AMD XC3S1200E-4FGG320I
- Part No.:
- XC3S1200E-4FGG320I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1200E-4FGG320I.pdf
- Description:
- IC FPGA 250 I/O 320FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:504
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Product details
Overview
XC3S1200E-4FGG320I from AMD is an FPGA orderable option positioned for configurable logic, memory-side control, and digital interface concentration in embedded systems. By pairing the Spartan-3E architecture with the 320-BGA package, which supports denser routing and higher I/O concentration for FPGA subsystems, the device helps preserve programmable logic flexibility in systems that continue to rely on a proven AMD/Xilinx FPGA path.
Spartan-3E devices target cost-sensitive FPGA designs with balanced logic, memory, and I/O resources for embedded control, digital bridging, and interface concentration. For engineers reviewing the XC3S1200E-4FGG320I datasheet, XC3S1200E-4FGG320I pinout, XC3S1200E-4FGG320I application, or XC3S1200E-4FGG320I equivalent, this device is widely used in embedded control platforms, industrial boards, communications hardware, digital interface modules, subsystem glue-logic replacements, and long-life programmable hardware programs.
Technical Context
In practical deployments, XC3S1200E-4FGG320I is chosen for how its exact FPGA density, speed grade 4 orderable option., and package align with the logic partition, routing plan, and board constraints of the target design. For many of these devices, package continuity and qualification suffix are just as important as raw logic resources.
The orderable code matters because 320-BGA affects assembly style and I/O breakout, while the industrial temperature option indicated by the suffix. determines whether the part fits the intended deployment range. In sustaining or lifecycle-sensitive programs, those details often drive whether a specific orderable option can be released into production or service stock.
Higher Spartan-3E density point for larger embedded logic, memory buffering, and programmable interface workloads. In practice, this means XC3S1200E-4FGG320I is typically selected when the hardware still needs FPGA-based control, timing coordination, memory-side logic, or programmable interface support without forcing a platform migration to a newer architecture.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Device Type | Spartan-3E FPGA. |
| Series | Spartan-3E |
| Package | 320-BGA package with tray packing. |
| Speed Grade | Speed grade 4 orderable option. |
| Operating Range | Industrial temperature option indicated by the suffix. |
| Architecture Role | FPGA platform for configurable digital logic, subsystem integration, and programmable interface behavior. |
| System Positioning | Used in embedded and sustaining designs that continue to depend on established FPGA footprints and validation paths. |
| Configuration Model | SRAM-based programmable logic device within the referenced AMD/Xilinx FPGA family. |
Pinout & Package
The XC3S1200E-4FGG320I pinout includes programmable user I/O, configuration access, dedicated clocking resources, and the required power and ground rails inside the 320-BGA package option.
For PCB work, the key concerns are package-compatible routing, configuration method continuity, power-rail integrity, and preserving the validated I/O assignment strategy already used by the target platform.
| Pin / Function | PCB Design and Circuit Role |
|---|---|
| User I/O Pins | Programmable logic pins used for digital interfaces, control signals, timing functions, and board-level subsystem connectivity. |
| Clock Inputs | Support synchronous FPGA operation and timing distribution across the design. |
| Configuration Pins | Used for initialization, programming, and configuration management. |
| Power Rails | Provide the required supply domains for core logic, auxiliary functions, and I/O banks. |
| Ground Pins | Support return-current integrity and stable programmable logic operation. |
Key Features
- Field-programmable logic supports subsystem updates without redesigning fixed-function hardware.
- Package and suffix options help align the part with board-level qualification and assembly needs.
- Useful in long-life and sustaining programs that still depend on established FPGA footprints.
- Supports digital interface concentration, control logic, and embedded subsystem integration.
- Preserves programmable behavior in systems where platform migration would add validation cost.
- Applicable across industrial, embedded, and legacy communications hardware environments.
