Analog Devices Inc. 104631-HMC363S8G

Overview

HMC363S8G from Analog Devices is a GaAs HBT MMIC static frequency divider operating from DC (square-wave input) to 12 GHz with divide-by-8 functionality, +5 V single supply, -6 dBm typical output power, and -153 dBc/Hz SSB phase noise at 100 kHz offset-used in X-band PLL prescalers for satellite communications and fiber optic transceivers.

For engineers reviewing the HMC363S8G datasheet, HMC363S8G pinout, HMC363S8G application, or HMC363S8G equivalent, key selection criteria include input sensitivity window (-15 to +10 dBm across 1–7 GHz), reverse isolation (65 dB), output transition time (100 ps), and SOIC_N_EP package compatibility with RF layout best practices.

Technical Context

The HMC363S8G implements a static CMOS-compatible divide-by-8 logic architecture using InGaP GaAs HBT technology, enabling operation down to DC with square-wave inputs and up to 12 GHz with sine-wave inputs. It supports both single-ended (IN only, NIN AC-grounded) and differential (IN/NIN 180° out-of-phase) RF input modes.

Output signals on OUT (pin 3) and NOUT (pin 1) are complementary, 180° out of phase, with 50 Ω matched outputs and specified harmonic suppression. The device requires DC blocking on RF inputs and direct grounding of the exposed paddle (pin 8) for thermal and RF performance.

Key Specifications

Pinout & Package

Package: 8-lead SOIC_N_EP (narrow body, low stand-off) with exposed ground paddle per JEDEC MS-012-BA; RoHS-compliant variant is HMC363S8GE, but HMC363S8G uses Sn/Pb lead finish and MSL1 rating.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar frequency divider applications.

Compared with HMC363S8GE, the HMC363S8G offers identical RF performance but requires Sn/Pb assembly; compared with HMC433, the HMC363S8G extends usable bandwidth by 4 GHz, adds DC-square-wave capability, and improves thermal dissipation via exposed paddle - critical for X-band infrastructure.

Availability

HMC363S8G is available at Aetrix Electronics and suitable for satellite communication transceivers, fiber optic line cards, and point-to-point microwave radios requiring stable component supply across extended temperature ranges and high-frequency signal integrity.

Supply support for HMC363S8G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving precision instrumentation, communications, and industrial markets since 1965.

The HMC363S8G belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for broadband RF and microwave frequency synthesis in defense, aerospace, and telecom infrastructure.

FAQ

What is the minimum input frequency supported by the HMC363S8G?

The HMC363S8G supports DC input when driven with a square-wave signal, per datasheet Note 1. For sine-wave inputs, the minimum frequency is 0.2 GHz (200 MHz) at +25 °C, with reduced sensitivity at temperature extremes. This makes the HMC363S8G suitable for ultra-low-frequency prescaling in wideband synthesizers where traditional dividers fail.

Can the HMC363S8G operate with a 3.3 V supply?

No, the HMC363S8G requires a +5 V ± 0.25 V supply (4.75–5.25 V) as specified in Absolute Maximum Ratings and Electrical Specifications. Operation outside this range risks parametric shift, increased phase noise, or permanent damage. The HMC363S8G is not rated for 3.3 V operation, and no characterization data exists for lower voltages.

Is the HMC363S8G pin-compatible with the HMC363S8GE?

Yes, the HMC363S8G and HMC363S8GE share identical pinout, package outline (SOIC_N_EP), and electrical specifications. The only differences are lead finish (Sn/Pb vs. 100% matte Sn) and MSL reflow profile (235 °C vs. 260 °C peak). No PCB layout change is needed when substituting HMC363S8GE for HMC363S8G in new designs.

How should the exposed paddle (pin 8) of the HMC363S8G be connected on the PCB?

The exposed paddle of the HMC363S8G must be soldered directly to a solid copper ground plane using multiple thermal vias (≥6, 0.3 mm diameter) spaced within 2 mm of the paddle edge. Per evaluation board layout (104627), this connection is essential for achieving specified thermal resistance (73.2 °C/W) and RF grounding - floating or poorly connected paddles cause current derating and degraded phase noise.

Does the HMC363S8G require external DC blocking capacitors on its RF ports?

Yes, the HMC363S8G requires DC blocking on both IN (pin 5) and NIN (pin 7) inputs, as stated in the Pin Description table. The internal bias network is not designed to handle DC-coupled RF sources. Evaluation board 104627 uses 100 pF 0402 capacitors (C1–C4) for this purpose. Failure to implement DC blocking may result in input stage saturation or permanent damage.