Infineon Technologies TLE9254VSKXUMA1
- Part No.:
- TLE9254VSKXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Drivers, Receivers, Transceivers
- Package:
- 14-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TLE9254VSKXUMA1.pdf
- Description:
- IC TRANSCEIVER HALF 2/2 PGDSO14
- Quantity:
- Payment:

- Shipping:

Inventory:4,444
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLE9254VSKXUMA1 from Infineon is a dual-channel high-speed CAN FD transceiver compliant with ISO 11898-2:2016, supporting data rates up to 5 Mbit/s. It features bus wake-up pattern detection, VIO voltage adaptation (3.3 V/5 V), and stand-by mode with <10 µA quiescent current per channel. Used in automotive gateway modules and body control units for robust HS CAN communication under harsh EMI conditions.
For engineers reviewing the TLE9254VSKXUMA1 datasheet, TLE9254VSKXUMA1 pinout, TLE9254VSKXUMA1 application, or TLE9254VSKXUMA1 equivalent, key selection criteria include dual-channel CAN FD timing symmetry, ±40 V bus fault tolerance, ISO 7637 transient immunity, and stand-by wake-up behavior without external biasing.
Technical Context
The TLE9254VSKXUMA1 implements two independent HS CAN FD physical layer channels with matched transmitter delay symmetry (<5 ns) and receiver propagation delay matching (<10 ns), enabling reliable 5 Mbit/s data frame transmission. Each channel integrates dedicated STB control, internal pull-up on TxD/STB pins, and low-power wake-up logic that detects bus-level patterns while drawing <10 µA from VCC.
It supports dual-supply operation: VCC (4.5–6.0 V) powers transmitters and protection circuitry, while VIO (3.0–6.0 V) sets logic I/O levels for microcontroller interfacing. Fail-safe functions include TxD timeout, overtemperature shutdown (>150 °C), and short-circuit protection to battery, ground, and VCC on both CANH/CANL lines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CAN FD Data Rate | Up to 5 Mbit/s - enables high-bandwidth firmware updates and sensor fusion in modern ECUs. |
| Stand-by Quiescent Current | <10 µA per channel - allows always-on bus monitoring in vehicle sleep modes without battery drain. |
| Common-Mode Range | ±40 V - ensures robust operation during load-dump transients and ground offset in distributed automotive networks. |
| ESD Robustness (CANH/CANL) | ±10 kV HBM - eliminates need for external TVS diodes in most automotive PCB layouts. |
| VIO Supply Range | 3.0–6.0 V - supports direct interface to 3.3 V or 5 V microcontrollers without level shifters. |
| Bus Fault Protection | CANH/CANL short-circuit proof to battery, ground, and VCC - prevents latch-up and damage during wiring faults. |
| Wake-up Pattern Detection | Hardware-based bus wake-up logic - triggers RxD assertion without MCU intervention, reducing system latency. |
Pinout & Package
Package: PG-DSO-14 (lead-based, RoHS-compliant, halogen-free); thermal pad (PAD) must be connected to PCB ground plane for thermal management and EMI suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 TxD1 | Transmit input (Ch1) | CMOS input with internal VCC pull-up; dominant state = low; drives CANH1/CANL1 via differential transmitter. |
| 2 GND1 | Channel 1 ground reference | Mandatory connection to common PCB ground; must be tied to GND2 to avoid ground loop-induced EMI. |
| 3 VCC | Transmitter supply | 4.5–6.0 V supply; requires 100 nF decoupling capacitor to GND; can be disabled in stand-by mode. |
| 4 RxD1 | Receive output (Ch1) | CMOS output; dominant = low; asserts wake-up signal during bus activity in stand-by mode. |
| 5 GND2 | Channel 2 ground reference | Shared ground with GND1; ensures matched return paths for both CAN channels. |
| 6 TxD2 | Transmit input (Ch2) | Independent CMOS input with internal VCC pull-up; enables dual-bus topology (e.g., powertrain + body networks). |
| 7 RxD2 | Receive output (Ch2) | Active-low output synchronized to CANH2/CANL2; used for interrupt generation in multi-controller systems. |
| 8 STB2 | Stand-by control (Ch2) | High-active input; internal VCC pull-up; disables transmitter and reduces current to <10 µA when asserted. |
| 9 CANL2 | CAN bus low (Ch2) | Differential bus terminal; withstands ±40 V DC; short-circuit protected to battery/ground/VCC. |
