AMD XC6SLX75-2FGG676C

Overview

XC6SLX75-2FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, 3.2 MB of total block RAM, and operates at -2 speed grade with I/O support up to 1.25 Gbps. It is used in industrial video processing systems requiring deterministic latency and multi-channel pixel data handling.

For engineers reviewing the XC6SLX75-2FGG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2 V to 3.3 V), embedded memory depth per BRAM block (18 Kb), and differential signaling compliance with LVDS, TMDS, and RSDS standards.

Technical Context

The XC6SLX75-2FGG676C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates six CMT clock management tiles-each containing two DCMs and one PLL-for jitter-reduced clock synthesis and phase alignment across multiple domains.

Configuration is supported via Master SPI, Slave Serial, or JTAG modes, with bitstream encryption enabled through AES-256 and HMAC-SHA-256 authentication. Configuration memory is stored in on-chip SEU detection/correction circuitry supporting single-event upset mitigation during operation.

Key Specifications

Pinout & Package

XC6SLX75-2FGG676C is housed in a 676-pin Fine-Pitch Flip-Chip BGA (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad exposed on underside supports conduction cooling in high-density PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and acceleration applications.

Compared with XC6SLX75-3FGG676C, the XC6SLX75-2FGG676C trades 15% timing margin for lower static power (18% less typical ICCINT at 667 MHz); versus XCKU035-2FFVA676E, it offers proven qualification for extended temperature industrial use with simpler thermal design and no transceiver calibration overhead.

Availability

XC6SLX75-2FGG676C is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and programmable logic controller I/O hubs requiring stable component supply across long production lifecycles.

Supply support for XC6SLX75-2FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.

The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power logic integration, flexible I/O, and industrial-grade reliability - particularly in video, industrial control, and communications infrastructure.

FAQ

What is the maximum operating junction temperature for XC6SLX75-2FGG676C?

The XC6SLX75-2FGG676C is rated for a maximum junction temperature of 100°C under continuous operation. This rating applies to the C-grade industrial temperature range (0°C to 85°C ambient) with proper PCB thermal design, including ≥4 thermal vias under the package's central thermal pad and ≥2 oz copper on inner layers. The XC6SLX75-2FGG676C includes an on-die temperature sensor that reports real-time die temperature via JTAG or I2C.

Does XC6SLX75-2FGG676C support partial reconfiguration?

Yes, the XC6SLX75-2FGG676C supports partial reconfiguration through Xilinx ISE Design Suite 14.7 and later toolchains. Verified use cases include runtime swapping of video compression IP blocks and protocol engines in medical imaging systems. The XC6SLX75-2FGG676C requires dedicated configuration controller logic and encrypted bitstream partitioning; full reconfiguration still resets all CLBs and BRAM contents.

What configuration modes are supported by XC6SLX75-2FGG676C?

The XC6SLX75-2FGG676C supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Master SPI uses on-chip oscillator and auto-starts from external SPI flash; Slave Serial allows external processor control of configuration timing. JTAG is used for debugging and programming during development. All modes support AES-256 bitstream encryption and HMAC-SHA-256 authentication for secure loading.

Can XC6SLX75-2FGG676C interface directly with DDR3 memory?

No, the XC6SLX75-2FGG676C does not include a hardened DDR3 memory controller. It supports DDR2-800 (400 MHz clock) with source-synchronous capture using IDDR/ODDR primitives and IDELAY/ODELAY calibration. For DDR3-1066, external PHY or third-party soft IP (e.g., Xilinx LogiCORE DDR3 Controller) must be implemented, requiring careful timing closure and board-level impedance control. The XC6SLX75-2FGG676C's I/O banks support 1.5 V VCCO required for DDR3 signaling.

What is the purpose of the INIT_B pin on XC6SLX75-2FGG676C?

The INIT_B pin on XC6SLX75-2FGG676C is an open-drain, active-low signal indicating configuration status. It is driven low during bitstream loading and CRC verification, then released (pulled high externally) upon successful validation. If CRC fails or configuration is interrupted, INIT_B remains low, halting further startup. This pin enables external monitoring and safe system reset sequencing in safety-critical applications using the XC6SLX75-2FGG676C.