Applications
| Embedded Control Boards | Industrial and Service-Life Platforms |
|---|---|
|
Use Scenario: Used in systems that need FPGA-based digital control, sequencing, or board-specific logic behavior. IC Role: Acts as the programmable logic layer inside an embedded hardware platform. Use Value: Improves flexibility while preserving an established board architecture. |
Use Scenario: Used in long-life industrial hardware and maintenance builds that still depend on validated FPGA footprints. IC Role: Maintains the configurable logic role inside a sustained product family. Use Value: Supports lifecycle continuity and serviceability. |
| Communications and Interface Modules | Legacy System Upkeep |
|
Use Scenario: Used in hardware that needs programmable interface handling, timing alignment, or local digital adaptation. IC Role: Implements adaptable logic around interface and transport functions. Use Value: Helps keep subsystem behavior programmable without major redesign. |
Use Scenario: Used when engineering teams must keep older programmable hardware in production or repair channels. IC Role: Preserves the logic role originally assigned to the FPGA device. Use Value: Reduces disruption in sustaining engineering and replacement workflows. |
Equivalent & Alternatives
When evaluating a XC3S1200E-4FGG320I equivalent, engineers should compare FPGA family generation, package continuity, speed grade, operating range, logic density, and the level of redesign the system can accept.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1200E-4FTG256C | Closely related orderable option in the same or neighboring AMD/Xilinx FPGA family with a comparable system role. | Used when the platform should remain close to the same density or package strategy. | Compare package, suffix, and timing margin before substitution. |
| XC3S1600E-4FGG320C | Alternative programmable logic option that may fit a similar role with a different density or family emphasis. | Used when the design can consider a nearby logic class or updated footprint path. | Choose according to board fit, platform continuity, and validation scope. |
Compared with XC3S1200E-4FTG256C, XC3S1200E-4FGG320I selection depends on exact package continuity, speed grade, and environmental suffix. XC3S1200E-4FGG320I vs XC3S1600E-4FGG320C selection depends on whether the system should remain on the same FPGA path or shift to a nearby family or density with different integration tradeoffs.
Quality
XC3S1200E-4FGG320I should be sourced as original AMD/Xilinx programmable logic inventory through traceable channels. Quality checks may include package inspection, marking validation, configuration-access checks, and board-level replacement verification.
For lifecycle-sensitive programs, validation should include configuration bring-up, timing confirmation, power-sequencing review, and interface checks against the target implementation.
Availability
XC3S1200E-4FGG320I is relevant to embedded programmable logic, subsystem integration, and lifecycle-sensitive FPGA deployments where configurable digital behavior must be preserved.
Supply support may include volume procurement planning, scheduled delivery arrangements, traceable sourcing management, and long-term supply support for OEM, industrial electronics, automotive electronics, and embedded product programs. Sample and NPI supply support, as well as urgent in-stock supply support, can also be arranged for prototype builds, pilot runs, and time-critical production needs.
For production and service builds, confirming package continuity, lifecycle status, configuration compatibility, and sourcing stability helps reduce programmable-logic supply risk.
Manufacturer
AMD is a semiconductor manufacturer whose adaptive computing and programmable logic portfolio includes FPGA devices, CPLDs, configuration solutions, embedded processing platforms, and related development technologies for industrial, communication, computing, automotive, and embedded electronic systems.
Spartan-3E devices target cost-sensitive FPGA designs with balanced logic, memory, and I/O resources for embedded control, digital bridging, and interface concentration. Higher Spartan-3E density point for larger embedded logic, memory buffering, and programmable interface workloads.
FAQ
What is XC3S1200E-4FGG320I used for?
XC3S1200E-4FGG320I is used for programmable digital logic, interface handling, timing coordination, and subsystem integration in embedded FPGA-based hardware.
Where can I find the XC3S1200E-4FGG320I datasheet download?
The XC3S1200E-4FGG320I datasheet is available through the confirmed source used for this AMD/Xilinx FPGA family and orderable option.
What should be considered in XC3S1200E-4FGG320I pinout design?
Designers should preserve package compatibility, power domains, configuration access, and validated I/O assignment when integrating or replacing the device.
Is XC3S1200E-4FGG320I aimed at new designs or sustaining designs?
XC3S1200E-4FGG320I can serve both, but many orderable options in this range are especially relevant to sustaining, compatibility-driven, or lifecycle-sensitive FPGA programs.
What are common XC3S1200E-4FGG320I equivalent solutions?
Common candidates include XC3S1200E-4FTG256C and XC3S1600E-4FGG320C depending on package fit, family generation, logic density, and platform continuity goals.
XC3S1200E-4FGG320I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 250
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1200E-4FGG320I FAQ
1.How can I place an order for XC3S1200E-4FGG320I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-4FGG320I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-4FGG320I reliable?
The price and inventory of XC3S1200E-4FGG320I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-4FGG320I is usually 5 days.
3.What payment methods are accepted for XC3S1200E-4FGG320I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-4FGG320I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1200E-4FGG320I?
XC3S1200E-4FGG320I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-4FGG320I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-4FGG320I?
For technical support, including XC3S1200E-4FGG320I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-4FGG320I requirements.
6.How does Aetrix verify that XC3S1200E-4FGG320I is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-4FGG320I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-4FGG320I meets industry standards.
7.What is the process for return or replacement of XC3S1200E-4FGG320I?
All XC3S1200E-4FGG320I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-4FGG320I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-4FGG320I part is unused and in its original packaging.
Return procedure for XC3S1200E-4FGG320I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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