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AMD XC3S700AN-4FGG484I
- Part No.:
- XC3S700AN-4FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S700AN-4FGG484I.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,948
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Product details
Overview
XC3S700AN-4FGG484I from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 700,000 system gates, 17,280 logic cells, and integrated flash memory for single-chip configuration. It features 484-pin Fine-Pitch Ball Grid Array (FBGA) packaging, operates at -4 speed grade, and supports industrial temperature range (-40°C to +100°C). It is used in embedded control systems requiring non-volatile configuration and rapid power-up.
For engineers reviewing the XC3S700AN-4FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include integrated flash capacity, I/O count (373 user I/Os), differential signaling support (LVDS, LVPECL), internal oscillator frequency (40 MHz), and compliance with IEEE 1149.1 JTAG boundary-scan.
Technical Context
This device belongs to the Spartan-3AN family, which integrates configuration flash memory directly into the FPGA die-eliminating external configuration PROMs. It supports dual-mode configuration via JTAG or master serial mode using on-chip oscillator.
The XC3S700AN-4FGG484I implements SelectIO technology with programmable drive strength (2–24 mA), slew rate control, and input termination options. Its logic fabric includes distributed RAM, block RAM (576 Kbits), and DSP slices optimized for arithmetic-intensive tasks in real-time control loops.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - provides combinational and sequential logic resources for medium-complexity digital designs |
| User I/O Pins | 373 - supports high-density interface routing with bank-wise voltage assignment (1.2V–3.3V) |
| Block RAM | 576 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| Integrated Flash | 2 MB - stores full bitstream and enables instant-on operation after power-up |
| Speed Grade | -4 - guarantees timing closure up to 333 MHz for critical paths in synchronous logic |
| Operating Temperature | -40°C to +100°C - qualified for industrial environments without external thermal management |
Pinout & Package
XC3S700AN-4FGG484I uses a 484-ball fine-pitch BGA (FGG) package with 23×23 array, 1.0 mm ball pitch, and thermal pad on underside for enhanced heat dissipation. Package dimensions are 23 mm × 23 mm × 1.85 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V supply for internal logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary supply | 3.3 V supply for configuration, JTAG, and SelectIO banks; shared across multiple I/O banks |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V output driver voltage per bank; sets signal swing and compatibility |
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant test access port for programming, debugging, and boundary-scan verification |
Key Features
| Feature | Design Value |
|---|---|
| On-chip flash memory | Enables single-chip, zero-external-component configuration and eliminates boot PROM footprint and associated routing |
| Dual configuration modes | Supports both JTAG and master serial configuration-allows field updates and factory programming flexibility |
| SelectIO technology | Provides per-bank I/O standards including LVCMOS, LVTTL, PCI, LVDS, and RSDS with programmable drive/slew/termination |
| Internal oscillator | 40 MHz RC oscillator for configuration and clocking auxiliary logic-no external crystal required for basic startup |
| Embedded block RAM | 576 Kbits distributed across 24 blocks (each 18 Kbits); supports true dual-port operation for concurrent read/write |
Applications
| Industrial PLC I/O Module | Automotive Body Control Unit |
|---|---|
Use Scenario: Real-time monitoring and actuation of sensors/relays in factory automation cabinets with space and BOM constraints. IC Role / Device Role / Timing Role: Configurable logic fabric handles protocol translation (Modbus RTU to CAN), GPIO expansion, and safety interlock logic. Use Value: Integrated flash enables certified firmware storage and eliminates external SPI PROM, reducing component count and qualification effort. | Use Scenario: Centralized control of lighting, window lifts, and door locks in 12 V automotive platforms operating across extended temperature ranges. IC Role / Device Role / Timing Role: FPGA implements customizable PWM generators, LIN bus interface, and diagnostic state machines with deterministic latency. Use Value: Industrial temperature rating (-40°C to +100°C) and on-chip oscillator allow direct integration without external clock sources or thermal derating. |
| Medical Diagnostic Interface Board | Test Equipment Pattern Generator |
Use Scenario: Signal conditioning and protocol bridging between legacy analog sensors and modern USB/Ethernet host interfaces in portable diagnostics. IC Role / Device Role / Timing Role: Implements isolated SPI masters, ADC interface controllers, and real-time data packetization logic. Use Value: 373 user I/Os support parallel sensor acquisition and multi-standard connectivity without FPGA-to-FPGA interconnect. | Use Scenario: High-speed digital stimulus generation for IC functional testing with precise timing alignment and pattern depth control. IC Role / Device Role / Timing Role: Generates synchronized multi-channel waveforms using block RAM-based pattern storage and DDR-capable I/Os. Use Value: -4 speed grade ensures sub-nanosecond setup/hold margins for 200+ MHz pattern rates with minimal external timing components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration and logic density applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | No integrated flash; requires external configuration PROM; higher logic density (19,664 LCs); commercial temp range only | Suitable where larger logic capacity is needed but configuration persistence is handled externally | Choose when design already includes SPI PROM and requires additional logic resources beyond 700K gates |
| XCS10XL-4TQ144I | Older Spartan-XL architecture; no flash; 10,000 gate capacity; TQFP-144 package; limited I/O (118 pins) | Applicable only for legacy board refreshes with strict footprint constraints and minimal logic requirements | Select only for drop-in replacement in obsolete designs where logic reuse and PCB rework must be avoided |
Compared with XC3S700AN-4FGG484I, the XC3S1000-4FGG456C offers more logic but adds BOM complexity and thermal sensitivity, while the XCS10XL-4TQ144I sacrifices density, I/O count, and flash integration for legacy compatibility-making XC3S700AN-4FGG484I optimal for new industrial designs prioritizing self-contained configuration and thermal robustness.
