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Analog Devices Inc. 104987-HMC407MS8G
- Part No.:
- 104987-HMC407MS8G
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
104987-HMC407MS8G.pdf
- Description:
- BOARD EVAL AMPLIFIER MMIC HMC407
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
HMC407MS8G from Analog Devices is a GaAs InGaP HBT MMIC power amplifier operating from 5 to 7 GHz, delivering +29 dBm saturated output power, 15 dB small-signal gain, and 28% power-added efficiency at +5 V supply. It requires no external matching, features integrated power-down control, and is packaged in an 8-lead Mini-SO with exposed thermal pad for RF and thermal performance in 5–7 GHz wireless infrastructure.
For engineers reviewing the HMC407MS8G datasheet, HMC407MS8G pinout, HMC407MS8G application, or HMC407MS8G equivalent, key selection criteria include its 5–7 GHz bandwidth, 50 Ω matched I/O, power-down capability, thermal resistance of 32 °C/W, and suitability for UNII/HiperLAN systems requiring compact, high-efficiency RF amplification without external tuning.
Technical Context
The HMC407MS8G integrates two cascaded GaAs InGaP HBT amplifier stages-Vcc1 powers the driver stage, Vcc2 powers the output stage-with independent bias control enabling optimized linearity and efficiency trade-offs. Its monolithic design eliminates external matching networks, achieving broadband 50 Ω input/output impedance across 5–7 GHz.
Power-down functionality is implemented via Vpd pin (Pin 2), which reduces quiescent current from 230 mA to 2 µA when pulled low, enabling rapid RF switching with 30 ns tON/tOFF. The exposed paddle package ensures low thermal resistance (32 °C/W) and stable operation from –40 °C to +85 °C ambient.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 5–7 GHz - Fully specified operational band for UNII and HiperLAN systems; includes 5.6–6.0 GHz typical narrowband optimization. |
| Saturated Output Power (Psat) | +29 dBm - Delivers 794 mW RF output into 50 Ω load at compression, sufficient for medium-power WLAN transmit stages. |
| Small-Signal Gain | 15 dB typical - Provides fixed, stable amplification with ±3 dB variation over temperature and frequency; enables predictable cascade design. |
| Power-Added Efficiency (PAE) | 28% at Psat - Minimizes DC power dissipation (230 mA @ 5 V = 1.15 W total) while maintaining high RF output, critical for thermally constrained modules. |
| Input/Output Return Loss | 12 dB / 15 dB - Ensures ≥94% / ≥97% power transfer at I/O ports without external matching components, reducing BOM count and layout complexity. |
| Power-Down Quiescent Current | 2 µA - Enables ultra-low standby power mode; supports battery-aware or duty-cycled RF subsystems without auxiliary shutdown circuitry. |
| Thermal Resistance (θJA) | 32 °C/W - Requires minimal heatsinking; compatible with standard PCB copper pours and single via arrays under exposed paddle for industrial-grade reliability. |
Pinout & Package
Package: 8-Lead Mini Small Outline Package with Exposed Pad (Mini_SO_EP, JEDEC MO-187-AA-T), dimensions 3.0 × 3.0 × 0.9 mm, exposed thermal paddle on bottom, MSL1 rating, Sn/Pb lead finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Vcc1) | Driver-stage supply voltage | Bias for first amplifier stage; requires local 330 pF bypass capacitor placed near pin to suppress RF noise and ensure stability. |
| 2 (Vpd) | Power-down control | Digital enable/disable input: 0 V → 2 µA Iq, 5 V → full 230 mA operation; supports fast 30 ns switching without external logic. |
| 3, 6, 7 (GND) | RF and DC ground reference | Multiple ground pins plus backside exposed paddle must be connected to solid ground plane using ≥4 thermal vias for optimal RF return path and thermal conduction. |
| 4 (RFIN) | 50 Ω matched RF input | AC-coupled, internally matched; accepts direct connection from 50 Ω source (e.g., filter or PA driver) without series/shunt components. |
