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Analog Devices Inc. 106043-HMC457QS16G

Part No.:
106043-HMC457QS16G
Manufacturer:
Analog Devices Inc.
Category:
RF, RFID, Wireless Evaluation Boards
Package:
Datasheet:
Aetrix106043-HMC457QS16G.pdf
Description:
BOARD EVAL HMC457QS16GE
Quantity:
Payment:
Payment
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Inventory:2,840

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Product details

Overview

HMC457QS16G from Analog Devices (formerly Hittite Microwave) is a GaAs InGaP HBT monolithic microwave integrated circuit (MMIC) power amplifier optimized for 1.7–2.2 GHz cellular infrastructure applications. It delivers 29 dBm P1dB, 27 dB gain at 1900 MHz, and +45 dBm output IP3 with 48% PAE at +32 dBm output, operating from a single +5 V supply. Its integrated Vpd power control enables RF output power and bias current adjustment in W-CDMA base station driver stages.

For engineers reviewing the HMC457QS16G datasheet, HMC457QS16G pinout, HMC457QS16G application, or HMC457QS16G equivalent, key selection criteria include its 16-pin QSOP package footprint, temperature-stable gain (±0.035 dB/°C), broadband input/output return loss (>8 dB), and suitability for CDMA/W-CDMA repeater and small-cell PA driver designs requiring high linearity and thermal robustness.

Technical Context

The HMC457QS16G employs a two-stage InGaP HBT MMIC architecture with separate bias networks for input and output stages. Its Vpd control pin directly modulates collector quiescent current (Icq = 400–620 mA across 4.5–5.5 V), enabling dynamic power-down and linear output power scaling without external bias circuitry.

It operates within –40°C to +85°C ambient, with thermal resistance of 23.3°C/W (junction-to-paddle) and absolute max Vcc = +6 Vdc. The device requires external 50 Ω matching on RFIN (Pin 6) and RFOUT (Pins 10–15), with all ground pins (2,4,5,7,9,16) and exposed paddle soldered to PCB RF ground via multiple vias.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 1710–1990 MHz & 2010–2170 MHz - dual-band support covering primary LTE/W-CDMA bands without retuning.
Small-Signal Gain 27 dB @ 1900 MHz - sufficient for driver-stage amplification before final PA stage in multi-stage transmitters.
P1dB Output Power 29 dBm - delivers 794 mW saturated RF output, meeting Class AB PA driver requirements for 20–30 MHz channel bandwidths.
OIP3 +45 dBm - enables <–50 dBc ACPR in W-CDMA (64 DPCH) at 2140 MHz, critical for spectral mask compliance.
PAE @ +32 dBm 48% - reduces thermal load and DC power consumption in densely packed RF modules.
Supply Current (Icq) 510 mA @ Vs = +5 V - defines heatsink sizing and LDO current capability for stable operation.
Input/Output Return Loss 11 dB / 8 dB - ensures <–15 dB reflection coefficient, minimizing VSWR-induced gain ripple and stability risk.

Pinout & Package

Package: QSOP16G - 16-lead plastic surface-mount package with exposed ground paddle (29.4 mm² footprint); MSL1 rated; Sn/Pb lead finish; max reflow 235°C.

Pin/Terminal Circuit Role Design Meaning
1 Vcc DC supply for first amplifier stage; requires local 100 pF + 1000 pF bypassing per application schematic.
2,4,5,7,9,16 GND RF/DC ground terminals; backside paddle must be soldered with ≥6 thermal vias to inner ground plane.
3 Vbias Bias circuit supply; decoupled with 1000 pF capacitor to stabilize quiescent point against supply noise.
6 RFIN 50 Ω matched RF input; AC-coupled; connects to preceding stage via microstrip with 20° electrical length at 1900 MHz.
8 Vpd Power-down/control voltage; 0–5 V range adjusts Icq from ~0 mA to 620 mA; enables fast TDD power gating.
10–15 RFOUT Combined RF output and DC bias feed for final stage; requires external 50 Ω output match and harmonic filtering.

Key Features

Feature Design Value
Integrated Vpd power control Enables full RF shutdown (Icq ≈ 0 mA) or precise output power tuning without external DAC or FET switch.
InGaP HBT process Provides >150°C junction temperature rating and superior reliability vs. AlGaAs HBT in continuous-wave base station operation.
High OIP3 / low NF trade-off 45 dBm OIP3 with only 5 dB noise figure - balances linearity and receiver sensitivity in TDD/FDD transceivers.
Thermally enhanced QSOP 23.3°C/W junction-to-paddle thermal resistance allows 2.78 W dissipation at 85°C ambient - supports unheatsinked deployment.
Multi-band frequency coverage Validated performance across both 1900 MHz (PCS) and 2100 MHz (UMTS) bands using same PCB layout with minor C9/L value change.

Applications

W-CDMA Base Station Driver CDMA2000 Repeater Transmitter

Use Scenario: Final driver stage before 10–20 W final PA in outdoor macrocell BTS cabinets.

IC Role / Device Role / Timing Role: Linear RF power amplifier providing 27 dB gain and +45 dBm OIP3 to meet ACLR <–45 dBc.

Use Value: Enables single-stage driver design with 48% PAE, reducing thermal density and DC-DC converter loading in confined RF shelves.

Use Scenario: Bidirectional repeater unit amplifying uplink signals from mobile devices in rural coverage extension.

IC Role / Device Role / Timing Role: Low-noise, high-linearity driver amplifying weak uplink signals while suppressing intermodulation distortion.

Use Value: Delivers +25 dBm W-CDMA channel power at –50 dBc ACPR, ensuring compliant uplink transmission without adjacent-channel interference.

