Analog Devices Inc. 104124-HMC784MS8GE
- Part No.:
- 104124-HMC784MS8GE
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
104124-HMC784MS8GE.pdf
- Description:
- BOARD EVAL SWITCH SPDT HMC784
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HMC784MS8GE from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC SPDT transmit/receive switch in an 8-lead MSOPG package, designed for DC–4 GHz RF signal routing in high-power infrastructure transceivers. It delivers +40 dBm input P1dB at +8 V, 0.4 dB insertion loss at DC–1 GHz, and +62 dBm third-order intercept, enabling robust operation in cellular base station front-ends and test equipment.
For engineers reviewing the HMC784MS8GE datasheet, HMC784MS8GE pinout, HMC784MS8GE application, or HMC784MS8GE equivalent, key selection criteria include its 10 W RF power handling, positive CMOS/TTL-compatible control (3–8 V), reflective OFF-state architecture, and thermal performance up to +85 °C with 53.4 °C/W channel-to-ground thermal resistance.
Technical Context
The HMC784MS8GE implements a monolithic GaAs pHEMT-based SPDT switch with integrated bias control circuitry enabling single-supply operation from +3 V to +8 V. Its reflective OFF-state design (RF1/RF2 present short circuits when inactive) minimizes external component count while maintaining >26 dB isolation across DC–4 GHz.
Switching is controlled via complementary logic inputs A and B, with tRISE/tFALL of 15 ns and tON/tOFF of 40 ns. On-chip thermal protection supports continuous dissipation of 1.217 W at +85 °C, derating linearly above that temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | DC to 4 GHz - supports full-band operation from baseband through C-band without reconfiguration. |
| Insertion Loss (DC–1 GHz) | 0.4 dB typical - enables minimal signal attenuation in sub-2 GHz cellular and WiMAX applications. |
| Isolation (DC–4 GHz) | 26 dB min - ensures sufficient Tx/Rx port separation to prevent receiver desensitization. |
| Input P1dB @ +8 V | +40 dBm - supports 10 W peak RF power handling, suitable for macrocell PA output switching. |
| Input IP3 @ +5 V | +62 dBm - delivers ultra-low intermodulation distortion for multi-carrier LTE/WiMAX signals. |
| Supply Voltage Range | +3 V to +8 V - allows flexible system-level biasing and compatibility with standard logic families. |
| Switching Speed | 15 ns tRISE/tFALL - enables fast TDD frame transitions in time-division duplex systems. |
Pinout & Package
Package: MSOP8G (14.8 mm²), RoHS-compliant low-stress plastic with copper alloy leadframe and 100% matte tin finish; MSL1 rated; thermal paddle must be soldered to PCB RF ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (A) | Control Input A | Logic input selecting RFC→RF1 path when high; compatible with CMOS/TTL levels (0–Vdd). |
| 2 (B) | Control Input B | Complementary logic input selecting RFC→RF2 path when high; drives opposite state to A. |
| 3 (RFC) | Common RF Port | DC-coupled 50 Ω input requiring external blocking capacitor; connects to PA or LNA common node. |
| 4 (Vdd) | Positive Supply | Bias supply for internal pHEMTs; supports +3 V to +8 V; current draw ranges from 0.5 μA to 20 μA. |
| 5 (RF1) | RF Output 1 | DC-coupled 50 Ω reflective port; presents short circuit when OFF; used for Tx path in T/R configuration. |
| 6,7 (GND) | Ground Terminals | Signal and power return paths; both leads plus exposed thermal paddle must connect to solid RF ground plane. |
| 8 (RF2) | RF Output 2 | DC-coupled 50 Ω reflective port; presents short circuit when OFF; used for Rx path in T/R configuration. |
Key Features
| Feature | Design Value |
|---|---|
| High-Power T/R Switching | Handles +40 dBm P1dB at +8 V, supporting 10 W peak RF power in macrocell and repeater front-ends. |
| Reflective OFF-State Architecture | RF1 and RF2 present shorts when inactive-eliminates need for external termination resistors in most layouts. |
| Single Positive Supply Operation | Operates from +3 V to +8 V with <20 μA quiescent current-reduces system power management complexity. |
| CMOS/TTL-Compatible Control | A/B inputs accept logic-high = Vdd ±0.2 V and logic-low = 0–0.2 V-direct interface with FPGA/GPIO without level shifters. |
| Thermal Robustness | 150 °C max channel temperature and 53.4 °C/W θCH-GND enable reliable operation in sealed outdoor enclosures. |
Applications
| Cellular Base Station Transceiver | WiMAX/WiBro Fixed Wireless Terminal |
|---|---|
|
Use Scenario: High-power TDD front-end switching between PA output and LNA input in 2.3–2.7 GHz LTE macrocells. IC Role / Device Role / Timing Role: SPDT T/R switch routing RF energy between transmit and receive chains with nanosecond-level timing alignment. Use Value: +40 dBm P1dB and +62 dBm IP3 maintain EVM integrity under multi-carrier 20 MHz LTE signals at full PA output. |
Use Scenario: Dual-band (2.5/3.5 GHz) fixed wireless CPE unit requiring low-loss, high-isolation antenna switching. IC Role / Device Role / Timing Role: Reflective SPDT switch enabling shared antenna operation between WiMAX transmitter and receiver sections. Use Value: 0.4 dB insertion loss at 2.5 GHz and >26 dB isolation preserve link budget and reduce adjacent-channel interference. |
| Automotive Telematics V2X Module | RF Test Equipment Signal Routing |
|
Use Scenario: 5.9 GHz DSRC/V2X transceiver module in automotive ECU requiring rugged, thermally stable RF switching. IC Role / Device Role / Timing Role: High-reliability SPDT switch managing antenna duplexing in safety-critical vehicle-to-vehicle communication. Use Value: -40 °C to +85 °C operating range and 150 °C channel temperature rating ensure functional stability in engine bay environments. |
