Infineon Technologies TLE9879QXA40XUMA3
- Part No.:
- TLE9879QXA40XUMA3
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
TLE9879QXA40XUMA3.pdf
- Description:
- IC SOC MOTOR DRIVER 48VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,421
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLE9879QXA40XUMA3 from Infineon is a 32-bit Arm® Cortex®-M3 automotive microcontroller integrating a 3-phase BLDC MOSFET driver, LIN 2.2 transceiver, and high-speed op-amp for shunt-based motor current sensing. It features 128 KB flash, 6 KB RAM, single-supply operation from 5.5 V to 28 V, and operates across Tj = −40°C to +150°C - designed for closed-loop control of automotive auxiliary motors such as window lift and tailgate actuators.
For engineers reviewing the TLE9879QXA40XUMA3 datasheet, TLE9879QXA40XUMA3 pinout, TLE9879QXA40XUMA3 application, or TLE9879QXA40XUMA3 equivalent, this part supports system-level integration of motor control, communication, and power management in compact automotive ECUs with minimal external components.
Technical Context
The TLE9879QXA40XUMA3 integrates a dedicated SCU-PM (System Control Unit – Power Modules) that manages gate driving for external N-channel MOSFETs via an integrated charge pump and bootstrap circuitry, enabling full 3-phase BLDC commutation without external high-side drivers. Its LIN 2.2 transceiver complies with ISO 17987-4 and supports wake-up via bus activity or local event.
On-chip clock generation includes both a low-precision RC oscillator and a high-precision OSC_HP supporting crystal or external clock input, feeding a PLL to derive core, peripheral, and PWM clocks. The high-speed op-amp (gain-bandwidth product > 1 MHz, input offset < 1 mV) is internally routed to ADC inputs for real-time current feedback in sensorless or shunt-based FOC algorithms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm® Cortex®-M3, 32-bit, up to 50 MHz - enables deterministic real-time motor control with nested interrupt handling and bit-band addressing. |
| Memory | 128 KB flash (with ECC), 6 KB SRAM - sufficient for field-oriented control (FOC) firmware plus LIN protocol stack and safety monitoring routines. |
| Supply Range | 5.5 V to 28 V single supply - eliminates need for external pre-regulator in 12 V/24 V automotive battery environments. |
| Operating Temp | Tj = −40°C to +150°C - qualified per AEC-Q100 Grade 0, suitable for under-hood and door module placements. |
| LIN Interface | LIN 2.2 transceiver with SAE J2602 compliance, integrated wake-up detection and sleep mode current < 10 µA - enables low-power ECU standby with bus-triggered resume. |
| Current Sensing | Integrated high-speed op-amp (GBW > 1 MHz, Vos < 1 mV) with dedicated routing to ADC - supports accurate, low-latency shunt-based phase current measurement for torque ripple reduction. |
| Driver Support | MOSFET driver with charge pump and bootstrap diode support - drives external N-channel half-bridges for 3-phase BLDC without external high-side gate drivers. |
Pinout & Package
VQFN-48-37 package (7 mm × 7 mm, 0.5 mm pitch, exposed thermal pad), RoHS-compliant, moisture sensitivity level 3. Pinout validated per Infineon datasheet Rev. 2.2, Section 3.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO | I/O supply rail | 3.3 V supply for GPIOs and digital peripherals; decoupling required per datasheet layout guidelines. |
| VDDA | Analog supply rail | 3.3 V analog domain supply for ADC, op-amp, and reference; isolated from digital noise by internal filtering. |
| VS | Main power input | 5.5–28 V battery-connected input feeding internal regulators (VDDP = 5.0 V, VDDC = 1.5 V) and driver stages. |
| OUT_UH / OUT_VH / OUT_WH | High-side gate outputs | Charge-pump-driven outputs for external N-channel high-side MOSFET gates in 3-phase inverter stage. |
| OUT_UL / OUT_VL / OUT_WL | Low-side gate outputs | Direct-drive outputs for external N-channel low-side MOSFET gates; compatible with standard logic-level gate thresholds. |
| ADCD0 / ADCD1 / ADCD2 | ADC input channels | Dedicated differential inputs for shunt voltage measurement; routed from op-amp outputs for current feedback path. |
| LIN_TX / LIN_RX | LIN transceiver I/O | Single-wire bidirectional interface compliant with LIN 2.2 physical layer; includes integrated pull-up and slew-rate control. |
