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AMD XC3S700AN-4FGG484C
- Part No.:
- XC3S700AN-4FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S700AN-4FGG484C.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:578
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Product details
Overview
XC3S700AN-4FGG484C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 700,000 system gates, 17,280 logic cells, and integrated flash memory for single-chip configuration. It features 484-pin Fine-Pitch Ball Grid Array (FBGA) packaging, operates at -4 speed grade, and supports 1.2 V core voltage with 3.3 V I/O tolerance. It is used in industrial control logic, reconfigurable I/O interfaces, and embedded vision preprocessing.
For engineers reviewing the XC3S700AN-4FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include integrated flash capacity, I/O count (373 user I/Os), configuration mode support (Master Serial, Slave SelectMAP), and thermal performance in compact industrial enclosures.
Technical Context
The XC3S700AN-4FGG484C implements a fully SRAM-based logic fabric with embedded block RAM (288 kbits), digital clock managers (DCMs), and multipliers (18×18). Its on-chip flash enables instant-on operation without external PROM and supports dual-boot capability via internal flash partitioning.
Configuration is supported through JTAG, Master Serial, and Slave SelectMAP modes. The device includes 22 dedicated global clock lines and supports LVCMOS, LVTTL, PCI, and SSTL I/O standards across its 373 user-configurable pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - defines maximum combinational/sequential logic capacity for custom state machines or protocol engines |
| System Gates | 700,000 - indicates relative logic density benchmarked against ASIC gate count equivalents |
| User I/O Pins | 373 - supports high-pin-count peripheral bridging (e.g., parallel camera interface + SPI + UART) |
| Block RAM | 288 kbits - enables local data buffering for video line storage or FIFO implementation |
| Embedded Flash | 4 Mbit - eliminates external configuration PROM and enables field-upgradable bitstreams |
| Speed Grade | -4 - specifies worst-case propagation delay timing for critical path synthesis targets |
| Core Voltage | 1.2 V ±3% - determines power delivery design requirements and thermal dissipation profile |
Pinout & Package
XC3S700AN-4FGG484C uses a 484-ball Fine-Pitch BGA (FGG) package with 23×23 array, 1.0 mm ball pitch, and thermal pad exposed on underside for enhanced heat transfer in sealed industrial housings.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be filtered with low-ESR ceramic capacitors near package corner balls to meet 1.2 V rail stability |
| VCCO_0 | I/O bank power (Bank 0) | Configures voltage level for all I/Os in Bank 0 (supports 1.2–3.3 V) |
| PROGRAM_B | Active-low configuration reset | Pulling low initiates full reconfiguration from internal flash or external source |
| DONE | Configuration status output | Drives high when bitstream loading completes and device enters user mode |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables in-system programming, debugging, and IEEE 1149.1 compliance testing |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | 4 Mbit nonvolatile storage eliminates external configuration PROM and reduces BOM count by one component |
| Dual-Boot Capability | Allows two independent bitstreams stored in flash partitions for fail-safe firmware updates |
| Digital Clock Managers (DCMs) | Provides jitter-reduced clock synthesis, phase shifting, and frequency multiplication without external PLL ICs |
| 373 User I/Os | Supports mixed-voltage I/O banks enabling direct interfacing with legacy 5 V, 3.3 V, and 1.8 V peripherals |
| Multi-Voltage I/O Support | Each of 8 I/O banks independently configurable for LVCMOS, LVTTL, PCI, or SSTL standards |
Applications
| Industrial Motion Controller | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM outputs. IC Role / Device Role / Timing Role: FPGA fabric executes deterministic logic for position interpolation and safety monitoring; DCMs generate synchronized clocks for ADC sampling and PWM generation. Use Value: Integrated flash enables secure, tamper-resistant firmware storage; 373 I/Os accommodate encoder inputs, analog sensor channels, and isolated communication buses. | Use Scenario: High-speed parallel image data capture from CMOS sensors followed by real-time histogram equalization and edge detection. IC Role / Device Role / Timing Role: Configurable logic implements pixel pipeline processing; block RAM buffers line data between stages; DCMs align sensor clock domains with processing clock. Use Value: On-chip 288 kbits RAM avoids external SRAM latency; 1.2 V core reduces power in thermally constrained diagnostic equipment enclosures. |
| Automated Test Equipment (ATE) | Communications Backplane Interface |
