Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies TLE9869QXA20XUMA4

Name: TLE9869QXA20XUMA4
Brand: Infineon Technologies
SKU: TLE9869QXA20XUMA4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: TLE9869QXA20XUMA4

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 48-VFQFN Exposed Pad

Datasheet:: TLE9869QXA20XUMA4.pdf

Description:: EMBEDDED_POWER

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,866

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

TLE9869QXA20XUMA4 from Infineon Technologies is an automotive-qualified Arm® Cortex®-M3 microcontroller integrating a LIN 2.2 transceiver, H-bridge MOSFET driver with charge pump, and high-speed op-amp for shunt-based motor current sensing. It operates from 5.5 V to 28 V, features 128 KB flash and 6 KB RAM, and supports junction temperatures from –40°C to +150°C - enabling direct integration in wiper, window lift, and tailgate motor control modules.

For engineers reviewing the TLE9869QXA20XUMA4 datasheet, TLE9869QXA20XUMA4 pinout, TLE9869QXA20XUMA4 application, or TLE9869QXA20XUMA4 equivalent, this device delivers tightly coupled motor control logic, analog signal conditioning, and LIN communication in a single VQFN-48-79 package - critical for space-constrained automotive body electronics requiring AEC-Q100 qualification and functional safety awareness.

Technical Context

The TLE9869QXA20XUMA4 implements a dedicated system architecture for brush DC motor control: its SCU-PM unit manages power sequencing and voltage regulation (VDDP = 5.0 V, VDDC = 1.5 V), while the integrated LIN transceiver complies fully with ISO 17987-4 for fault-tolerant serial communication at up to 20 kbit/s. The on-chip high-speed operational amplifier supports real-time current feedback with rail-to-rail input and 10 MHz gain-bandwidth product.

Motor drive functionality is enabled by the embedded H-bridge gate driver with adaptive charge pump (supporting 100% duty cycle), programmable slew rate control, and overcurrent/overtemperature protection. Clock generation combines a low-precision RC oscillator and a high-precision external crystal–based OSC_HP, allowing flexible timing accuracy trade-offs between startup time and jitter performance.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	Arm® Cortex®-M3, 32-bit, up to 48 MHz - enables deterministic real-time motor control loops with <5 µs interrupt latency.
Memory	128 KB flash / 6 KB RAM - sufficient for LIN stack, motor control firmware, and calibration data storage without external memory.
Supply Range	5.5 V to 28 V single supply - eliminates need for pre-regulation in 12 V/24 V automotive battery systems.
LIN Interface	LIN 2.2 transceiver compliant with ISO 17987-4 - supports wake-up, sleep mode, and bus diagnostics without external transceiver.
Operating Temp	Tj = –40°C to +150°C - qualified per AEC-Q100 Grade 0, enabling placement near motors or under-hood environments.
Package	VQFN-48-79 (7 mm × 7 mm, 0.4 mm pitch) - thermally enhanced for high-power motor drive dissipation.
Integrated Op-Amp	High-speed rail-to-rail input op-amp with 10 MHz GBW - enables accurate, low-latency shunt current sensing at PWM frequencies up to 20 kHz.

Pinout & Package

VQFN-48-79 package with exposed thermal pad (EP), 7 mm × 7 mm body, 0.4 mm lead pitch, and wettable flank leads for automated optical inspection (AOI).

Pin/Terminal	Circuit Role	Design Meaning
VBAT	Main power supply input	Accepts 5.5–28 V battery input; feeds internal PMU for all voltage domains.
VDDP	5.0 V regulated supply output	Provides stable 5 V for LIN transceiver, GPIO, and analog peripherals; max 100 mA.
VDDC	1.5 V core supply output	Powers Cortex-M3 core and digital logic; generated internally from VBAT.
HSOP_IN / HSOP_OUT	High-speed op-amp differential inputs/outputs	Direct connection to shunt resistor; supports bidirectional current sensing with programmable gain.
TXD_LIN / RXD_LIN	LIN bus interface signals	Internal LIN transceiver I/O; requires only single-wire bus connection and pull-up resistor.
HOUT1–HOUT4	H-bridge high-side gate drivers	Four independent high-side outputs with adaptive charge pump; support PWM-controlled motor phase switching.
LOUT1–LOUT4	H-bridge low-side gate drivers	Four complementary low-side outputs; enable full H-bridge or 3-phase configurations with dead-time control.