| 10 CANH2 | CAN bus high (Ch2) | Differential bus terminal; matches CANL2 timing for <5 ns skew; optimized for EMC compliance. |
| 11 VIO | Digital I/O supply | Sets logic thresholds for TxD/RxD/STB pins; decoupled with 100 nF capacitor; independent of VCC. |
| 12 CANL1 | CAN bus low (Ch1) | Primary bus interface for gateway or BCM; supports SAE J1939 and J2284 protocols. |
| 13 CANH1 | CAN bus high (Ch1) | Paired with CANL1; high symmetry enables clean edge transitions at 5 Mbit/s. |
| 14 STB1 | Stand-by control (Ch1) | Independent channel enable/disable; allows asymmetric power management (e.g., Ch1 active, Ch2 stand-by). |
| PAD | Thermal pad | Must be soldered to GND plane; improves thermal resistance (RthJA ≈ 50 K/W) and reduces radiated emissions. |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent CAN FD channels | Enables simultaneous communication on two isolated HS CAN buses (e.g., powertrain + infotainment) with separate STB control. |
| Bus wake-up pattern detection | Hardware-accelerated wake-up logic triggers RxD assertion without MCU polling, reducing system wake latency to <150 µs. |
| VIO voltage adaptation | Supports 3.3 V or 5 V microcontrollers directly-no external level shifters required for TxD/RxD/STB signals. |
| No external common-mode choke needed | Ultra-low EME due to matched CANH/CANL rise/fall times (<5 ns skew) meets CISPR 25 Class 5 without added BOM cost. |
| AEC-Q100 qualified (Grade 1) | Rated for -40 °C to +125 °C ambient; validated for 15-year automotive service life under thermal cycling and humidity stress. |
Applications
| Gateway Module | Body Control Module (BCM) |
|---|---|
|
Use Scenario: Aggregating messages between powertrain, chassis, and infotainment CAN networks in modern vehicle architectures. IC Role / Device Role / Timing Role: Dual-channel HS CAN FD transceiver bridging isolated networks; provides galvanic isolation via bus-level signaling and precise timing symmetry. Use Value: Enables deterministic 5 Mbit/s data routing with <10 ns inter-channel skew, reducing gateway processing latency by >30% vs. single-channel solutions. |
Use Scenario: Managing door locks, lighting, HVAC, and window controls in centralized body electronics. IC Role / Device Role / Timing Role: Primary CAN interface for microcontroller; supports wake-on-CAN during vehicle sleep with <10 µA stand-by current per channel. Use Value: Eliminates need for external wake-up controllers or discrete biasing resistors, cutting BOM count by 3 components per module. |
| Electric Power Steering (EPS) | Battery Management System (BMS) |
|
Use Scenario: Real-time torque and position feedback between EPS ECU and motor driver over HS CAN. IC Role / Device Role / Timing Role: High-integrity CAN physical layer with ±40 V bus fault tolerance and overtemperature shutdown. Use Value: Maintains communication integrity during load-dump events (ISO 7637-2 Pulse 5a) without bus lockup or data corruption. |
Use Scenario: Cell voltage, temperature, and SOC reporting from battery pack to vehicle controller via isolated CAN. IC Role / Device Role / Timing Role: Robust CAN interface with ESD immunity (±10 kV HBM on CANH/CANL) for high-voltage battery environments. Use Value: Prevents field failures caused by ESD discharge during service operations, meeting ISO 11452-2 immunity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel CAN FD transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP TJA1044GT | Single-channel CAN FD transceiver; no dual-channel integration; lower ESD rating (±6 kV HBM on CANH/CANL). | Requires two devices for dual-bus use; lacks integrated wake-up pattern detection logic. | Select when only one CAN bus is needed and cost-per-channel is prioritized over integration. |
| ST TPD2S017 | USB port protector with CAN bus support; not a full CAN FD transceiver; no VIO adaptation or stand-by mode. | Designed for USB-C ESD protection, not automotive CAN networking; no AEC-Q100 qualification. | Not suitable as functional replacement; only applicable for USB interface protection in hybrid designs. |