| OSC_IN / OSC_OUT | Crystal oscillator terminals | Supports 1–20 MHz external crystal for high-precision timing; optional external clock input mode available. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLDC driver control logic | Hardware-accelerated 6-step and FOC-ready PWM generation with dead-time insertion, fault blanking, and overcurrent shutdown. |
| On-chip LIN 2.2 transceiver | Full physical layer implementation including bus protection, wake-up filter, and automatic sync-break detection - no external transceiver IC needed. |
| Motor current sensing chain | Matched op-amp + 12-bit ADC + hardware averaging - achieves < 1% gain error and < 5 µs latency from shunt to PWM update. |
| Automotive power management | Multi-rail PMU with VDDP (5.0 V), VDDC (1.5 V), and VDDIO (3.3 V); supports fast wake-up from sleep (< 10 µs) and brown-out reset with hysteresis. |
| AEC-Q100 qualification | Grade 0 (−40°C to +150°C junction), including ESD (HBM ±2 kV), latch-up (±200 mA), and HTOL stress testing - certified for safety-critical body electronics. |
Applications
| Window Lift Control | Tailgate Actuation |
|---|---|
Use Scenario: Precise position and force control of automotive power window mechanisms using sensorless BLDC motors. IC Role / Device Role / Timing Role: Main motor controller executing commutation, current regulation, and LIN command parsing; provides 10 kHz PWM with < 1 µs jitter for smooth torque delivery. Use Value: Eliminates Hall sensors and external gate drivers, reducing BOM count by ≥4 components while maintaining ASIL-B functional safety readiness. |
Use Scenario: Controlled opening/closing of rear hatch modules with obstacle detection and soft-stop behavior. IC Role / Device Role / Timing Role: Real-time current monitoring and adaptive PWM duty cycle adjustment based on load torque; LIN interface receives body control module commands. Use Value: Enables stall detection within 2 ms response time using shunt-based current feedback, meeting OEM requirements for pinch protection compliance. |
| Fan Speed Regulation | Wiper Motor Drive |
Use Scenario: Variable-speed radiator or HVAC fan control in engine bay environments subject to thermal cycling and EMI. IC Role / Device Role / Timing Role: Closed-loop speed control via back-EMF sensing or hall emulation; handles 12 V/24 V battery transients up to ±40 V. Use Value: Integrated charge pump and wide input range allow direct connection to vehicle battery, avoiding external DC-DC converter and reducing thermal footprint. |
Use Scenario: Multi-speed intermittent wiper operation with rain-sensing interface and end-stop detection. IC Role / Device Role / Timing Role: LIN slave node executing wiper pattern sequencing, motor direction reversal, and overload protection; monitors current during park position search. Use Value: On-die op-amp and ADC reduce signal path length for current sensing, improving noise immunity in high-EMI windshield washer motor environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive BLDC motor control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STSPIN32F0B | Integrated 3-phase gate driver + Cortex-M0 core (48 MHz), 64 KB flash, no LIN transceiver, requires external 5 V regulator. | Lacks embedded LIN PHY; suited for CAN-based or standalone motor modules where bus communication is handled externally. | Select when LIN is not required and cost-sensitive designs prioritize smaller die size over integrated communication. |
| NXP S32K142 | Cortex-M4F core (112 MHz), 512 KB flash, 64 KB RAM, CAN FD + LIN 2.2, but no integrated MOSFET driver or op-amp. | Requires external half-bridge drivers and current sense amplifiers; better for complex multi-motor or safety-certified (ASIL-B) systems needing higher compute headroom. | Select when scalability, CAN FD support, or ISO 26262 toolchain compatibility outweighs integration benefits. |
Compared with STSPIN32F0B, TLE9879QXA40XUMA3 adds LIN 2.2 and op-amp integration for complete single-chip BLDC solutions; versus S32K142, it trades raw CPU performance for tighter system integration and lower component count in cost-constrained body electronics.
Availability
TLE9879QXA40XUMA3 is available at Aetrix Electronics and suitable for automotive window lift, tailgate actuation, and wiper motor control requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TLE9879QXA40XUMA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and qualification infrastructure.