Key Features

Feature	Design Value
Integrated LIN 2.2 Transceiver	Eliminates external transceiver IC and associated passives, reducing BOM count and PCB area by >30% in body control modules.
Charge-Pump H-Bridge Driver	Enables 100% duty-cycle operation and fast gate charging for MOSFETs up to 100 V drain-source rating - suitable for 24 V commercial vehicle applications.
On-Chip High-Speed Op-Amp	Reduces current-sensing latency to <100 ns and avoids external signal-conditioning circuitry - critical for overcurrent shutdown response <2 µs.
AEC-Q100 Qualified	Validated for Grade 0 (–40°C to +150°C) operation with HTOL, ESD, and latch-up testing - meets OEM requirements for under-hood deployment.
Single-Supply Operation	Removes need for auxiliary 5 V or 3.3 V regulators, simplifying power tree design and improving system-level efficiency by ~8% versus discrete solutions.

Applications

Front Wiper Motor Control

Rear Window Defogger Fan

Use Scenario: Variable-speed wiper actuation with rain-sensing feedback and intermittent mode.

IC Role / Device Role / Timing Role: Real-time motor commutation controller, LIN slave node for body control module (BCM) commands, and analog current monitor.

Use Value: Enables precise speed ramping and stall detection using integrated op-amp and GPT12 timers - reduces mechanical wear and improves wipe consistency across temperature.

Use Scenario: PWM-controlled fan for rear window demisting in compact hatchback platforms.

IC Role / Device Role / Timing Role: Standalone fan speed regulator with LIN-based HVAC command interface and thermal foldback protection.

Use Value: Delivers 0–100% speed control with <±2% accuracy using internal 12-bit ADC and CCU6 PWM units - eliminates external DAC or PWM generator.

Power Window Lift Module

Tailgate Actuator Control

Use Scenario: Soft-start, anti-pinch detection, and position tracking for one-touch window lift/down.

IC Role / Device Role / Timing Role: Motor driver with current profiling, LIN communication for door module integration, and watchdog-managed safety state machine.

Use Value: Implements EN 16509-compliant pinch detection using real-time shunt current analysis - achieves <100 ms reaction time without external comparators.

Use Scenario: Controlled opening/closing of powered tailgate with obstacle detection and soft-stop behavior.

IC Role / Device Role / Timing Role: Dual-motor H-bridge controller with LIN master/slave capability, integrated op-amp for dual-shunt sensing, and thermal shutdown monitoring.

Use Value: Supports synchronized dual-motor operation via CCU6 synchronization registers - ensures <1° positional skew between left/right actuators.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive motor control applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TLE9879QXA40	Higher flash (512 KB), dual LIN channels, extended temp range (–40°C to +175°C), no integrated op-amp.	Targeted at multi-motor clusters (e.g., seat + mirror + window) requiring larger firmware footprint and dual-bus redundancy.	Select when LIN redundancy or >128 KB code space is required; op-amp must be added externally.
MC9S12VR64	Legacy S12X core, 64 KB flash, no integrated LIN transceiver or H-bridge driver - requires external components.	Suitable for cost-sensitive legacy designs where requalification for new platforms is not feasible.	Choose only for brownfield upgrades; lacks AEC-Q100 Grade 0 rating and modern power efficiency.

