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AMD XC3S700AN-4FGG484I

Part No.:
XC3S700AN-4FGG484I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC3S700AN-4FGG484I.pdf
Description:
IC FPGA 372 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,948

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Product details

Overview

XC3S700AN-4FGG484I from AMD is a programmable logic device in the Spartan-3AN line designed for systems that need more flexibility than CPLD-style glue logic but still require controlled package, timing, and qualification choices. The device pairs the FPGA resource set with 484-BBGA, which is suited to higher-density FPGA logic and wider I/O breakout, making it useful in embedded digital subsystems, interface engines, and long-life programmable hardware platforms.

Spartan-3AN devices pair Spartan-3A class programmable logic with nonvolatile configuration convenience for embedded systems that benefit from integrated startup behavior. For engineers reviewing the XC3S700AN-4FGG484I datasheet, XC3S700AN-4FGG484I pinout, XC3S700AN-4FGG484I application, or XC3S700AN-4FGG484I equivalent, this device is widely used in embedded processing platforms, digital interface bridges, industrial control systems, communications equipment, sensor aggregation hardware, and programmable accelerator subsystems.

Technical Context

In real hardware, XC3S700AN-4FGG484I is used as an FPGA platform rather than a fixed-function controller. The selected Spartan-3AN density and speed grade 4 orderable option. matter because logic capacity, memory blocks, DSP availability, and I/O reach all influence whether the device can absorb the intended control, buffering, and protocol workload.

The exact orderable code is important here: 484-BBGA affects escape routing and memory-interface planning, speed grade 4 orderable option. affects timing margin, and the industrial temperature option indicated by the suffix. determines whether the part can be approved for the target deployment range. That combination often decides which device is actually released into a production BOM.

Larger Spartan-3AN density point for embedded systems that need more programmable logic and nonvolatile startup convenience. In practice, this means XC3S700AN-4FGG484I is typically chosen when the system needs FPGA flexibility for control-heavy datapaths, local acceleration, interface bridging, or memory-connected logic while still respecting board-area and package constraints.

Key Specifications

Parameter Value and Actual Design Meaning
Device Type Spartan-3AN FPGA.
Series Spartan-3AN
Package 484-BBGA package with tray packing.
Speed Grade Speed grade 4 orderable option.
Operating Range Industrial temperature option indicated by the suffix.
Architecture Role Field-programmable logic device for configurable digital processing, interface adaptation, and subsystem integration.
Integration Focus Used where programmable logic, memory connectivity, and board-specific digital control need to be consolidated.
Programming Model Configuration-based FPGA platform within the referenced AMD family.

Pinout & Package

The XC3S700AN-4FGG484I pinout includes configurable user I/O, dedicated power rails, configuration and JTAG connections, clock-capable pins, and package-specific escape resources within 484-BBGA package.

For PCB design, the main concerns are clean power distribution, configuration-access planning, clock integrity, and package-aware escape routing around memory and high-activity interface banks.

Pin / Function PCB Design and Circuit Role
User I/O Pins Configurable pins used for subsystem interfaces, memory buses, control signals, and application-specific logic connectivity.
Clock Inputs Dedicated or clock-capable pins supporting timing distribution and synchronous FPGA operation.
Configuration / JTAG Pins Used for device programming, configuration control, and boundary-scan access.
Power Rails Support FPGA core, auxiliary, and I/O voltage domains required by the selected device family.
Ground Pins Provide return paths for stable power integrity and high-speed digital operation.

Key Features

  • Configurable FPGA fabric supports board-specific logic, control, and interface integration.
  • Package options scale I/O reach for compact through higher-density digital platforms.
  • Orderable speed grades help align the device with board timing and interface targets.
  • Suitable for consolidating subsystem logic, buffering, and programmable control functions.
  • Supports embedded system flexibility across industrial, communications, and computing use cases.
  • Field-programmable behavior preserves updateability across platform revisions.

Applications

Embedded Processing Platforms Industrial and Machine Control

Use Scenario: Used in digital systems that need FPGA-based control, buffering, or local acceleration around processors and custom logic.

IC Role: Provides configurable logic resources near embedded compute blocks.

Use Value: Improves flexibility for evolving control and interface requirements.

Use Scenario: Used in platforms that need programmable digital interfacing, timing coordination, and subsystem integration.

IC Role: Acts as the configurable logic layer between sensors, memory, and control paths.

Use Value: Supports maintainable and adaptable industrial hardware architectures.

Communications and Data Interfaces Signal Aggregation and System Glue

Use Scenario: Used where protocol bridging, framing logic, or board-level connectivity must stay field-programmable.

IC Role: Implements adaptable interface engines and control-plane logic.

Use Value: Helps avoid respins when interface requirements change.

Use Scenario: Used to collect subsystem control, memory-side logic, and data-routing functions into one programmable device.