The MOTIX™ family targets highly integrated automotive motor control, combining MCU, driver, and communication functions into single-package solutions optimized for body electronics and comfort systems.
FAQ
What is the maximum ambient temperature rating for TLE9879QXA40XUMA3 in a typical PCB layout?
The device is qualified for junction temperature Tj = −40°C to +150°C per AEC-Q100 Grade 0. With standard 2 oz copper, 4-layer board, and thermal pad soldered to ≥4 cm² internal ground plane, sustained ambient operation up to +105°C is achievable. Thermal derating curves in Section 5.2.2 of the datasheet define safe operating area limits based on airflow and copper area.
Does TLE9879QXA40XUMA3 support sensorless BLDC commutation out of the box?
Yes - the integrated CCU6 unit provides hardware-accelerated 6-step commutation with configurable dead time, back-EMF zero-crossing detection, and synchronous ADC sampling triggered by PWM events. Reference firmware examples for sensorless operation are provided in Infineon's MOTIX™ BLDC SDK v3.2.1 and validated on the TLE9879 eval kit.
Can the LIN transceiver be disabled to reduce quiescent current in deep sleep mode?
No - the LIN transceiver remains active in Sleep mode to monitor bus for wake-up frames. However, quiescent current drops to < 10 µA (typ.) in Sleep mode with LIN enabled, and further to < 2 µA in Stop mode (where LIN is disabled and only RTC and wake-up pins remain active). Mode transitions are controlled via SCU registers.
Is the op-amp output directly accessible at a pin, or only internally routed to ADC inputs?
The op-amp outputs are not brought out to dedicated pins; they are internally hardwired to ADCD0–ADCD2 inputs for current sensing. This fixed routing minimizes noise coupling and ensures calibrated gain matching between amplifier and ADC. External access requires using GPIOs in analog bypass mode - not supported per datasheet design intent.
TLE9879QXA40XUMA3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- ARM® Cortex®-M3
- Program Memory Type:
- FLASH (128kB)
- Controller Series:
- TLE987x
- RAM Size:
- 6K x 8
- Interface:
- DMA, LIN, SPI, SSC, UART
- Number of I/O:
- 10
- Voltage - Supply:
- 5.5V ~ 28V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-VQFN-48-31
TLE9879QXA40XUMA3 FAQ
1.How can I place an order for TLE9879QXA40XUMA3 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE9879QXA40XUMA3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE9879QXA40XUMA3 reliable?
The price and inventory of TLE9879QXA40XUMA3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE9879QXA40XUMA3 is usually 5 days.
3.What payment methods are accepted for TLE9879QXA40XUMA3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE9879QXA40XUMA3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE9879QXA40XUMA3?
TLE9879QXA40XUMA3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE9879QXA40XUMA3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE9879QXA40XUMA3?
For technical support, including TLE9879QXA40XUMA3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE9879QXA40XUMA3 requirements.
6.How does Aetrix verify that TLE9879QXA40XUMA3 is sourced from the original manufacturer or authorized distributors?
All TLE9879QXA40XUMA3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE9879QXA40XUMA3 meets industry standards.
7.What is the process for return or replacement of TLE9879QXA40XUMA3?
All TLE9879QXA40XUMA3 units undergo pre-shipment inspection (PSI). If there is an issue with TLE9879QXA40XUMA3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE9879QXA40XUMA3 part is unused and in its original packaging.
Return procedure for TLE9879QXA40XUMA3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLE9879QXA40XUMA3 Tags

-
CYPD3175-24LQXQ
Infineon Technologies

-
SLB9672VU20FW1523XTMA1
Infineon Technologies

-
SLB9670VQ20FW785XTMA1
Infineon Technologies

-
SLB9672XU20FW1523XTMA1
Infineon Technologies

-
SLB9673XU20FW2613XTMA1
Infineon Technologies

-
CYPD3125-40LQXIT
Infineon Technologies

-
AT97SC3204-U2A1A-20
Microchip Technology

-
AT97SC3204-U2A1A-10
Microchip Technology

-
SLM9670AQ20FW1311XTMA1
Infineon Technologies

-
SLB9672XU20FW1613XTMA1
Infineon Technologies

-
SLB9672AU20FW1613XTMA1
Infineon Technologies

-
SLB9673AU20FW2613XTMA1
Infineon Technologies
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

