Infineon Technologies WLC151568LDXSXQMA1

Overview

WLC151568LDXSXQMA1 from Infineon is a 15-W automotive-grade wireless power transmitter IC compliant with Qi v1.3.x (EPP/BPP), featuring an integrated 32-bit Arm® Cortex®-M0 MCU (128 KB Flash, 16 KB RAM), buck-boost controller, dual high-side/low-side gate drivers, and on-chip FOD via Q factor, resonance frequency, and power loss detection. It operates across 4.5 V–24 V input and supports free-positioning multi-coil pads in vehicle cabins.

For engineers reviewing the WLC151568LDXSXQMA1 datasheet, WLC151568LDXSXQMA1 pinout, WLC151568LDXSXQMA1 application, or WLC151568LDXSXQMA1 equivalent, key selection criteria include AEC-Q100 qualification, LIN/I2C/SPI/UART interface support, integrated ASK decoder and FSK modulator, -40°C to +105°C ambient operation, and programmable coil-enabling logic for 1–3 TX coils.

Technical Context

The WLC1515 implements a full Qi v1.3.x transmitter stack-including digital ping, identification, negotiation, calibration, authentication, and bidirectional in-band communication-executed by its on-chip Cortex-M0 core. Its analog subsystem integrates ASK demodulation, FSK modulation, current sense amplifiers, and a dedicated Q-factor/resonance-frequency measurement path for real-time foreign object detection.

It features a programmable buck-boost controller regulating VBRG up to 24 V with OVP/OCP protection, plus independent high-side/low-side gate drivers for inverter stages driving up to three TX coils. Communication interfaces include LIN (for automotive integration), I2C (for host control), UART (debug), and SPI (secure firmware update).

Key Specifications

Pinout & Package

68-pin QFN package with wettable flanks, 10 mm × 10 mm × 0.85 mm height, exposed thermal pad, RoHS-compliant and AEC-Q100 qualified.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar wireless power transmitter applications.

Compared with STWLC99TR and NXP MWCT1013A-based solutions, WLC151568LDXSXQMA1 delivers integrated LIN, AEC-Q100 qualification, and hardware-accelerated multi-coil control-reducing system-level validation effort and enabling single-chip automotive deployment.

Availability

WLC151568LDXSXQMA1 is available at Aetrix Electronics and suitable for automotive in-cabin charging pads, multi-coil free-positioning transmitters, and Qi EPP-compliant OEM wireless power systems requiring stable component supply and long-term lifecycle support.

Supply support for WLC151568LDXSXQMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

WLC1515 belongs to Infineon's Wireless Charging IC product line, designed specifically for AEC-Q100-qualified automotive wireless power transmitters supporting Qi v1.3.x, free positioning, and LIN-based vehicle integration.

FAQ

Does WLC151568LDXSXQMA1 require an external Qi certification license?

Yes. While the IC implements the full Qi v1.3.x transmitter stack, customers must obtain separate licensing from the Wireless Power Consortium (WPC) to use the Qi logo and claim compliance. Infineon provides reference firmware and test reports, but commercial certification remains the customer's responsibility.

What is the role of the LIN interface in automotive integration?

The LIN interface allows direct connection to the vehicle's body control module without protocol translation. It supports diagnostic services (UDS over LIN), real-time status reporting (coil temperature, FOD alerts, power level), and remote configuration-enabling OEMs to manage charging behavior via existing vehicle networks.

Can WLC151568LDXSXQMA1 drive more than three TX coils?

No. The IC has dedicated gate driver pairs and enable signals for exactly three TX coils (COIL1_EN through COIL3_EN). Driving additional coils would require external logic or multiplexing, which is unsupported by the internal firmware and analog subsystem.

How does the triple-mode FOD improve safety over single-method detection?

By simultaneously monitoring power loss, Q-factor shift, and resonance frequency deviation, the IC detects diverse foreign objects-including thin metal sheets, aluminum foil, and conductive contaminants-that may evade detection by any single metric alone, meeting stringent automotive safety requirements for in-cabin deployment.