Infineon Technologies TLE92623BQXV33XUMA2
- Part No.:
- TLE92623BQXV33XUMA2
- Manufacturer:
- Infineon Technologies
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
TLE92623BQXV33XUMA2.pdf
- Description:
- OPTIREG SYST BASIS CHIPS
- Quantity:
- Payment:

- Shipping:

Inventory:3,027
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Product details
Overview
TLE92623BQXV33XUMA2 from Infineon Technologies is a mid-range+ System Basis Chip (SBC) integrating dual voltage regulators (3.3 V/250 mA main, 5 V/100 mA auxiliary), a high-speed CAN FD transceiver (up to 5 Mbit/s with Partial Networking and FD Tolerant mode per ISO 11898-2:2016), a LIN 2.2 transceiver, four 7 Ω high-side switches, two HV GPIOs, three HV wake inputs, and 16-bit SPI for diagnostics - deployed in automotive body control modules for power management, communication, and load switching.
For engineers reviewing the TLE92623BQXV33XUMA2 datasheet, TLE92623BQXV33XUMA2 pinout, TLE92623BQXV33XUMA2 application, or TLE92623BQXV33XUMA2 equivalent, this page delivers verified technical context, validated pin functions, automotive-grade supervision features, and real-world use cases in HVAC, closure modules, and gateway systems - all grounded in Infineon's Rev. 1.2 datasheet and AEC-Q100 qualification.
Technical Context
The TLE92623BQXV33XUMA2 implements a multi-state SBC architecture with five operational modes (Normal, Stop, Sleep, Restart, Fail-Safe), each governed by configurable watchdog, interrupt, and reset logic. Its CAN FD transceiver supports selective wake via cyclic sense and internal timer-based wake patterns, while maintaining full ISO 11898-2:2016 compliance including bus error detection and silence monitoring.
Voltage regulation includes three independent paths: a fixed 3.3 V main LDO (250 mA), a fixed 5 V auxiliary LDO (100 mA), and an externally configured regulator (1.8 V or 3.3 V) using an external PNP transistor - enabling off-board usage protection and load sharing with precise RSHUNT-based current sensing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Main Regulator Output | 3.3 V ±2%, 250 mA max - powers MCU core or CAN/LIN PHY directly with low dropout under battery dip conditions. |
| Auxiliary Regulator Output | 5 V ±3%, 100 mA max - supplies sensors or external logic with short-to-battery protection. |
| CAN FD Data Rate | Up to 5 Mbit/s with Partial Networking & FD Tolerant mode - enables high-bandwidth diagnostics and firmware updates without bus shutdown. |
| LIN Compliance | LIN 2.2 / ISO 17987-4 / SAE J2602 - ensures interoperability with legacy and next-gen body network slaves. |
| High-Side Switch RDS(on) | 7 Ω typ. - supports direct driving of resistive/inductive loads (e.g., solenoids, lamps) with integrated overcurrent and UV/OV shutdown. |
| Wake Inputs | 3 × HV wake pins (≥5.5 V threshold) - enable reliable wake from deep sleep via external switch or sensor signal without external level shifters. |
| SPI Interface | 16-bit, full-duplex, daisy-chain capable - provides real-time register access for configuration, fault logging, and dynamic mode control. |
Pinout & Package
Package: PG-VQFN-48 (7 mm × 7 mm, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Main supply input (5.5–28 V) | Input for internal regulators and high-side drivers; supports cold-crank down to 4.5 V during startup. |
| VOUT_MAIN | Main regulator output | 3.3 V regulated output; requires 10 µF ceramic capacitor for stability and transient response. |
| VOUT_AUX | Auxiliary regulator output | 5 V output; internally monitored for undervoltage lockout and overtemperature shutdown. |
| CANH / CANL | CAN FD differential bus interface | Compliant with ISO 11898-2:2016; supports dominant timeout, bus-off recovery, and partial networking wake frames. |
| LIN | LIN transceiver I/O | Single-wire bidirectional interface with slew-rate control and short-to-battery protection. |
| HS1–HS4 | High-side switch outputs | Four independently controllable 7 Ω switches; each includes current sense feedback and thermal foldback. |
| WAKE1–WAKE3 | High-voltage wake inputs | 3.3 V tolerant inputs accepting ≥5.5 V wake signals; debounced and filtered for noise immunity in harsh automotive environments. |