| 5 (RFOUT) | 50 Ω matched RF output | AC-coupled, internally matched; drives 50 Ω load (e.g., antenna switch or filter) directly; supports +29 dBm saturated output. |
| 8 (Vcc2) | Output-stage supply voltage | Bias for final power stage; requires 330 pF bypass capacitor placed ≤0.5 mm from pin to maintain stability under high-current transients. |
Key Features
| Feature | Design Value |
|---|---|
| No external matching required | Integrated broadband 50 Ω input/output impedance across 5–7 GHz eliminates discrete matching networks, saving board space and calibration effort. |
| Independent dual-stage biasing | Vcc1 and Vcc2 allow separate optimization of driver and output stage for linearity vs. efficiency trade-offs in multi-carrier systems. |
| Fast power-down control | Vpd pin enables 30 ns turn-on/turn-off with 2 µA standby current, supporting TDD protocols and dynamic power management without added ICs. |
| Thermally enhanced exposed paddle | 32 °C/W junction-to-ambient thermal resistance allows operation up to +85 °C ambient without forced air or heatsink in typical 4-layer PCB layouts. |
| Robust RF isolation | Reverse isolation (S12) >10 dB across band and >20 dB at 5.8 GHz minimizes oscillator pulling and improves system-level spectral purity. |
Applications
| UNII Band Transmitter | HiperLAN Access Point |
|---|---|
Use Scenario: 5.25–5.35 GHz and 5.47–5.725 GHz U-NII-1/2A bands in enterprise Wi-Fi access points. IC Role / Device Role / Timing Role: Final-stage power amplifier driving antenna switch and front-end filter before radiating signal. Use Value: Delivers +29 dBm Psat with 15 dB gain and 28% PAE, meeting EIRP limits while minimizing DC power draw and thermal footprint. |
Use Scenario: European 5.47–5.725 GHz HiperLAN/2 base stations operating at 54 Mbps data rates. IC Role / Device Role / Timing Role: High-linearity RF power amplifier in OFDM transmit chain, following digital predistortion and upconversion. Use Value: 37 dBm IP3 and <0.035 dB/°C gain drift ensure ACLR compliance and stable output across temperature-varying outdoor enclosures. |
| Point-to-Point Backhaul | Test Equipment Signal Source |
Use Scenario: 5.8 GHz licensed band short-haul wireless links (<5 km) with QPSK/16-QAM modulation. IC Role / Device Role / Timing Role: Medium-power amplifier in compact outdoor radio module, interfacing with directional antenna and duplexer. Use Value: 50 Ω matched I/O simplifies integration with microstrip filters; exposed paddle enables passive cooling in sealed metal housings. |
Use Scenario: Lab-grade signal generator output stage for 5–7 GHz spectrum analyzer calibration and receiver sensitivity testing. IC Role / Device Role / Timing Role: Stable, repeatable RF power source with known gain and compression characteristics for metrology-grade setups. Use Value: ±3 dB gain flatness and <0.5 dB P1dB variation over temperature support traceable, low-uncertainty test signal generation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC407MS8GE | RoHS-compliant version with 100% matte tin lead finish and 260 °C MSL1 reflow rating; identical electrical specs and pinout. | Required for RoHS-constrained production; same thermal and RF performance but higher peak reflow tolerance. | Select HMC407MS8GE for new designs targeting environmental compliance; HMC407MS8G remains valid for legacy Sn/Pb assembly lines. |
| QPA9807 | GaAs pHEMT-based 5–7 GHz PA with +30 dBm Psat, 32% PAE, and integrated active bias; no power-down pin; 16-pin QFN package. | Higher efficiency and output power, but requires external bias control and matching; larger footprint and different thermal interface. | Choose QPA9807 when maximum PAE (>30%) and higher Psat are prioritized over pin count, power-down capability, and board area. |
Compared with HMC407MS8GE, the HMC407MS8G offers identical RF performance but uses Sn/Pb finish for lower-cost reflow; versus QPA9807, it trades 1 dB Psat and 4% PAE for integrated power-down, smaller 8-pin footprint, and zero external matching-ideal for space- and control-constrained 5–7 GHz modules.