Use Scenario: Automated RF test system switching between multiple DUTs and measurement instruments in production line validation. IC Role / Device Role / Timing Role: Fast-switching SPDT element in programmable signal path matrix for multi-port vector network analyzer setups. Use Value: 15 ns tRISE/tFALL and repeatable 0.4 dB loss support high-throughput calibration and sweep sequencing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPDT high-power RF switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC547LP3E | Lower power: +34 dBm P1dB @ +5 V; 3×3 mm QFN package; 0.1–6 GHz range. | Better suited for compact portable radios and lower-power small cells where size and bandwidth outweigh power needs. | Select HMC547LP3E when footprint and 6 GHz coverage are prioritized over 10 W handling capability. |
| Qorvo QM11036 | GaAs pHEMT SPDT; +38 dBm P1dB @ +7 V; 0.7–3.8 GHz; requires negative gate bias for optimal linearity. | Designed for 5G FR1 infrastructure with tighter integration into PA modules; lacks reflective OFF-state. | Choose QM11036 only if system design accommodates dual-rail biasing and external termination networks. |
Compared with HMC784MS8GE, HMC547LP3E trades 6 dB P1dB headroom for smaller size and wider bandwidth, while QM11036 offers higher integration but demands more complex biasing and layout-neither is pin-compatible, and both require board redesign.
Availability
HMC784MS8GE is available at Aetrix Electronics and suitable for cellular infrastructure, fixed wireless terminals, and RF test equipment requiring stable component supply with guaranteed long-term availability and traceable sourcing.
Supply support for HMC784MS8GE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF portfolio, specializing in GaAs, GaN, and SiGe MMIC solutions for defense, communications, and instrumentation markets.
The HMC784MS8GE belongs to Hittite's legacy high-power SPDT switch product line, engineered specifically for DC–4 GHz T/R applications demanding high linearity, thermal resilience, and simplified bias architecture in macrocell and test-system designs.
FAQ
What is the maximum RF input power the HMC784MS8GE can handle continuously?
The HMC784MS8GE supports continuous RF input power up to +39 dBm (≈8 W) at +85 °C with +8 V supply and 50 Ω source/load impedances. Its absolute maximum rating is defined by thermal limits: 1.217 W dissipation at +85 °C, derating 25 mW/°C above that temperature. This makes the HMC784MS8GE suitable for macrocell base station T/R switching where sustained high-power operation is required.
Does the HMC784MS8GE require external DC blocking capacitors?
Yes, the HMC784MS8GE requires external DC blocking capacitors at all three RF ports (RFC, RF1, and RF2), as stated in the datasheet notes and truth table. These capacitors define the lowest usable frequency-typically 100 pF for operation down to ~20 MHz. The device itself is DC-coupled internally, so omission of these capacitors risks damage from DC voltage or bias feed-through in real-world RF circuits.
Can the HMC784MS8GE operate from a +3.3 V supply?
Yes, the HMC784MS8GE is fully specified for operation from +3 V to +8 V. At +3.3 V, it delivers +32 dBm input P0.1dB and +32 dBm P1dB across 0.1–4 GHz, with insertion loss increasing slightly (e.g., 0.6 dB typical at DC–1 GHz). Control inputs remain compatible with standard 3.3 V CMOS logic, making the HMC784MS8GE viable in mixed-voltage systems without level-shifting circuitry.
What is the thermal resistance of the HMC784MS8GE and how should it be managed on PCB?
The HMC784MS8GE has a channel-to-ground thermal resistance (θCH-GND) of 53.4 °C/W. To achieve rated performance, the exposed thermal paddle and pins 6 and 7 must be soldered directly to a low-impedance RF ground plane using multiple thermal vias. The datasheet mandates grounding the paddle-failure to do so results in excessive junction temperature rise and potential reliability degradation during high-power operation.
Is the HMC784MS8GE pin-compatible with other Hittite SPDT switches like the HMC783MS8GE?
No, the HMC784MS8GE is not pin-compatible with HMC783MS8GE or other members of the MSOP8G SPDT family. While both use the same MSOP8G package outline, their pin functions differ: HMC784MS8GE uses pins 1/A and 2/B for complementary control, whereas HMC783MS8GE employs a single-control architecture with different pin assignments. Board-level replacement requires schematic and layout revision-not drop-in substitution.
104124-HMC784MS8GE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Bag
- Product Status:
- Active
- Type:
- Switch, SPDT
- Frequency:
- 0Hz ~ 4GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC784MS8GE
104124-HMC784MS8GE FAQ
1.How can I place an order for 104124-HMC784MS8GE through Aetrix?
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6.How does Aetrix verify that 104124-HMC784MS8GE is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of 104124-HMC784MS8GE?
All 104124-HMC784MS8GE units undergo pre-shipment inspection (PSI). If there is an issue with 104124-HMC784MS8GE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 104124-HMC784MS8GE part is unused and in its original packaging.
Return procedure for 104124-HMC784MS8GE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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