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AMD XCV600-6BG560C
- Part No.:
- XCV600-6BG560C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 560-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV600-6BG560C.pdf
- Description:
- IC FPGA 404 I/O 560MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,876
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Product details
Overview
XCV600-6BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304 bits of block SelectRAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.
For engineers reviewing the XCV600-6BG560C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).
Technical Context
The XCV600-6BG560C implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaBlock-local interconnect, and VersaRing I/O ring for pin-locking. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and configurable storage elements supporting synchronous/asynchronous set/reset.
I/O functionality is organized into eight banks, each requiring shared VCCO and (where applicable) single VREF voltage; supported standards include LVTTL, LVCMOS2, PCI 3.3 V/5 V, SSTL2/3, HSTL Classes I/III/IV, GTL/GTL+, and CTT - with 5 V tolerance limited to LVTTL, LVCMOS2, and PCI 5 V inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 661,111 - defines total logic capacity for ASIC replacement estimation |
| Logic Cells | 15,552 - 4.5 logic cells per CLB across 48×72 array, enabling high-density RTL implementation |
| User I/O Pins | 512 - maximum available in BG560 package, distributed across eight I/O banks |
| Block RAM | 98,304 bits - 24 × 4,096-bit synchronous dual-ported blocks with independent port widths |
| Speed Grade | -6 - worst-case system performance up to 200 MHz, including I/O timing closure |
| DLL Count | 4 - dedicated delay-locked loops for clock deskew, phase alignment, and domain crossing |
| Operating Voltage | 2.5 V core (VCCINT), 3.3 V/2.5 V/1.5 V I/O (VCCO) - multi-voltage I/O banking enables mixed-standard interfaces |
Pinout & Package
Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant. Pinout defined in DS003-4 (v4.0) Module 4; includes 512 user I/O pins, 4 dedicated global clock inputs (GCLK0–GCLK3), 4 DLL reference clocks, configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG boundary-scan pins (TCK, TMS, TDI, TDO), and bank-specific VCCO/VREF supply pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Low-skew primary clock distribution nets feeding all DLLs and CLB clock trees |
| VCCO_0–VCCO_7 | I/O Bank Supply | Eight independent VCCO rails - each powers one I/O bank and sets output voltage level |
| VREF_0–VREF_7 | I/O Threshold Reference | Eight independent VREF inputs - each enables compatible input standards within its bank |
| DIN / CCLK / INIT / DONE | Configuration Interface | Master serial mode: DIN loads bitstream, CCLK clocks it, INIT indicates readiness, DONE confirms completion |
| TCK / TMS / TDI / TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for programming, debugging, and interconnect verification |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs with jitter compensation | Enables sub-nanosecond clock deskew across large designs and reliable 200 MHz system timing |
| Configurable LUT RAM/Shift Register | Each 4-input LUT acts as 16×1-bit RAM, 16×2-bit RAM, 32×1-bit RAM, or 16-bit shift register - eliminates external FIFOs in data capture paths |
| Synchronous dual-ported block RAM | 24 × 4,096-bit blocks support independent read/write operations on two ports - ideal for ping-pong buffering and bus bridging |
| Eight I/O banks with flexible voltage assignment | Allows simultaneous use of LVTTL (3.3 V), SSTL2 (2.5 V), and HSTL (1.5 V) on same device - reduces external level-shifting components |
| Dedicated carry chain & F5/F6 multiplexers | Supports high-speed arithmetic (e.g., 16-bit adders in <5 ns) and wide-input logic (up to 19 inputs) without LUT resource penalty |
Applications
| PCI Express Endpoint Interface | High-Speed Data Acquisition System |
|---|---|
Use Scenario: Implementing a 66-MHz, 32-bit PCI interface with DMA controller and local SRAM buffer in telecom line cards. IC Role / Device Role / Timing Role: Configurable logic fabric handles protocol state machines, address decoding, burst transfers, and clock domain crossing between PCI and internal logic. Use Value: Native 66-MHz PCI compliance and DLL-controlled clock management eliminate external clock synthesizers and simplify timing closure. |
Use Scenario: Capturing 100+ MSPS ADC samples, performing real-time FIR filtering, and streaming results over LVDS to host processor. IC Role / Device Role / Timing Role: LUT-based shift registers capture parallel ADC outputs; CLB arithmetic units execute filter taps; block RAM buffers intermediate data. Use Value: 16-bit shift register mode per LUT enables precise sample alignment; 200 MHz system clock supports multi-cycle DSP pipelines. |
| Industrial Motion Control Controller | Legacy Bus Protocol Bridge |
Use Scenario: Replacing ASIC in servo drive with integrated encoder interface, PWM generation, safety logic, and CAN physical layer support. IC Role / Device Role / Timing Role: IOBs configured for differential encoder inputs (LVDS-compatible); CLBs generate synchronized 20 kHz PWM with dead-time insertion. Use Value: Eight I/O banks allow concurrent 5 V-tolerant encoder inputs, 2.5 V PWM outputs, and 3.3 V communication interfaces - no level shifters required. |
Use Scenario: Bridging RS-485 Modbus RTU to Ethernet TCP/IP in building automation gateways using legacy field devices. IC Role / Device Role / Timing Role: UART logic implemented in CLBs; block RAM stores protocol translation tables; MAC/PHY interface uses SelectIO for MII signals. Use Value: Multi-standard SelectIO supports both 3.3 V MII and 5 V-tolerant RS-485 transceiver control - single FPGA replaces dual-chip bridge solution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV600-5BG560C | Slower speed grade (-5 vs. -6); 180 MHz max system clock vs. 200 MHz | Suitable for cost-sensitive designs where 200 MHz timing margin is unnecessary | Select when design meets -5 timing closure and lower power consumption is prioritized |
| XCV800-6BG560C | Higher density (888,439 gates, 21,168 logic cells), same package and speed grade | Provides headroom for design expansion or integration of additional peripherals | Choose when future-proofing or migrating from XCV600 with minimal PCB change |
Compared with XCV600-6BG560C, the -5 variant trades 20 MHz performance for lower static/dynamic power, while the XCV800-6BG560C retains identical pinout and speed but adds ~34% more logic and RAM - enabling feature-rich upgrades without layout revision.