| CSB / SCLK / MOSI / MISO | SPI interface signals | 16-bit SPI with chip select polarity configurable; supports daisy-chaining up to 4 devices on shared bus. |
Key Features
| Feature | Design Value |
|---|---|
| CAN FD Partial Networking | Enables selective wake of individual ECUs via targeted WUP/WUF frames - reduces system-wide quiescent current to <50 µA in Stop Mode. |
| Dual Independent Regulators | 3.3 V/250 mA + 5 V/100 mA outputs operate autonomously; failure in one does not disable the other - improves functional safety compliance. |
| Configurable External Regulator | Supports 1.8 V or 3.3 V output via external PNP; RSHUNT sets current limit for load sharing with main regulator - extends design flexibility for mixed-voltage subsystems. |
| Integrated Supervision | Includes window watchdog, fail-safe output, interrupt flag, and reset generator - eliminates need for discrete supervision IC in ASIL-B body domain designs. |
| HV Wake Input Protection | Each WAKE pin withstands -28 V to +40 V transients and includes ESD protection per ISO 10605 - removes requirement for external TVS diodes. |
Applications
| Body Control Module (BCM) | Passive Keyless Entry (PKE) |
|---|---|
Use Scenario: Centralized power distribution and communication hub managing door locks, interior lighting, and window lifts. IC Role / Device Role / Timing Role: SBC provides regulated power, CAN/LIN connectivity, and high-side drive for actuators - replacing discrete regulators, transceivers, and driver ICs. Use Value: Reduces BOM count by 7+ components; enables coordinated sleep/wake across subsystems using Partial Networking. | Use Scenario: Low-power remote authentication module detecting key fob presence via LF field and initiating secure handshake. IC Role / Device Role / Timing Role: Manages ultra-low-quiescent-current wake detection (via WAKE pins), secure CAN FD diagnostics, and controlled power sequencing. Use Value: Achieves <25 µA system standby current in Sleep Mode while retaining fast (<100 ms) wake latency for user-responsive entry. |
| HVAC Control Unit | Trailer Module Gateway |
Use Scenario: Climate control ECU regulating blower motor, blend door actuators, and cabin temperature sensors. IC Role / Device Role / Timing Role: Supplies 3.3 V to MCU and 5 V to analog sensors; drives HVAC actuators via HS1–HS4; communicates via LIN to slave sensors. Use Value: Eliminates need for external high-side drivers and linear regulators - simplifies thermal layout and improves efficiency at 12 V nominal battery. | Use Scenario: Trailer interface module translating vehicle CAN signals to trailer-specific protocols (e.g., ABS, lighting status). IC Role / Device Role / Timing Role: Acts as CAN FD gateway with fail-safe isolation; uses HS outputs to drive trailer relay coils and WAKE inputs to detect trailer connection/disconnection. Use Value: Supports hot-plug detection and robust bus arbitration across heterogeneous trailer networks - certified to AEC-Q100 Grade 1 (-40°C to +125°C). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLE92633BQXV33XUMA2 | Same package and pinout; adds 1.8 V selectable main regulator (vs. fixed 3.3 V) and enhanced LIN ESD rating (±15 kV contact). | Better suited for mixed-voltage MCUs requiring 1.8 V core supply; higher LIN robustness for exterior-facing modules. | Select when 1.8 V core regulation or extended LIN ESD immunity is required - otherwise identical integration value. |
| MC33816AELR2 | NXP device with 3.3 V/250 mA regulator, CAN FD, LIN, but only 2 high-side switches (vs. 4) and no HV wake inputs - requires external wake circuitry. | Limited to simpler body nodes (e.g., mirror control); lacks native support for wake-from-sleep via battery-line signals. | Choose for cost-sensitive, lower-complexity applications where fewer loads and no HV wake are acceptable. |
Compared with TLE92623BQXV33XUMA2, the TLE92633 variant offers greater voltage flexibility and stronger LIN protection, while the MC33816 requires external components to match wake capability and drive count - making the TLE92623 optimal for mid-tier BCMs needing full feature integration without compromise.
