Qorvo TQL9063-PCB

Overview

TQL9063-PCB from Qorvo is an evaluation board designed to demonstrate and accelerate development with the TQL9063 ultra-low-noise, bypass-capable LNA IC. It provides full RF signal path access (500–4000 MHz), on-board bias control (VDD, VBYP, VSD), and optimized 50 Ω matching using Rogers 4350B/4450F PCB stack-up. The board supports all three operating modes-LNA ON, Bypass ON, and OFF-with validated switching timing and thermal grounding via backside paddle vias.

For engineers reviewing the TQL9063-PCB datasheet, pinout, applications, or equivalent options, this evaluation board enables rapid characterization of noise figure (0.7 dB at 1.95 GHz), gain (19 dB), OIP3 (+36.3 dBm), and fast mode switching (983 ns LNA activation) in wireless infrastructure receiver designs.

Technical Context

The TQL9063-PCB implements the TQL9063 DFN-8 LNA in a controlled RF environment: top-layer Rogers 4350B defines 50 Ω microstrip traces (width = 0.020", spacing = 0.032"), while inner layers use Rogers 4450F for stable dielectric performance across temperature. Grounding relies on ≥12 plated-through vias under the exposed paddle and dedicated GND turrets (J8).

All DC bias paths include decoupling (C1–C8: 100 pF–1 µF), RF choke (L1: 68 nH), and mode-control resistors (R1–R3: 0 Ω jumpers; R4: 91 kΩ shunt for sub-µs switching). The board supports both standard and optimized return-loss configurations-verified via S-parameter de-embedding up to 4 GHz.

Key Specifications

Availability

TQL9063-PCB is available at Aetrix Electronics and suitable for wireless infrastructure prototyping, base station receiver validation, and tower-mount amplifier design requiring stable component supply and traceable RF evaluation hardware.

Supply support for TQL9063-PCB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Qorvo is a U.S.-based semiconductor company specializing in RF solutions for wireless infrastructure, defense, and mobile applications, with expertise in GaAs and GaN process technologies.

The TQL9063-PCB belongs to Qorvo's evaluation platform series for high-performance RF front-end components, engineered specifically to validate low-noise amplification, bypass switching, and thermal integrity in 5G/LTE base station receiver chains.

FAQ

What is the primary purpose of the TQL9063-PCB evaluation board?

The TQL9063-PCB evaluation board is designed to enable immediate functional testing and RF performance validation of the TQL9063 ultra-low-noise bypass LNA. It provides SMA-accessible RF ports, configurable bias control via turret terminals, and a thermally optimized Rogers-based PCB layout that replicates production-grade grounding and impedance matching-allowing engineers to verify gain, noise figure, OIP3, and switching behavior without custom PCB development.

Does the TQL9063-PCB support all three operating modes of the TQL9063 IC?

Yes, the TQL9063-PCB fully supports all three TQL9063 operating states: LNA ON (VBYP = 0 V, VSD = 0 V), Bypass ON (VBYP = 1.6–5 V, VSD = 1.6 V), and OFF (VBYP = 1.6 V, VSD = 0 V). Mode selection is implemented via jumper-configurable voltage levels at J4 (VSD) and J5 (VBYP), with R4 (91 kΩ) installed to achieve datasheet-specified switching times (983 ns Bypass→LNA).

What PCB materials and stack-up are used in the TQL9063-PCB?

The TQL9063-PCB uses a four-layer stack-up: top layer (1 oz. Cu on Rogers 4350B), two inner layers (1 oz. Cu on Rogers 4450F), and bottom layer (1 oz. Cu on Rogers 4350B), with total thickness 0.062" ±0.006". This construction ensures stable 50 Ω microstrip impedance (width = 0.020", spacing = 0.032") and low-loss RF propagation across 0.5–4.0 GHz-matching the TQL9063 IC's specified operational bandwidth.

How is thermal performance managed on the TQL9063-PCB?

Thermal performance on the TQL9063-PCB is managed through ≥12 plated-through vias directly beneath the TQL9063's exposed backside paddle, connected to internal and bottom-layer ground planes. This design replicates the 44 °C/W junction-to-case thermal resistance specified for the TQL9063 IC and ensures reliable operation at 77 mA (LNA ON) and 3 mA (Bypass ON) supply currents under continuous RF stress.

Can the TQL9063-PCB be used for production-level RF measurements?

Yes-the TQL9063-PCB is calibrated for production-grade RF measurements: it includes de-embedded S-parameter data (up to 4 GHz), validated noise figure (0.7 dB typ. at 1.95 GHz), and OIP3 (+36.3 dBm) results aligned with the TQL9063 datasheet. Its Rogers-based construction, controlled impedance routing, and grounded paddle vias eliminate parasitic coupling, making it suitable for lab validation, pre-compliance testing, and reference design benchmarking.