Availability
XCV600-6BG560C is available at Aetrix Electronics and suitable for industrial motion controllers, telecom line card interfaces, high-speed data acquisition systems, and legacy protocol bridges requiring stable component supply during extended product lifecycles.
Supply support for XCV600-6BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as high-performance, high-capacity programmable logic solutions targeting demanding communications, computing, and industrial applications.
The Virtex family was designed to replace mask-programmed gate arrays with flexible, reconfigurable silicon - emphasizing place-and-route efficiency, hierarchical memory, and multi-standard I/O for system-level integration.
FAQ
What is the maximum operating frequency of the XCV600-6BG560C?
The XCV600-6BG560C has a -6 speed grade, specifying worst-case synchronous system clock rates up to 200 MHz, including I/O timing. This is validated across representative circuits like register-to-register paths (5.0 ns), pipelined multipliers (5.1 ns), and address decoders (4.4 ns) per DS003-1 Table 2. Actual achievable frequency depends on design complexity and placement.
Does the XCV600-6BG560C support 5 V tolerant I/O?
Yes, the XCV600-6BG560C supports 5 V tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, implemented via on-die Zener-like clamping to ground. However, 5 V tolerance applies only to inputs - outputs are strictly 2.5 V or 3.3 V referenced (VCCO), and VREF-dependent standards (e.g., HSTL, SSTL) are not 5 V tolerant.
How many block RAMs does the XCV600-6BG560C contain?
The XCV600-6BG560C contains 24 block SelectRAMs, totaling 98,304 bits of dedicated synchronous dual-ported memory. Each block is 4,096 bits with independently configurable port widths (e.g., 16×256, 8×512, 4×1024), enabling flexible buffering, FIFOs, and lookup table implementations without consuming CLB resources.
Is the XCV600-6BG560C still in production?
No, the XCV600-6BG560C is obsolete per Xilinx documentation DS003-1 (v4.0, March 2013), which states "The products listed in this data sheet are obsolete. See XCN10016 for further information." Aetrix Electronics provides last-time-buy support, legacy inventory, and migration path guidance for this end-of-life device.
What configuration modes does the XCV600-6BG560C support?
The XCV600-6BG560C supports four configuration modes: master serial (reads bitstream from external PROM via DIN/CCLK), slave serial (bitstream loaded by external controller), SelectMAP™ (parallel loading via 8- or 16-bit bus), and JTAG (boundary-scan programming via TCK/TMS/TDI/TDO). All modes use SRAM-based in-system reprogrammability.
XCV600-6BG560C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 560-LBGA Exposed Pad, Metal
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3456
- Number of Logic Elements/Cells:
- 15552
- Total RAM Bits:
- 98304
- Number of I/O:
- 404
- Number of Gates:
- 661111
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 560-MBGA (42.5x42.5)
XCV600-6BG560C FAQ
1.How can I place an order for XCV600-6BG560C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV600-6BG560C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV600-6BG560C reliable?
The price and inventory of XCV600-6BG560C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600-6BG560C is usually 5 days.
3.What payment methods are accepted for XCV600-6BG560C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600-6BG560C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV600-6BG560C?
XCV600-6BG560C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV600-6BG560C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV600-6BG560C?
For technical support, including XCV600-6BG560C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600-6BG560C requirements.
6.How does Aetrix verify that XCV600-6BG560C is sourced from the original manufacturer or authorized distributors?
All XCV600-6BG560C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600-6BG560C meets industry standards.
7.What is the process for return or replacement of XCV600-6BG560C?
All XCV600-6BG560C units undergo pre-shipment inspection (PSI). If there is an issue with XCV600-6BG560C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV600-6BG560C part is unused and in its original packaging.
Return procedure for XCV600-6BG560C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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