GSM/GPRS Edge Booster Small-Cell Remote Radio Head

Use Scenario: Output stage in indoor distributed antenna system (DAS) node supporting GSM 1800/1900 MHz bands.

IC Role / Device Role / Timing Role: High-efficiency power amplifier delivering 29 dBm P1dB with minimal harmonic content.

Use Value: Meets EN 301 908 spectral mask with 11 dB input return loss, eliminating need for external isolators in cost-sensitive DAS nodes.

Use Scenario: Compact RRH module requiring high integration and thermal resilience in pole-mounted enclosures.

IC Role / Device Role / Timing Role: Thermally robust driver IC operating continuously at –40°C to +85°C ambient with no derating.

Use Value: Exposed paddle and 23.3°C/W thermal resistance enable direct PCB mounting without heatsink, saving volume and BOM cost.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
Qorvo QPA9121 2.3–2.8 GHz band; GaN-on-SiC; 34 dBm P1dB; 55% PAE; 24-pin QFN. Targets higher-frequency 5G NR n41/n77 bands; requires different matching network and gate bias sequencing. Select for 2.5 GHz+ systems needing higher output power; not drop-in due to frequency shift and bias complexity.
Skyworks SKY66312-364 1.7–2.2 GHz; GaAs pHEMT; 28 dBm P1dB; 32% PAE; 16-pin QFN; integrated coupler. Lacks Vpd control; lower OIP3 (+40 dBm); designed for handset PA front-end, not infrastructure driver role. Prefer for battery-powered portable gear; insufficient linearity for base station driver use cases requiring <–50 dBc ACPR.

Compared with QPA9121 and SKY66312-364, the HMC457QS16G uniquely combines 1.7–2.2 GHz dual-band coverage, Vpd-based power control, +45 dBm OIP3, and QSOP thermal performance-making it specifically suited for thermally constrained, linearity-critical infrastructure driver stages where bias flexibility and proven field reliability are mandatory.

Availability

HMC457QS16G is available at Aetrix Electronics and suitable for cellular infrastructure, wireless repeater, and small-cell radio applications requiring stable component supply, long-lifecycle support, and consistent RF performance across temperature.

Supply support for HMC457QS16G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF product portfolio, including GaAs and GaN MMICs for defense, communications, and test equipment.

The HMC457QS16G belongs to Hittite's legacy linear & power amplifier family, engineered specifically for cellular base station driver and repeater transmitter applications demanding high linearity, thermal stability, and compact SMT integration.

FAQ

What is the recommended PCB layout practice for thermal management of the HMC457QS16G?

The HMC457QS16G requires soldering of all ground pins (2,4,5,7,9,16) and the exposed paddle to a solid RF ground plane using ≥6 thermal vias. Rogers 4350B substrate (10 mil, εr = 3.48) is recommended. Thermal resistance is 23.3°C/W junction-to-paddle, so a 25°C ambient rise above case temperature is typical under full 510 mA Icq operation. Avoid floating ground pads or insufficient via count to prevent thermal throttling.

Can the HMC457QS16G operate reliably at 2140 MHz for W-CDMA uplink with 64 DPCH modulation?

Yes - the HMC457QS16G is characterized at 2100–2170 MHz and delivers +25 dBm W-CDMA channel power at –50 dBc ACPR when biased at +5 V and tuned per the 2100 MHz application circuit (C9 = 2.7 pF). Its +45 dBm OIP3 and 5 dB noise figure ensure ACLR compliance and uplink sensitivity preservation in real-world deployment.

Does the HMC457QS16G require external matching components for 50 Ω operation?

Yes - the HMC457QS16G is not internally matched. RFIN (Pin 6) and RFOUT (Pins 10–15) require external 50 Ω microstrip matching: TL1 (20° electrical length) and C9 (3.9 pF @ 1900 MHz / 2.7 pF @ 2100 MHz) per the reference schematics. Input return loss is 11 dB and output is 8 dB, confirming need for external tuning to achieve optimal VSWR and gain flatness.

How does the Vpd pin function in the HMC457QS16G, and what voltage range is safe?

The Vpd pin controls collector quiescent current (Icq) from near-zero to 620 mA across 0–5.5 V. For full power, connect to +5 V; voltages above +5.4 Vdc exceed absolute maximum rating and risk permanent damage. Reducing Vpd to 3.3 V lowers Icq to ~300 mA, enabling partial power-down during TDD guard intervals while maintaining RF path integrity.

Is the HMC457QS16G RoHS-compliant, and what is its moisture sensitivity level?

The HMC457QS16G uses Sn/Pb lead finish and is not RoHS-compliant; its RoHS-compliant variant is HMC457QS16GE (100% matte Sn). Both variants carry MSL1 rating, permitting unlimited floor life and peak reflow up to 235°C (HMC457QS16G) or 260°C (HMC457QS16GE), per JEDEC J-STD-020.

106043-HMC457QS16G Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Packaging:
Box
Product Status:
Active
Type:
Amplifier
Frequency:
1.9GHz
Contents:
Board(s)
Utilized IC / Part:
HMC457QS16G

106043-HMC457QS16G FAQ

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6.How does Aetrix verify that 106043-HMC457QS16G is sourced from the original manufacturer or authorized distributors?

All 106043-HMC457QS16G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 106043-HMC457QS16G meets industry standards.

7.What is the process for return or replacement of 106043-HMC457QS16G?

All 106043-HMC457QS16G units undergo pre-shipment inspection (PSI). If there is an issue with 106043-HMC457QS16G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 106043-HMC457QS16G part is unused and in its original packaging.

Return procedure for 106043-HMC457QS16G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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