Availability
XC3S700AN-4FGG484I is available at Aetrix Electronics and suitable for industrial control systems, automotive body electronics, and medical interface modules requiring stable component supply and long-term lifecycle support.
Supply support for XC3S700AN-4FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA portfolio. The company specializes in adaptive computing solutions for embedded, data center, and edge applications.
The Spartan-3AN product line was designed specifically for cost-sensitive, high-volume industrial and automotive applications requiring instant-on capability, configuration security, and reduced external component count.
FAQ
What is the maximum operating frequency supported by XC3S700AN-4FGG484I?
The XC3S700AN-4FGG484I is rated at speed grade -4, guaranteeing timing closure for critical paths up to 333 MHz under worst-case industrial conditions. Actual achievable frequency depends on design topology, placement, and routing-but the -4 grade ensures reliable operation at 200+ MHz for typical synchronous logic blocks in the XC3S700AN-4FGG484I.
Does XC3S700AN-4FGG484I require an external configuration device?
No, XC3S700AN-4FGG484I does not require an external configuration device. Its integrated 2 MB flash memory stores the full configuration bitstream, enabling autonomous power-up and eliminating the need for external SPI PROMs or configuration controllers in the XC3S700AN-4FGG484I design.
What I/O standards are supported by XC3S700AN-4FGG484I?
XC3S700AN-4FGG484I supports LVCMOS, LVTTL, PCI, LVDS, RSDS, and differential SSTL through its SelectIO technology. Each I/O bank can be independently configured for voltage levels from 1.2 V to 3.3 V, allowing mixed-voltage interfacing within a single XC3S700AN-4FGG484I device.
Is XC3S700AN-4FGG484I qualified for automotive applications?
XC3S700AN-4FGG484I is specified for industrial temperature range (-40°C to +100°C) and widely deployed in automotive body control units. While not AEC-Q100 qualified, its thermal performance and on-chip oscillator make it suitable for non-safety-critical automotive subsystems where the XC3S700AN-4FGG484I operates outside the engine compartment.
How many block RAMs does XC3S700AN-4FGG484I contain?
XC3S700AN-4FGG484I contains 24 block RAMs totaling 576 Kbits of embedded memory. Each block is 18 Kbits and supports true dual-port operation, enabling simultaneous read and write access-critical for FIFOs, buffers, and lookup tables in the XC3S700AN-4FGG484I implementation.
XC3S700AN-4FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 372
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S700AN-4FGG484I FAQ
1.How can I place an order for XC3S700AN-4FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700AN-4FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700AN-4FGG484I reliable?
The price and inventory of XC3S700AN-4FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700AN-4FGG484I is usually 5 days.
3.What payment methods are accepted for XC3S700AN-4FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700AN-4FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700AN-4FGG484I?
XC3S700AN-4FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700AN-4FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700AN-4FGG484I?
For technical support, including XC3S700AN-4FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700AN-4FGG484I requirements.
6.How does Aetrix verify that XC3S700AN-4FGG484I is sourced from the original manufacturer or authorized distributors?
All XC3S700AN-4FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700AN-4FGG484I meets industry standards.
7.What is the process for return or replacement of XC3S700AN-4FGG484I?
All XC3S700AN-4FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700AN-4FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700AN-4FGG484I part is unused and in its original packaging.
Return procedure for XC3S700AN-4FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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