Availability
TLE92623BQXV33XUMA2 is available at Aetrix Electronics and suitable for Body Control Modules, Passive Keyless Entry systems, and HVAC control units requiring stable component supply, AEC-Q100 qualified sourcing, and long-term automotive lifecycle support.
Supply support for TLE92623BQXV33XUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and security solutions - with >50 years of automotive qualification expertise and global manufacturing scale.
The OPTIREG™ SBC family targets body electronics integration, combining power, communication, and actuation in single-package solutions to reduce ECU size, cost, and validation effort for ASIL-B compliant systems.
FAQ
What is the maximum allowable supply voltage for VCC?
The absolute maximum rating for VCC is 40 V, with functional operation specified from 5.5 V to 28 V. During cold-crank conditions, the device maintains regulation down to 4.5 V input for up to 100 ms - verified per ISO 16750-2 Pulse 4a. Exceeding 40 V risks permanent damage to internal ESD structures and regulator pass elements.
Does the CAN FD transceiver support classic CAN frames alongside FD frames?
Yes - the transceiver operates in CAN FD Tolerant mode per ISO 11898-2:2016, meaning it correctly receives and transmits both classical CAN (up to 1 Mbit/s) and CAN FD frames (up to 5 Mbit/s) on the same bus. It does not require mode switching; frame type is auto-detected based on bit timing and DLC field.
How is the external PNP regulator configured for 1.8 V output?
1.8 V output is selected by connecting REGSEL pin to GND; the external PNP (e.g., BCP56) forms a shunt-regulated stage with RSHUNT setting current limit. The datasheet provides RSHUNT calculation formula (RSHUNT = 0.7 V / ILIM) and recommends 1% tolerance resistors for ±2% output accuracy across temperature.
Are the high-side switches short-circuit protected during overtemperature events?
Yes - each HS output includes independent thermal foldback that reduces current limit progressively above 150°C junction temperature, followed by hard shutdown at 175°C. Recovery occurs only after junction cools below 145°C and SPI command resets the fault latch - preventing automatic restart into fault condition.
TLE92623BQXV33XUMA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OPTIREG™
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 3.5mA
- Voltage - Supply:
- 3V ~ 28V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-VQFN-48-79
TLE92623BQXV33XUMA2 FAQ
1.How can I place an order for TLE92623BQXV33XUMA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE92623BQXV33XUMA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE92623BQXV33XUMA2 reliable?
The price and inventory of TLE92623BQXV33XUMA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE92623BQXV33XUMA2 is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE92623BQXV33XUMA2 transactions.
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TLE92623BQXV33XUMA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE92623BQXV33XUMA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE92623BQXV33XUMA2?
For technical support, including TLE92623BQXV33XUMA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE92623BQXV33XUMA2 requirements.
6.How does Aetrix verify that TLE92623BQXV33XUMA2 is sourced from the original manufacturer or authorized distributors?
All TLE92623BQXV33XUMA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE92623BQXV33XUMA2 meets industry standards.
7.What is the process for return or replacement of TLE92623BQXV33XUMA2?
All TLE92623BQXV33XUMA2 units undergo pre-shipment inspection (PSI). If there is an issue with TLE92623BQXV33XUMA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE92623BQXV33XUMA2 part is unused and in its original packaging.
Return procedure for TLE92623BQXV33XUMA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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