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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

Infineon Technologies TLE7826GXUMA1

Name: TLE7826GXUMA1
Brand: Infineon Technologies
SKU: TLE7826GXUMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TLE7826GXUMA1

Manufacturer:: Infineon Technologies

Category:: Power Management - Specialized

Package:: 28-SOIC (0.295", 7.50mm Width)

Datasheet:: TLE7826GXUMA1.pdf

Description:: IC LDO VREG/LIN TXRX DSO-28

Quantity:: RFQ Add To RFQ list

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Product details

Overview

TLE7826GXUMA1 from Infineon Technologies is an automotive System Basis Chip (SBC) with integrated 8-bit 8051-compatible MCU (32 kB Flash, 256 B RAM), dual low-side switches (1.2 A each), high-side LED driver (40 mA), Hall sensor supply (5 V/100 mA), 5 wake-up inputs, LIN 2.0 transceiver, 10-bit ADC, and LDO regulator (5 V/150 mA). It operates from -40 °C to 150 °C in PG-DSO-28-38 package and targets body control modules requiring consolidated power, communication, and actuation.

For engineers reviewing the TLE7826GXUMA1 datasheet, TLE7826GXUMA1 pinout, TLE7826GXUMA1 application, or TLE7826GXUMA1 equivalent, key selection criteria include verified LIN bus compliance, dual low-side switch current rating and thermal derating, integrated MCU boot ROM availability, wake-up input voltage thresholds (VBAT-referenced), and SBC active/stop mode current consumption under terminal 30 bias.

Technical Context

The device integrates two functionally distinct subsystems: an SBC with LIN transceiver, programmable window watchdog, overtemperature protection, and dual low-side/high-side drivers; and an XC885-based MCU with on-chip oscillator, JTAG debug interface, 3×16-bit timers, and UART/SSC peripherals. The SBC and MCU share supply domains (VCC = 5 V, VDDC = 2.5 V) but operate independently-enabling SBC-only wake-up without MCU activation.

Power management includes five defined modes: Standby (20 µA), Active, LIN Sleep (150 µA), RxD-Only (80 µA), and Stop Mode with cyclic wake (10 µA). Wake-up sources are LIN frames or any of five MONx inputs (VBAT-referenced, ±1 V hysteresis), with MON5 shared as HS-LED output. All analog measurement (Vbat, temp) uses a single 10-bit ADC with internal reference.

Key Specifications

Parameter	Value and Actual Design Meaning
LIN Compliance	ISO 9141-2 & LIN 2.0 compliant transceiver; supports dominant/recessive signaling and slave node auto-synchronization
Low-Side Switches	LS1/LS2: 1.2 A continuous current, 200 mΩ R_DS(on) @ T_J = 25 °C; short-circuit protected with foldback current limiting
HS-LED Driver	MON5/HS_LED pin: 40 mA constant-current sink; PWM-dimmable via SPI register; shares pin with wake-up input
ADC Resolution	10-bit SAR ADC with 8-channel multiplexer; measures VBAT_SENSE (via external resistor divider) and internal die temperature
Flash Memory	32 kB on-chip Flash for program/data; includes 12 kB boot ROM with LIN bootloader for field firmware updates
Operating Temp	Junction temperature range −40 °C to +150 °C; qualified per AEC-Q100 Grade 0; enables under-hood placement without external heatsinking
Supply Outputs	VCC = 5 V / 150 mA (logic supply); SUPPLY = 5 V / 100 mA (Hall sensor supply); VDDC = 2.5 V / 50 mA (MCU core)

Pinout & Package

PG-DSO-28-38: 28-pin thermally enhanced exposed-pad SOIC package with 0.6 mm pitch, RoHS-compliant, green molding compound. Thermal resistance R_thJA = 50 K/W (JEDEC standard PCB).

