Infineon Technologies TLF11251LDXUMA1

Overview

TLF11251LDXUMA1 from Infineon Technologies is an automotive-qualified 2.5 A half-bridge power stage with integrated PMOS/NMOS output transistors, gate drivers, level shifter, and dead-time logic. It delivers CMOS-compatible PWM control, output current sensing, overcurrent protection on both high- and low-side MOSFETs, and overtemperature shutdown. Designed as a companion to the TLF35584xx PMIC for AURIX™ TC3xx microcontroller core voltage regulation in electric power steering and battery management systems.

For engineers reviewing the TLF11251LDXUMA1 datasheet, TLF11251LDXUMA1 pinout, TLF11251LDXUMA1 application, or TLF11251LDXUMA1 equivalent, this device supports closed-loop control via low propagation delay (<100 ns), enables synchronous buck operation with programmable low-side control (LSCON), and integrates protection features critical for automotive domain controllers requiring AEC-Q100 compliance and robust fault handling.

Technical Context

The TLF11251LDXUMA1 implements a single-input half-bridge topology with internal level shifting from VCC-referenced logic to VS-referenced gate drive. Its dead-time generation is fixed and optimized for interface with AURIX™ TC3xx embedded regulators-no external timing components required. The high-side P-channel and low-side N-channel MOSFETs are co-packaged and thermally coupled to a shared heat sink pad.

Control logic interprets PWM input state directly: high opens high-side and closes low-side; low closes high-side and opens low-side. LSCON pin selects between synchronous rectification (LSCON = high) or diode emulation (LSCON = low). Propagation delay is ≤90 ns typical, enabling switching frequencies up to 1 MHz in buck configurations.

Key Specifications

Pinout & Package

TLF11251LDXUMA1 is housed in a PG-TSON-10 package (3.0 mm × 3.0 mm, 0.65 mm pitch) with exposed thermal pad (heat sink) for enhanced thermal dissipation. The package supports solder reflow per JEDEC J-STD-020 and is RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge driver applications.

Compared with TLF11252LDXUMA1, the TLF11251LDXUMA1 offers lower quiescent current and native active-high LSCON compatibility with AURIX™ reference designs; versus IRS2005MTRPBF, it trades external component flexibility for reduced footprint, faster time-to-market, and guaranteed AEC-Q100 qualification out-of-box.

Availability

TLF11251LDXUMA1 is available at Aetrix Electronics and suitable for electric power steering, battery management, and domain controller applications requiring stable component supply, automotive-grade reliability, and AEC-Q100 compliance.

Supply support for TLF11251LDXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in AEC-Q100-qualified PMICs and silicon carbide solutions.

The OPTIREG™ PMIC product line targets automotive microcontroller power delivery-specifically engineered to provide tightly regulated, fault-protected core and I/O voltages for AURIX™, Traveo™, and other safety-critical MCUs.

FAQ

What is the maximum switching frequency supported by TLF11251LDXUMA1?

The TLF11251LDXUMA1 supports switching frequencies up to 1 MHz in buck configurations, enabled by its ≤90 ns propagation delay, low gate charge drive capability, and optimized dead-time logic. Real-world operation is typically limited to 500–800 kHz due to thermal constraints and external LC filter design, but the device's electrical characteristics remain valid through 1 MHz per datasheet Section 4.3.3.

Can TLF11251LDXUMA1 be used without the LSCON pin connected?

No-LSCON must be actively driven high or low; floating LSCON may cause undefined low-side behavior and risk shoot-through. Datasheet Section 2.2 specifies LSCON as a CMOS input with defined thresholds (VIL ≤ 0.3×VCC, VIH ≥ 0.7×VCC). Pull-up or pull-down resistors (e.g., 10 kΩ to VCC or GND) are acceptable if firmware control is unavailable.

How does overcurrent protection trigger and recover on TLF11251LDXUMA1?

Overcurrent protection triggers independently on high-side and low-side MOSFETs when sensed current exceeds 2.5 A (continuous) or 4.4 A (pulsed). Upon detection, the affected side latches off for ≥10 µs, then automatically recovers if fault condition clears. Recovery is non-latching unless overtemperature also activates, which forces full shutdown until Tj drops below 135 °C.

Is the heat sink pad electrically connected internally?

Yes-the exposed thermal pad (pin "Heat sink") is internally connected to PGND and GND. Per datasheet Section 6 and layout guidelines, it must be soldered to a dedicated PCB thermal plane tied to both PGND and GND with ≥4 thermal vias (0.3 mm diameter, 0.6 mm pitch) to ensure thermal resistance θ_JA ≤ 45 °C/W and prevent junction overheating under 2.5 A continuous load.