AMD XC3S250E-4TQG144I

Overview

XC3S250E-4TQG144I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250,000 system gates, 5,760 logic cells, and 216 Kbits of block RAM. It features 144-pin TQFP packaging, -4 speed grade, and industrial temperature range (-40°C to +100°C), used in motor control interface modules and industrial I/O expansion.

For engineers reviewing the XC3S250E-4TQG144I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count (108 user I/Os), embedded RAM capacity, speed grade timing compliance, and industrial-grade thermal performance.

Technical Context

The XC3S250E-4TQG144I implements a fully configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18 multipliers and supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL.

Configuration is performed via master serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction across its two DCM blocks.

Key Specifications

Pinout & Package

XC3S250E-4TQG144I is housed in a 144-pin Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad (non-electrical). Pin assignment follows Xilinx DS312 v2.5 specification.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and interface applications.

Compared with XC3S250E-4TQG144I, the XC3S500E-4TQG144I offers immediate logic headroom within identical mechanical and thermal constraints, while the XC6SLX9-2TQG144I demands layout changes but delivers superior power-performance trade-offs and extended lifecycle availability.

Availability

XC3S250E-4TQG144I is available at Aetrix Electronics and suitable for industrial motor control, factory automation I/O expansion, and programmable logic controller (PLC) modules requiring stable component supply and long-term obsolescence management.

Supply support for XC3S250E-4TQG144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Spartan FPGA product line for cost-sensitive, high-volume industrial and automotive applications.

The Spartan-3E family was designed specifically for logic-intensive embedded control, bridging, and interface consolidation where predictable timing, moderate density, and industrial temperature operation are essential.

FAQ

What is the maximum operating frequency supported by XC3S250E-4TQG144I?

The XC3S250E-4TQG144I speed grade -4 guarantees internal logic timing closure up to 333 MHz and I/O interface operation up to 220 MHz, as verified in Xilinx DS312 v2.5. Actual achievable frequency depends on design placement, routing, and clock domain structure. The XC3S250E-4TQG144I DCMs support output frequencies up to 320 MHz with jitter below 150 ps RMS.

Does XC3S250E-4TQG144I support JTAG boundary-scan for in-system programming?

Yes, XC3S250E-4TQG144I includes IEEE 1149.1-compliant JTAG circuitry with TDI, TDO, TMS, and TCK pins. It supports configuration through JTAG mode, enabling in-system programming, debugging, and boundary-scan testing without requiring external PROM. The XC3S250E-4TQG144I also supports readback and verification of configuration memory via JTAG.

What power supply voltages does XC3S250E-4TQG144I require?

XC3S250E-4TQG144I requires three distinct supply rails: 1.2 V for core logic (VCCINT), 2.5 V for auxiliary circuits and configuration (VCCAUX), and 3.3 V or 2.5 V for I/O banks (VCCO), depending on selected I/O standard. All supplies must be independently decoupled per Xilinx UG331 guidelines. The XC3S250E-4TQG144I does not support single-rail operation.

Can XC3S250E-4TQG144I be used in automotive applications?

No, XC3S250E-4TQG144I is rated for industrial temperature range (-40°C to +100°C), not automotive AEC-Q100 qualification. While it operates reliably within that thermal envelope, it lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation. For automotive use, consider AMD/Xilinx Automotive Spartan-3A or newer Spartan-7 families instead of XC3S250E-4TQG144I.

Is there a pin-compatible replacement for XC3S250E-4TQG144I with higher logic capacity?

XC3S500E-4TQG144I is pin-compatible with XC3S250E-4TQG144I and shares identical TQFP-144 packaging, speed grade (-4), and thermal specifications. It doubles the logic cell count to 11,520 and increases block RAM to 360 Kbits while maintaining full backward compatibility at the board level. No PCB changes are required to upgrade from XC3S250E-4TQG144I to XC3S500E-4TQG144I.