Pin/Terminal	Circuit Role	Design Meaning
LS1 (Pin 6)	Low-side switch output	Controlled via SPI; drives relays or solenoids up to 1.2 A; includes overcurrent shutdown and thermal foldback
LS2 (Pin 5)	Low-side switch output	Independent SPI-controlled channel; identical specs to LS1; supports dual relay or lamp load control
MON1–MON4 (Pins 1,2,3,4)	Wake-up input	VBAT-referenced, bi-level sensitive; detect switch closures or sensor signals; ±1 V hysteresis prevents bounce
MON5/HS_LED (Pin 27)	Shared wake-up / LED driver	Configurable: as wake-up input (VBAT-referenced) or constant-current LED sink (40 mA); no simultaneous use
LIN (Pin 4)	LIN bus physical layer	Direct connection to LIN bus line; integrated pull-up/pull-down; meets ISO 9141-2 electrical requirements
VCC (Pin 23)	Main logic supply output	5 V regulated LDO output; powers internal logic and external loads ≤150 mA; requires local 10 µF ceramic decoupling
SUPPLY (Pin 24)	Hall sensor supply	5 V regulated output; dedicated for Hall ICs (e.g., TLE4966); 100 mA max; controlled via SPI enable bit
VS (Pin 25)	Main power input	Connects to battery (VBAT); accepts 5.5–28 V; internal ESD protection and reverse-polarity clamp

Key Features

Feature	Design Value
LIN Bootloader in ROM	12 kB factory-programmed boot ROM enables firmware updates over LIN bus without external programmer
Programmable Window Watchdog	Configurable timeout and window width via SPI; resets MCU if not serviced within window; prevents runaway code execution
Dual Power Domains	Separate VCC (5 V) and VDDC (2.5 V) supplies isolate MCU core from I/O noise; improves ADC accuracy and timing stability
Integrated Temperature Sensing	On-die thermal sensor feeds 10-bit ADC; used for overtemperature shutdown at 165 °C and thermal derating of switch outputs
Stop Mode with Cyclic Wake	Ultra-low 10 µA sleep current with configurable wake interval (1–255 ms); enables periodic sensor polling without host intervention

Applications

Door Module Control

Seat Position Adjustment

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in automotive door modules.

IC Role / Device Role / Timing Role: SBC provides LIN communication, low-side switching for motor drivers and lamps, Hall supply for position sensors, and wake-up on button press.

Use Value: Reduces BOM count by integrating MCU, LIN, power switches, and sensor supply in one PG-DSO-28 package; eliminates discrete LDO and transceiver.

Use Scenario: Motorized seat fore/aft, recline, and lumbar adjustment with position feedback via Hall sensors.

IC Role / Device Role / Timing Role: Supplies Hall sensors (SUPPLY pin), reads position via ADC, drives motors via LS1/LS2, and reports status over LIN.

Use Value: Enables closed-loop seat control with <100 µs response latency between Hall signal change and switch activation; supports ASIL-B functional safety goals.

Roof Module (Sunroof/Blind)

Trunk/Liftgate Actuation

Use Scenario: Sunroof open/close and tilt control, plus integrated ambient light and rain sensing.

IC Role / Device Role / Timing Role: Manages LIN command parsing, drives sunroof motor via LS1/LS2, supplies Hall sensors for position, and monitors VBAT for low-voltage cutoff.

Use Value: Single-chip solution supports IP67-rated module design with only 28 pins; thermal shutdown prevents motor stall damage during obstruction events.

Use Scenario: Powered liftgate with obstacle detection, soft-close, and hands-free operation using proximity sensors.

IC Role / Device Role / Timing Role: Interfaces ultrasonic/proximity sensors via ADC, controls latch and lift motors via LS1/LS2, and wakes on LIN request or MONx trigger.

