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Analog Devices Inc. 107755-HMC454ST89
- Part No.:
- 107755-HMC454ST89
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
107755-HMC454ST89.pdf
- Description:
- BOARD EVAL HMC454ST89E 900MHZ
- Quantity:
- Payment:
- Shipping:
Inventory:1,604
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Product details
Overview
HMC454ST89 from Analog Devices (formerly Hittite Microwave) is a GaAs InGaP HBT linear RF power amplifier optimized for 0.4–2.5 GHz operation, delivering 12.5 dB gain at 2150 MHz, +42 dBm output IP3 at 2.0 GHz, and 50% PAE at +28 dBm Pout - deployed as a driver amplifier in W-CDMA base station transmit chains.
For engineers reviewing the HMC454ST89 datasheet, HMC454ST89 pinout, HMC454ST89 application, or HMC454ST89 equivalent, this page delivers verified RF performance data, SOT89 package interface details, temperature-stable biasing guidance, and validated alternatives for cellular infrastructure and fixed wireless designs.
Technical Context
The HMC454ST89 integrates a single-stage InGaP HBT die with internal DC biasing networks and is configured for Class A operation using a +5 V single supply. It achieves broadband matching across three frequency bands: 824–960 MHz, 1800–2000 MHz, and 2000–2200 MHz, with gain variation under ±0.016 dB/°C.
Its RF I/O ports are AC-coupled and require external off-chip matching components (e.g., 1 nH/36 nH inductors, 8–22 pF capacitors), while pins 2 and 4 plus the exposed paddle must be soldered to RF/DC ground per PCB layout guidelines for thermal and impedance integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 0.4–2.5 GHz operating bandwidth covering GSM, CDMA, W-CDMA, and ISM bands |
| Small-Signal Gain | 17.8 dB @ 0.8–1.0 GHz; 12.5 dB @ 1.8–2.2 GHz - enables cascaded gain staging without active level control |
| OIP3 | +40 dBm @ 0.9 GHz; +42 dBm @ 2.0 GHz - supports high-linearity W-CDMA and LTE uplink with low ACPR |
| P1dB | 24.5 dBm @ 0.9 GHz; 27 dBm @ 2.0 GHz - provides headroom for peak envelope power in multi-carrier systems |
| Noise Figure | 6.5 dB @ 0.9 GHz; 5.2 dB @ 2.0 GHz - suitable as a driver stage where noise contribution is secondary to linearity |
| Supply Current | 175 mA @ +5 V - enables efficient thermal design with 73 °C/W junction-to-ground-paddle thermal resistance |
| Package | SOT89 with exposed thermal paddle - requires full-solder connection to PCB ground plane for thermal dissipation |
Pinout & Package
SOT89-3 package with exposed thermal paddle; body material is low-stress injection-molded plastic; MSL1 rating; RoHS-compliant version marked HMC454ST89E uses 100% matte Sn lead finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | RFIN | AC-coupled RF input requiring external matching network (e.g., 8 pF capacitor, 1 nH inductor) |
| 2 & 4 | GND | RF/DC ground terminals - must be soldered to PCB ground plane with multiple vias for thermal and return-path integrity |
| 3 | RFOUT | RF output and DC bias node - requires external output matching (e.g., 36 nH inductor, 22 pF capacitor) and DC blocking |
Key Features
| Feature | Design Value |
|---|---|
| InGaP HBT process | Enables stable +42 dBm OIP3 over -40°C to +85°C with <0.016 dB/°C gain drift |
| Single +5 V supply | Eliminates need for dual-rail biasing; simplifies power delivery in compact RF modules |
| Industry-standard SOT89 | Supports automated SMT assembly and thermal management via exposed paddle soldering |
| High PAE | 50% power-added efficiency at +28 dBm Pout reduces heat sink requirements in densely packed transceivers |
| W-CDMA compliance | +17.5 dBm channel power at -45 dBc adjacent channel power ratio meets 3GPP TS 25.104 |
Applications
| Cellular Base Station Driver | Fixed Wireless Access (FWA) |
|---|---|
Use Scenario: Final-stage driver in macrocell BTS transmit chain supporting 4×4 MIMO W-CDMA carriers. IC Role / Device Role / Timing Role: Linear RF power amplifier boosting signal from IF DAC output to PA input, operating at 2140 MHz. Use Value: +42 dBm OIP3 ensures -45 dBc ACPR compliance at +28 dBm Pout, reducing digital predistortion complexity. |
Use Scenario: Transmit amplifier in point-to-point 2.3 GHz FWA radios for rural broadband backhaul. IC Role / Device Role / Timing Role: High-efficiency driver enabling 27 dBm saturated output with 50% PAE under +5 V supply. Use Value: 12.5 dB gain and 27 dBm Psat support link budgets >110 dB without additional gain stages. |
| ISM Band Transmitter | WLL Subscriber Unit |
Use Scenario: 2.45 GHz ISM band transmitter in industrial IoT sensor gateways. IC Role / Device Role / Timing Role: Final RF amplifier driving antenna switch module, operating at 2.4–2.5 GHz. Use Value: Broadband 0.4–2.5 GHz coverage allows reuse across 900 MHz, 1.9 GHz, and 2.4 GHz bands with minimal BOM change. |
Use Scenario: Uplink amplifier in 3.5 GHz WLL CPE units serving enterprise customers. IC Role / Device Role / Timing Role: Linearity-critical driver stage preceding GaN final PA, operating at 3.4–3.6 GHz. Use Value: +40 dBm OIP3 at 2.0 GHz extrapolates to >+38 dBm at 3.5 GHz, meeting FCC Part 101 spectral mask requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF driver amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QPL9057 | 0.6–2.7 GHz range; 15.5 dB gain @ 2.1 GHz; +44 dBm OIP3; 3.3 V supply; 2 mm × 2 mm DFN | Lower voltage operation and smaller footprint; higher gain but narrower thermal margin (Tj max = 125°C vs. 150°C) | Select for space-constrained 3.3 V systems needing higher gain; verify thermal derating above 70°C ambient. |
| Mini-Circuits PSA4-5043+ | 0.05–4.3 GHz range; 13.5 dB gain @ 2.1 GHz; +38 dBm OIP3; +5 V supply; 5.0 × 5.0 mm SMT | Wider bandwidth but lower OIP3 and larger footprint; no exposed thermal paddle | Select for ultra-broadband lab evaluation or non-thermal-critical receive-chain use; not recommended for high-duty-cycle transmit. |
Compared with QPL9057 and PSA4-5043+, the HMC454ST89 offers superior thermal robustness (150°C Tj max, 73 °C/W θJA) and proven +42 dBm OIP3 at 2.0 GHz under production conditions - making it preferred for thermally demanding, linearity-critical infrastructure drivers.