IC Role: Centralizes digital support logic within the FPGA fabric.

Use Value: Reduces auxiliary logic count while preserving scalability.

Equivalent & Alternatives

When evaluating a XC3S700AN-4FGG484I equivalent, engineers should compare family architecture, package, speed grade, operating range, memory-interface planning, and overall programmable logic fit.

Alternative Part Technical Difference Application Difference Selection Advice
XC3S700AN-4FGG484C Closely related orderable option in the same or adjacent family density with a different package, speed, or qualification emphasis. Used when the board stays in the same general FPGA family but requires a different orderable fit. Compare package, speed grade, temperature suffix, and validated system margins before substitution.
XC3S400AN-4FGG400C Alternative programmable logic option that can serve a similar subsystem role with a different density or family emphasis. Used in comparable programmable-control or interface-heavy applications when the design tradeoff shifts. Choose according to logic capacity, package routing, memory needs, and platform continuity.

Compared with XC3S700AN-4FGG484C, XC3S700AN-4FGG484I selection depends on exact package, speed grade, qualification suffix, and board-routing fit. XC3S700AN-4FGG484I vs XC3S400AN-4FGG400C selection depends on whether the design should remain in the same FPGA family path or shift to another density or architecture with different integration tradeoffs.

Quality

XC3S700AN-4FGG484I should be sourced as original AMD programmable logic inventory through traceable supply channels. Quality checks may include package inspection, top-mark validation, configuration access checks, and board-level bring-up verification.

Production validation should include power-sequencing review, configuration reliability, timing-closure confirmation, clock integrity checks, and signal-integrity review on high-activity I/O paths.

Availability

XC3S700AN-4FGG484I is suitable for configurable digital logic, subsystem integration, and FPGA-based interface or control functions in embedded, industrial, and communications platforms.

Supply support may include volume procurement planning, scheduled delivery arrangements, traceable sourcing management, and long-term supply support for OEM, industrial electronics, automotive electronics, and embedded product programs. Sample and NPI supply support, as well as urgent in-stock supply support, can also be arranged for prototype builds, pilot runs, and time-critical production needs.

For production builds, confirming package option, speed grade, operating-range suffix, lifecycle status, and sourcing continuity helps reduce programmable-logic procurement risk.

Manufacturer

AMD is a semiconductor manufacturer whose adaptive computing and programmable logic portfolio includes FPGA devices, CPLDs, configuration solutions, embedded processing platforms, and related development technologies for industrial, communication, computing, automotive, and embedded electronic systems.

Spartan-3AN devices pair Spartan-3A class programmable logic with nonvolatile configuration convenience for embedded systems that benefit from integrated startup behavior. Larger Spartan-3AN density point for embedded systems that need more programmable logic and nonvolatile startup convenience.

FAQ

What is XC3S700AN-4FGG484I used for?

XC3S700AN-4FGG484I is used for configurable logic, interface concentration, memory-side support, and embedded digital subsystem integration in FPGA-based hardware.

Where can I find the XC3S700AN-4FGG484I datasheet download?

The XC3S700AN-4FGG484I datasheet can be accessed from the confirmed source used for this FPGA family and orderable option.

What should be considered in XC3S700AN-4FGG484I pinout design?

Designers should account for configuration access, power domains, clock planning, and package-driven escape routing around high-activity I/O and memory-related signals.

Is XC3S700AN-4FGG484I a CPLD?

No. It is an FPGA orderable option in an AMD programmable logic family intended for broader configurable logic and subsystem integration tasks.

What are common XC3S700AN-4FGG484I equivalent solutions?

Common candidates include XC3S700AN-4FGG484C and XC3S400AN-4FGG400C depending on package, family architecture, logic density, and system-level integration needs.

XC3S700AN-4FGG484I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3AN
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC3S700AN-4FGG484I FAQ

1.How can I place an order for XC3S700AN-4FGG484I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S700AN-4FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S700AN-4FGG484I reliable?

The price and inventory of XC3S700AN-4FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700AN-4FGG484I is usually 5 days.

3.What payment methods are accepted for XC3S700AN-4FGG484I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700AN-4FGG484I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S700AN-4FGG484I?

XC3S700AN-4FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S700AN-4FGG484I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S700AN-4FGG484I?

For technical support, including XC3S700AN-4FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700AN-4FGG484I requirements.

6.How does Aetrix verify that XC3S700AN-4FGG484I is sourced from the original manufacturer or authorized distributors?

All XC3S700AN-4FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700AN-4FGG484I meets industry standards.

7.What is the process for return or replacement of XC3S700AN-4FGG484I?

All XC3S700AN-4FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700AN-4FGG484I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S700AN-4FGG484I part is unused and in its original packaging.

Return procedure for XC3S700AN-4FGG484I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S700AN-4FGG484I Tags

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