Compared with TLE9254VSKXUMA1, the NXP TJA1044GT requires duplication for dual-bus use and lacks hardware wake-up logic, while the ST TPD2S017 is not a CAN transceiver at all-making TLE9254VSKXUMA1 the only qualified dual-channel, wake-capable, AEC-Q100-compliant solution in this form factor.
Availability
TLE9254VSKXUMA1 is available at Aetrix Electronics and suitable for automotive gateway modules, body control units, and electric power steering systems requiring stable component supply across extended production lifecycles.
Supply support for TLE9254VSKXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TLE9254VSKXUMA1 belongs to Infineon's automotive-grade high-speed CAN transceiver product line, designed specifically for ASIL-B compliant vehicle networks requiring dual-bus redundancy, ultra-low stand-by power, and robust EMC performance.
FAQ
What is the maximum supported CAN FD data rate for TLE9254VSKXUMA1?
The TLE9254VSKXUMA1 supports CAN FD data frames up to 5 Mbit/s, achieved through matched transmitter symmetry (<5 ns skew) and optimized receiver delay matching. This is verified per ISO 11898-2:2016 Annex C test conditions and confirmed in Infineon's characterization report Rev. 1.0, Section 7.6.
Does TLE9254VSKXUMA1 require an external common-mode choke?
No. The TLE9254VSKXUMA1 achieves CISPR 25 Class 5 EMC compliance without external common-mode chokes due to its ultra-low electromagnetic emission (EME), resulting from precisely balanced CANH/CANL edge rates and internal termination design.
How does the bus wake-up pattern function operate in stand-by mode?
In stand-by mode, the TLE9254VSKXUMA1 monitors the CAN bus using dedicated low-power wake-up logic. Upon detecting a valid wake-up pattern (dominant-recessive-dominant sequence), it asserts RxD and exits stand-by within 150 µs-without requiring MCU intervention or external circuitry.
Is TLE9254VSKXUMA1 qualified for automotive use?
Yes. The TLE9254VSKXUMA1 is AEC-Q100 qualified (Grade 1, -40 °C to +125 °C ambient), tested for thermal cycling, humidity, and mechanical shock per automotive reliability standards. It is approved for safety-critical applications including EPS and BMS.
TLE9254VSKXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 14-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Transceiver
- Protocol:
- CANbus
- Number of Drivers/Receivers:
- 2/2
- Duplex:
- Half
- Receiver Hysteresis:
- 50 mV
- Data Rate:
- 5Mbps
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-14
TLE9254VSKXUMA1 FAQ
1.How can I place an order for TLE9254VSKXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE9254VSKXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE9254VSKXUMA1 reliable?
The price and inventory of TLE9254VSKXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE9254VSKXUMA1 is usually 5 days.
3.What payment methods are accepted for TLE9254VSKXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE9254VSKXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE9254VSKXUMA1?
TLE9254VSKXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE9254VSKXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE9254VSKXUMA1?
For technical support, including TLE9254VSKXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE9254VSKXUMA1 requirements.
6.How does Aetrix verify that TLE9254VSKXUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE9254VSKXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE9254VSKXUMA1 meets industry standards.
7.What is the process for return or replacement of TLE9254VSKXUMA1?
All TLE9254VSKXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE9254VSKXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE9254VSKXUMA1 part is unused and in its original packaging.
Return procedure for TLE9254VSKXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLE9254VSKXUMA1 Tags

-
ATA6561-GAQW-N
Microchip Technology

-
ATA6561-GBQW-N
Microchip Technology
-
AM26LS32ACDR
Texas Instruments

-
SP485CN-L/TR
MaxLinear, Inc.

-
SP485EN-L/TR
MaxLinear, Inc.

-
SP485EEN-L/TR
MaxLinear, Inc.

-
SP485ECN-L/TR
MaxLinear, Inc.

-
THVD1400DR
Texas Instruments
-
AM26C31IDR
Texas Instruments

-
TLIN1021ADRQ1
Texas Instruments
-
MAX232IDR
Texas Instruments
-
AM26C32IDR
Texas Instruments
Tech Hub
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

