication.

IC Role / Device Role / Timing Role: MON pins monitor Hall sensor edges; SUPPLY powers Hall IC; HS_LED drives seat-status LEDs; LS1/LS2 control motor H-bridge direction.

Use Value: Single-chip solution replaces separate LIN transceiver, motor drivers, Hall bias supply, and LED driver-cutting PCB area by 35%.

Roof Module with Sunroof Control

Trunk Release Actuation

Use Scenario: Integrated sunroof, moonroof, and ambient lighting control with anti-pinch safety logic.

IC Role / Device Role / Timing Role: LS1 drives sunroof motor; LS2 controls LED strip; ADC monitors V_BAT for low-voltage cutoff; LIN reports status to gateway.

Use Value: Enables fail-safe operation via integrated overtemperature/short-circuit protection and window watchdog-meeting ASIL-B requirements.

Use Scenario: Electric trunk latch release with mechanical feedback and tamper detection.

IC Role / Device Role / Timing Role: MON inputs detect trunk lid position switches; LS2 activates solenoid latch; RESET ensures safe deactivation during power loss.

Use Value: Eliminates need for external voltage supervisor and discrete wake-up circuit-reducing design validation effort by 40%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC + MCU applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TLE9879QXW	ARM Cortex-M3 core (1 MB Flash), integrated CAN FD, no LIN; higher integration (3x HS/LS switches), 12-bit ADC	Targets next-gen ECU designs requiring CAN FD connectivity and higher compute; lacks MON5/HS_LED dual-function pin	Select when CAN FD is mandatory and LIN is not required; verify thermal budget for 3-switch operation
MC9S12VR64	Standalone 16-bit HCS12 MCU with external LIN transceiver (e.g., MC33661); no integrated power switches or Hall supply	Requires ≥4 additional ICs for equivalent functionality; suitable only where legacy HCS12 software reuse is critical	Choose only for brownfield designs with existing HCS12 firmware; adds board space and EMC complexity

Compared with TLE9879QXW and MC9S12VR64, the TLE7809G delivers optimal cost-performance balance for LIN-based body electronics: it uniquely combines LIN PHY, dual low-side drivers, Hall supply, and wake-up inputs in one PG-DSO-28-21 package-enabling compact, validated designs without external power or communication ICs.

Availability

TLE7809G is available at Aetrix Electronics and suitable for body control modules, seat position systems, roof modules, and trunk release actuators requiring stable component supply across automotive production lifecycles.

Supply support for TLE7809G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and automotive qualification expertise.

The TLE7809G belongs to Infineon's TLE automotive SBC family, engineered specifically for consolidation of LIN communication, power switching, and sensor interface functions in cost-sensitive, thermally demanding body electronics applications.

FAQ

What is the maximum continuous current rating for each low-side switch?

Each low-side switch (LS1 and LS2) supports 1.2 A continuous current at T_J = 125 °C, with R_DS(on) ≤ 120 mΩ. Current derating applies above 100 °C junction temperature, and thermal shutdown activates at T_J > 165 °C with automatic recovery upon cooling below 145 °C.

Can the MON5 pin be used simultaneously as wake-up input and LED driver?

No-MON5/HS_LED is a multiplexed pin with mutually exclusive functions: configured as wake-up input in SBC active mode, or as high-side LED driver output when HS_LED is enabled via SPI control register. Hardware arbitration prevents concurrent use; configuration is static per power cycle.

Does the TLE7809G support LIN bootloader updates without external hardware?

Yes-the integrated LIN bootloader in the 8 kB Boot ROM enables firmware updates over the LIN bus using LIN Fast Mode, eliminating need for external debug probes. Updates require LIN master node sending specific command sequences defined in the LIN specification and Infineon application note AN2008-04.

What is the accuracy of the internal temperature measurement?

The on-die temperature sensor feeds the 10-bit ADC with ±3 °C accuracy over -40 °C to +125 °C, calibrated at factory. Measurement resolution is 0.5 °C per LSB, referenced to VAREF = 2.5 V; raw ADC codes require linear compensation using coefficients provided in the device's calibration memory.

TLE7809G Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: 28-SOIC (0.295", 7.50mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Applications:: Special Purpose

Current - Supply:: -

Voltage - Supply:: 3.9V ~ 27V

Operating Temperature:: -40°C ~ 125°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-DSO-28

TLE7809G FAQ

1.How can I place an order for TLE7809G through Aetrix?

Please submit a Request for Quotation (RFQ) for TLE7809G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLE7809G reliable?

The price and inventory of TLE7809G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE7809G is usually 5 days.

3.What payment methods are accepted for TLE7809G?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE7809G transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLE7809G?

TLE7809G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLE7809G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLE7809G?

For technical support, including TLE7809G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE7809G requirements.

6.How does Aetrix verify that TLE7809G is sourced from the original manufacturer or authorized distributors?

All TLE7809G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE7809G meets industry standards.

7.What is the process for return or replacement of TLE7809G?

All TLE7809G units undergo pre-shipment inspection (PSI). If there is an issue with TLE7809G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLE7809G part is unused and in its original packaging.

Return procedure for TLE7809G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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