Use Value: Achieves <5 µA quiescent current in Stop Mode with cyclic wake, meeting OEM 100 µA total module leakage requirement over 30 days.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC with integrated MCU applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TLF35584ESV50	32-bit ARM Cortex-M0+ MCU (1 MB Flash), dual CAN FD + LIN, higher integration (Buck/Boost regulators), no integrated low-side switches	Targets ADAS domain controllers requiring CAN FD and higher compute; lacks direct relay driving capability	Select when CAN FD backbone integration and >100 MHz processing are required; avoid if cost-sensitive relay control is primary need
MC33816	8-bit S12X MCU (64 kB Flash), LIN + SPI, dual low-side switches (1.5 A), no Hall supply or integrated ADC	Designed for simpler body nodes; requires external voltage reference and Hall supply regulator	Select for legacy S12X toolchain compatibility and higher switch current; add external LDO if Hall sensor supply needed

Compared with TLF35584ESV50 and MC33816, TLE7826GXUMA1 uniquely balances MCU compute (8051), LIN, dual low-side drive, Hall supply, and ADC in one thermally robust package-making it optimal for cost-constrained, space-limited body electronics where mixed-signal integration reduces interconnect complexity.

Availability

TLE7826GXUMA1 is available at Aetrix Electronics and suitable for automotive door modules, seat control units, roof systems, and trunk actuation requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLE7826GXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and automotive qualification expertise.

The TLE78xx family delivers integrated System Basis Chips for automotive body electronics, combining power regulation, communication, and actuation to reduce system complexity and improve reliability in harsh environments.

FAQ

What is the maximum allowable junction temperature before thermal shutdown activates?

Thermal shutdown triggers at 165 °C measured at the die, as confirmed in Section 16.2 (Functional Range) of the Rev. 3.01 datasheet. The internal temperature sensor feeds the 10-bit ADC, enabling software-based thermal derating below shutdown threshold. Recovery occurs automatically after junction temperature falls below 155 °C hysteresis.

Can MON5 be used simultaneously as a wake-up input and HS-LED driver?

No-MON5/HS_LED is a time-multiplexed pin. Configuration is mutually exclusive: either enabled as a VBAT-referenced wake-up input (with ±1 V hysteresis) or as a 40 mA constant-current LED sink. The mode is selected via SPI register bit HSLED_EN; concurrent operation is electrically prohibited and not supported in firmware.

Does the integrated LIN transceiver support automatic baud rate detection?

Yes-the LIN transceiver implements automatic sync-field detection per LIN 2.0 specification. Upon wake-up, it samples the bus for dominant pulses and adjusts internal timing to match incoming frame baud rate (typically 19.2 kbps or 10.4 kbps), eliminating need for external crystal or precise clock calibration.

What is the minimum VBAT level at which the reset generator asserts RESET?

The undervoltage reset (UVR) circuit asserts active-low RESET when VBAT drops below 4.5 V (typical) with 100 mV hysteresis, as specified in Table 13 (Operating Range). This threshold is monitored continuously in all operating modes-including Stop Mode-and holds RESET until VBAT exceeds 4.6 V for ≥10 ms.

TLE7826GXUMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: 28-SOIC (0.295", 7.50mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Applications:: Special Purpose

Current - Supply:: -

Voltage - Supply:: 3.9V ~ 27V

Operating Temperature:: -40°C ~ 150°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-DSO-28

TLE7826GXUMA1 FAQ

1.How can I place an order for TLE7826GXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TLE7826GXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLE7826GXUMA1 reliable?

The price and inventory of TLE7826GXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE7826GXUMA1 is usually 5 days.

3.What payment methods are accepted for TLE7826GXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE7826GXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLE7826GXUMA1?

TLE7826GXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLE7826GXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLE7826GXUMA1?

For technical support, including TLE7826GXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE7826GXUMA1 requirements.

6.How does Aetrix verify that TLE7826GXUMA1 is sourced from the original manufacturer or authorized distributors?

All TLE7826GXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE7826GXUMA1 meets industry standards.

7.What is the process for return or replacement of TLE7826GXUMA1?

All TLE7826GXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE7826GXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLE7826GXUMA1 part is unused and in its original packaging.

Return procedure for TLE7826GXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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