Use Scenario: Pin electronics module requiring programmable waveform generation, pattern matching, and high-speed digital I/O switching. IC Role / Device Role / Timing Role: FPGA implements pattern sequencer and comparator logic; JTAG interface enables in-system calibration and test vector upload. Use Value: Dual-boot flash allows ATE firmware rollback during qualification; 373 I/Os support simultaneous multi-site DUT testing. | Use Scenario: Protocol translation between proprietary backplane bus and standard PCIe or Gigabit Ethernet links. IC Role / Device Role / Timing Role: FPGA serves as bridge controller with SERDES-less parallel interface handling; I/O banks configured for 3.3 V LVTTL and 2.5 V SSTL signaling. Use Value: Multi-bank voltage support enables direct connection to mixed-signaling backplane without level shifters; integrated flash ensures boot reliability after hot-swap events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | Higher logic density (19,536 LCs), same -4 speed grade, but no integrated flash; requires external PROM | Lacks single-chip configuration; suitable where larger logic capacity outweighs flash dependency | Select when design requires >17K logic cells and external configuration is acceptable |
| XC6SLX75-3FGG484C | Next-generation Spartan-6 architecture; 74,691 logic cells, 3.3 V/2.5 V/1.8 V I/O, no integrated flash | Offers higher performance and lower static power, but lacks on-chip flash and requires migration effort | Choose for new designs needing scalability beyond Spartan-3AN limits and where external configuration is planned |
Compared with XC3S1000-4FGG456C and XC6SLX75-3FGG484C, the XC3S700AN-4FGG484C uniquely delivers flash-based instant-on operation and field-upgradability within the Spartan-3 footprint-critical for maintenance-sensitive industrial deployments where external PROM adds failure points and board space.
Availability
XC3S700AN-4FGG484C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interfaces, and automated test equipment requiring stable component supply and long-term lifecycle assurance.
Supply support for XC3S700AN-4FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3AN product line was designed specifically for applications demanding single-chip configuration, instant-on operation, and robust industrial temperature tolerance without external configuration memory.
FAQ
What is the maximum operating temperature range for the XC3S700AN-4FGG484C?
The XC3S700AN-4FGG484C is rated for commercial (0°C to +70°C) and industrial (-40°C to +85°C) temperature grades. The suffix 'C' in the part number denotes the commercial grade; industrial-grade variants carry an 'I' suffix (e.g., XC3S700AN-4FGG484I). Thermal derating applies above 70°C ambient for sustained operation.
Does the XC3S700AN-4FGG484C require an external configuration PROM?
No, the XC3S700AN-4FGG484C integrates 4 Mbit of on-chip flash memory, enabling self-contained configuration without external PROM. It supports Master Serial, Slave SelectMAP, and JTAG configuration modes directly from internal flash, reducing BOM count and improving system reliability.
How many Digital Clock Managers (DCMs) does the XC3S700AN-4FGG484C include?
The XC3S700AN-4FGG484C includes four Digital Clock Managers (DCMs). Each DCM provides clock doubling, halving, phase shifting, duty cycle correction, and jitter reduction-enabling precise clock domain management for mixed-speed I/O and synchronous logic blocks within the XC3S700AN-4FGG484C.
Can the XC3S700AN-4FGG484C support dual-boot functionality?
Yes, the XC3S700AN-4FGG484C supports dual-boot functionality using its internal 4 Mbit flash. Two independent bitstreams can be stored in separate flash partitions, allowing safe firmware updates with rollback capability-critical for unattended industrial systems where recovery from failed configuration is essential.
What I/O standards are supported by the XC3S700AN-4FGG484C?
The XC3S700AN-4FGG484C supports LVCMOS, LVTTL, PCI, and SSTL I/O standards across its eight configurable I/O banks. Each bank operates independently at voltages from 1.2 V to 3.3 V, enabling direct interfacing with diverse peripherals without external level-shifting circuitry in the XC3S700AN-4FGG484C design.
XC3S700AN-4FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 372
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S700AN-4FGG484C FAQ
1.How can I place an order for XC3S700AN-4FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700AN-4FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700AN-4FGG484C reliable?
The price and inventory of XC3S700AN-4FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700AN-4FGG484C is usually 5 days.
3.What payment methods are accepted for XC3S700AN-4FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700AN-4FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700AN-4FGG484C?
XC3S700AN-4FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700AN-4FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700AN-4FGG484C?
For technical support, including XC3S700AN-4FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700AN-4FGG484C requirements.
6.How does Aetrix verify that XC3S700AN-4FGG484C is sourced from the original manufacturer or authorized distributors?
All XC3S700AN-4FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700AN-4FGG484C meets industry standards.
7.What is the process for return or replacement of XC3S700AN-4FGG484C?
All XC3S700AN-4FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700AN-4FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700AN-4FGG484C part is unused and in its original packaging.
Return procedure for XC3S700AN-4FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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