Availability
HMC454ST89 is available at Aetrix Electronics and suitable for cellular infrastructure, fixed wireless access, and ISM-band transmitter designs requiring stable component supply, consistent RF performance across temperature, and long-term obsolescence mitigation.
Supply support for HMC454ST89 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF product portfolio, including GaAs and GaN MMICs for communications and defense.
The HMC454ST89 belongs to Hittite's legacy InGaP HBT amplifier family, designed specifically for high-linearity, high-efficiency driver stages in 3G/4G base stations and wireless infrastructure equipment.
FAQ
What is the maximum RF input power rating for the HMC454ST89?
The HMC454ST89 has an absolute maximum RF input power rating of +25 dBm at +5 V supply, as specified in the Absolute Maximum Ratings table. Exceeding this level risks permanent damage to the InGaP HBT transistor. For reliable operation, input power should remain ≤0 dBm per tone in two-tone testing to achieve the rated +42 dBm OIP3.
Does the HMC454ST89 require external bias sequencing or startup circuitry?
No, the HMC454ST89 operates from a single +5 V supply with no external bias sequencing required. Its internal bias network stabilizes quiescent current at 175 mA across temperature. However, proper RF decoupling (e.g., 2.2 μF tantalum + 100 pF ceramic) on the VCC path is mandatory to prevent oscillation and ensure gain flatness.
Can the HMC454ST89 be used at 3.5 GHz for 5G FWA applications?
The HMC454ST89 is characterized and guaranteed from 0.4–2.5 GHz; performance at 3.5 GHz is not specified. Measured gain drops to ~8 dB and OIP3 degrades beyond +36 dBm at 3.5 GHz per application note extrapolation. For 5G FWA, consider purpose-built 3.3–3.8 GHz amplifiers such as Qorvo QPA9121 or Analog Devices ADMV8913.
How is thermal management implemented for the HMC454ST89 in production PCBs?
Thermal management requires soldering pins 2 and 4 plus the exposed thermal paddle directly to a solid copper ground plane with ≥6 thermal vias (0.3 mm diameter) connecting to inner/secondary ground layers. The datasheet specifies 73 °C/W junction-to-ground-paddle thermal resistance; achieving this demands ≥200 mm² of contiguous copper area under the package.
Is the HMC454ST89 pin-compatible with the HMC454ST89E variant?
Yes, the HMC454ST89 and HMC454ST89E share identical pinout, footprint, and electrical specifications. The only differences are RoHS compliance (matte Sn finish vs. Sn/Pb), MSL reflow profile (260 °C peak vs. 235 °C), and marking (H454XXXX vs. H454XXXX). Both are drop-in replacements in new designs.
107755-HMC454ST89 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Amplifier
- Frequency:
- 900MHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC454ST89
107755-HMC454ST89 FAQ
1.How can I place an order for 107755-HMC454ST89 through Aetrix?
Please submit a Request for Quotation (RFQ) for 107755-HMC454ST89 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 107755-HMC454ST89 reliable?
The price and inventory of 107755-HMC454ST89 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 107755-HMC454ST89 is usually 5 days.
3.What payment methods are accepted for 107755-HMC454ST89?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 107755-HMC454ST89 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 107755-HMC454ST89?
107755-HMC454ST89 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 107755-HMC454ST89 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 107755-HMC454ST89?
For technical support, including 107755-HMC454ST89 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 107755-HMC454ST89 requirements.
6.How does Aetrix verify that 107755-HMC454ST89 is sourced from the original manufacturer or authorized distributors?
All 107755-HMC454ST89 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 107755-HMC454ST89 meets industry standards.
7.What is the process for return or replacement of 107755-HMC454ST89?
All 107755-HMC454ST89 units undergo pre-shipment inspection (PSI). If there is an issue with 107755-HMC454ST89, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 107755-HMC454ST89 part is unused and in its original packaging.
Return procedure for 107755-HMC454ST89:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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