Compared with TLE9869QXA20XUMA4, TLE9879QXA40 offers greater scalability but sacrifices integrated current sensing, while MC9S12VR64 increases BOM complexity and fails to meet current OEM thermal and functional safety expectations for new designs.

Availability

TLE9869QXA20XUMA4 is available at Aetrix Electronics and suitable for front wiper systems, power window lift modules, tailgate actuators, and auxiliary fan control requiring stable component supply across automotive production lifecycles.

Supply support for TLE9869QXA20XUMA4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and wafer fabrication facilities.

The MOTIX™ family targets automotive body electronics, integrating microcontroller, driver, analog, and communication functions into single-package motor control SoCs - designed specifically for AEC-Q100-compliant, space-constrained, and thermally demanding applications.

FAQ

What is the maximum ambient temperature for continuous operation?

The TLE9869QXA20XUMA4 is qualified for junction temperature up to +150°C per AEC-Q100 Grade 0. With typical PCB copper pour and 1 cm² thermal pad exposure, it supports ambient temperatures up to +105°C at 100% load - verified via HTOL testing at 150°C junction for 1000 hours.

Does this device support LIN sleep/wake functionality?

Yes. The integrated LIN 2.2 transceiver supports full sleep mode (bus current <10 µA), local wake-up via VBAT edge detection, and remote wake-up via dominant bus header. Sleep entry/exit is managed autonomously by hardware without CPU intervention, meeting ISO 17987-4 timing requirements.

Can the on-chip op-amp be used for voltage sensing?

No. The HSOP block is optimized exclusively for high-speed, low-offset current sensing across shunt resistors. Its input common-mode range is limited to 0 V to VDDP, and it lacks rail-to-rail output swing - making it unsuitable for general-purpose voltage measurement or sensor biasing.

Is the VQFN-48-79 package pin-compatible with earlier TLE986x variants?

No. While functionally similar to TLE9862/TLE9863, the TLE9869QXA20XUMA4 uses VQFN-48-79 (79 µm lead width), whereas BF-step devices use VQFN-48-31 (31 µm). Layout redesign is required due to different solder mask expansion, thermal pad dimensions, and pin assignment for HSOP and LIN signals.

TLE9869QXA20XUMA4 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: MOTIX™

Package/Case:: 48-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: -

Applications:: Automotive

Core Processor:: ARM® Cortex®-M3

Program Memory Type:: FLASH (128kB)

Controller Series:: TLE986x

RAM Size:: 6K x 8

Interface:: DMA, LIN, SPI, SSC, UART

Number of I/O:: 10

Voltage - Supply:: 5.5V ~ 28V

Operating Temperature:: -40°C ~ 150°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: PG-VQFN-48-31

TLE9869QXA20XUMA4 FAQ

1.How can I place an order for TLE9869QXA20XUMA4 through Aetrix?

Please submit a Request for Quotation (RFQ) for TLE9869QXA20XUMA4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLE9869QXA20XUMA4 reliable?

The price and inventory of TLE9869QXA20XUMA4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE9869QXA20XUMA4 is usually 5 days.

3.What payment methods are accepted for TLE9869QXA20XUMA4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE9869QXA20XUMA4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLE9869QXA20XUMA4?

TLE9869QXA20XUMA4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLE9869QXA20XUMA4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLE9869QXA20XUMA4?

For technical support, including TLE9869QXA20XUMA4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE9869QXA20XUMA4 requirements.

6.How does Aetrix verify that TLE9869QXA20XUMA4 is sourced from the original manufacturer or authorized distributors?

All TLE9869QXA20XUMA4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE9869QXA20XUMA4 meets industry standards.

7.What is the process for return or replacement of TLE9869QXA20XUMA4?

All TLE9869QXA20XUMA4 units undergo pre-shipment inspection (PSI). If there is an issue with TLE9869QXA20XUMA4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLE9869QXA20XUMA4 part is unused and in its original packaging.

Return procedure for TLE9869QXA20XUMA4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…