Availability
HMC407MS8G is available at Aetrix Electronics and suitable for UNII band transmitters, HiperLAN access points, point-to-point backhaul radios, and RF test equipment requiring stable component supply, consistent RF performance, and long-term industrial availability.
Supply support for HMC407MS8G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, and aerospace markets with precision signal processing solutions.
The HMC407MS8G belongs to Analog Devices' Hittite Microwave MMIC product line, designed specifically for compact, high-efficiency RF power amplification in 5–7 GHz wireless infrastructure where size, thermal management, and integration simplicity are critical.
FAQ
What is the operating frequency range of the HMC407MS8G?
The HMC407MS8G operates from 5 to 7 GHz, with full electrical specifications guaranteed across this band. Typical performance is optimized for 5.6–6.0 GHz, making it ideal for UNII and HiperLAN applications. The device maintains ≥12 dB input return loss and ≥15 dB output return loss throughout the range, ensuring robust 50 Ω system integration without external matching components. Its gain and output power remain stable across temperature and supply variations within this band.
Does the HMC407MS8G require external matching networks?
No, the HMC407MS8G does not require external matching networks. It is internally matched to 50 Ω at both input (Pin 4) and output (Pin 5) across its entire 5–7 GHz operating band. This eliminates the need for discrete capacitors, inductors, or transmission-line stubs, reducing bill-of-materials cost, PCB area, and design iteration time. The internal matching is validated per datasheet S-parameter data and functional diagrams, and confirmed by application schematics showing direct 50 Ω interface.
How does the power-down feature of the HMC407MS8G work?
The HMC407MS8G implements power-down via Pin 2 (Vpd): applying 0 V reduces quiescent current to 2 µA, while 5 V enables full 230 mA operation. This digital control supports fast 30 ns turn-on/turn-off transitions without external drivers. The feature is verified in datasheet Electrical Specifications and Gain/Current vs. Vpd plots. For reliable operation, Vpd must remain within absolute max rating (+5.5 Vdc), and should not float-pull-down resistors are recommended in low-power states.
What thermal considerations apply to the HMC407MS8G?
The HMC407MS8G has a junction-to-ambient thermal resistance of 32 °C/W, enabled by its exposed paddle package. To maintain safe operation up to +85 °C ambient, the exposed paddle must be soldered to a solid ground plane with ≥4 thermal vias (0.3 mm diameter, spaced ≤1 mm apart). Datasheet Absolute Maximum Ratings specify 150 °C max junction temperature and derating above 85 °C ambient. Thermal performance is validated in application notes using Roger 4350 evaluation boards with heatsinks.
Is the HMC407MS8G pin-compatible with the HMC407MS8GE?
Yes, the HMC407MS8G is pin-compatible with the HMC407MS8GE-both share identical pinout, package outline (Mini_SO_EP), and electrical specifications. The only differences are RoHS compliance (matte Sn vs. Sn/Pb finish) and MSL1 reflow profile (260 °C vs. 235 °C peak). No PCB layout changes are needed when migrating between them; the HMC407MS8GE is a drop-in replacement for new environmentally compliant designs, while HMC407MS8G supports legacy Sn/Pb assembly processes.
104987-HMC407MS8G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Bag
- Product Status:
- Active
- Type:
- Amplifier
- Frequency:
- 5GHz ~ 7GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC407MS8G
104987-HMC407MS8G FAQ
1.How can I place an order for 104987-HMC407MS8G through Aetrix?
Please submit a Request for Quotation (RFQ) for 104987-HMC407MS8G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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Once your 104987-HMC407MS8G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 104987-HMC407MS8G?
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6.How does Aetrix verify that 104987-HMC407MS8G is sourced from the original manufacturer or authorized distributors?
All 104987-HMC407MS8G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 104987-HMC407MS8G meets industry standards.
7.What is the process for return or replacement of 104987-HMC407MS8G?
All 104987-HMC407MS8G units undergo pre-shipment inspection (PSI). If there is an issue with 104987-HMC407MS8G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 104987-HMC407MS8G part is unused and in its original packaging.
Return procedure for 104987-HMC407MS8G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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