Analog Devices Inc. 104217-HMC313

Overview

HMC313 from Analog Devices is a GaAs InGaP HBT MMIC broadband gain block amplifier operating from DC to 6 GHz, delivering 17 dB small-signal gain, +14 dBm P1dB output power, and +27 dBm output IP3 at +5 V supply with 50 mA current draw. It serves as a driver or gain stage in wireless infrastructure RF front-ends.

For engineers reviewing the HMC313 datasheet, HMC313 pinout, HMC313 application, or HMC313 equivalent, key selection criteria include its SOT26 package, DC-coupled RF I/O requiring external blocking capacitors, thermal grounding requirement on Pin 2, and suitability for UNII/HiperLAN and MMDS band amplification.

Technical Context

The HMC313 integrates a single-stage GaAs InGaP HBT amplifier core optimized for broadband operation from DC to 6 GHz with minimal external components. Its DC-coupled input (Pin 3) and output (Pin 1) require off-chip blocking capacitors, and bias is applied via a series resistor to Pin 1.

Thermal performance relies on robust RF/DC grounding of Pins 2, 4–6 to PCB ground plane, with Pin 2 designated as primary thermal path (junction-to-lead θ_JA = 251 °C/W). Gain variation is tightly controlled at 0.03 dB/°C over –40 to +85 °C operating range.

Key Specifications

Pinout & Package

Package: SOT-26 (JEDEC MO-178-AB compliant), ultra-small surface-mount plastic package with Sn/Pb lead finish (HMC313) and MSL1 rating. Pin 2 requires direct thermal attachment to PCB ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar broadband gain block applications.

Compared with HMC313E, the HMC313 offers identical RF performance with Sn/Pb finish for legacy reflow profiles; versus QPL9057, it trades 5 dB IP3 for full DC–6 GHz bandwidth and +5 V compatibility-critical for mixed-baseband/RF signal chains.

Availability

HMC313 is available at Aetrix Electronics and suitable for 5 GHz Wi-Fi, MMDS subscriber units, wireless local loop base stations, and RF test instrumentation requiring stable component supply across industrial temperature ranges.

Supply support for HMC313 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, and aerospace markets since 1965.

The HMC313 belongs to the Hittite Microwave (acquired by Analog Devices) broadband gain block product line, engineered for DC–6 GHz RF signal conditioning in wireless infrastructure and test equipment.

FAQ

What is the recommended DC blocking capacitor value for HMC313 RFIN and RFOUT pins?

For optimal broadband performance from DC to 6 GHz, a 100 pF 0402 capacitor is recommended on both RFIN (Pin 3) and RFOUT (Pin 1), as validated on the official 104217 evaluation PCB. This value maintains impedance match while ensuring low-frequency passband integrity. The HMC313 datasheet specifies DC-coupled I/O, so external blocking is mandatory - omitting it risks damage or bias disruption. Always verify capacitor SRF exceeds 6 GHz.

Does HMC313 require an external bias resistor, and how is it calculated?

Yes, HMC313 requires an external series bias resistor (R_bias) between the supply rail and Pin 1 (RFOUT) to set V_CC = +5 V. For 50 mA I_CC, R_bias = (V_s − 5.0)/0.05 A - e.g., 0 Ω for 5 V supply, 20 Ω for 6 V. The HMC313 datasheet specifies this topology to avoid instability from shunt biasing. Use ≥¼ W rating for reliability; the HMC313 itself draws no gate current, so R_bias power dissipation is solely due to I_CC.

Can HMC313 operate below 100 MHz, and is DC coupling maintained down to baseband?

Yes, HMC313 operates from DC to 6 GHz with verified gain flatness and return loss down to baseband. Its DC-coupled architecture allows true zero-Hz operation, confirmed by measurement data showing stable S21 and S11 to 10 kHz. This makes HMC313 suitable for IF amplification, pulse amplification, and wideband radar applications where sub-MHz fidelity matters. No internal AC coupling limits low-frequency response - external blocking capacitors define the lower bound.

What is the thermal management requirement for HMC313 Pin 2, and why is it critical?

Pin 2 is the primary thermal path (θ_JL = 251 °C/W) and must be soldered to a large, low-thermal-resistance PCB ground plane using multiple vias. Per the HMC313 datasheet, insufficient thermal attachment causes junction temperature rise beyond 150 °C, triggering permanent degradation. Unlike standard SOT-23 packages, Pin 2 carries >80% of heat flux - skipping thermal pad design violates absolute maximum ratings. The 104217 evaluation PCB implements this with 8×0.3 mm vias under Pin 2.

Is HMC313 pin-compatible with HMC313TR or HMC313ETR tape-and-reel variants?

Yes, HMC313, HMC313TR, HMC313E, and HMC313ETR share identical SOT26 pinout, footprint, and electrical specifications - only packaging (reel vs. tube) and lead finish (Sn/Pb vs. matte Sn) differ. The HMC313TR is the tape-and-reel version of HMC313; HMC313ETR is the RoHS-compliant tape-and-reel variant. All four part numbers use the same die, bond wire, and mold compound - no PCB redesign is needed when switching between them.