Analog Devices Inc. 108355-HMC409LP4
- Part No.:
- 108355-HMC409LP4
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
108355-HMC409LP4.pdf
- Description:
- EVAL BOARD HMC409LP4
- Quantity:
- Payment:

- Shipping:

Inventory:1,060
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Product details
Overview
HMC409LP4E from Analog Devices is a GaAs InGaP HBT monolithic microwave integrated circuit (MMIC) power amplifier optimized for 3.3–3.8 GHz operation, delivering 31 dB small-signal gain, +32.5 dBm saturated output power, and 40% power-added efficiency at Psat under +5 V supply. It serves as a final-stage RF power amplifier in WiMAX 802.16 base stations and fixed wireless access transmitters.
For engineers reviewing the HMC409LP4E datasheet, HMC409LP4E pinout, HMC409LP4E application, or HMC409LP4E equivalent, key selection criteria include its 46 dBm output IP3, integrated Vpd power control for dynamic output adjustment, EVM performance of 2% at +22 dBm OFDM output, and thermal design requirements tied to its 17.4 °C/W junction-to-paddle thermal resistance.
Technical Context
The HMC409LP4E employs a two-stage GaAs InGaP HBT architecture with independent biasing for Vcc1 (first stage) and Vcc2 (second stage), enabling stable gain and power performance across temperature. Its integrated Vpd terminal provides analog control over RF output power and quiescent current without external switching circuitry.
Designed for broadband operation across 3.3–3.8 GHz, the device achieves >13 dB output return loss and >10 dB input return loss while maintaining <0.05 dB/°C gain variation. The exposed paddle LFCSP package ensures low thermal impedance and requires direct grounding via multiple vias for RF stability and thermal management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 3.3–3.8 GHz - fully specified gain, power, and linearity across this band without tuning. |
| Saturated Output Power (Psat) | +32.5 dBm - delivers ~1.8 W RF output into 50 Ω with 40% PAE at +5 V. |
| Small-Signal Gain | 31 dB - enables single-stage amplification from driver-level inputs to system output power. |
| Output IP3 | +46 dBm - supports high-linearity OFDM transmission with 2% EVM at +22 dBm Pout. |
| Noise Figure | 5.8 dB - suitable as final-stage PA where noise contribution is secondary to power and linearity. |
| Supply Voltage | +5 V - single-rail operation simplifies power delivery; Icq = 615 mA at nominal bias. |
| Thermal Resistance | 17.4 °C/W - mandates PCB-level thermal design with exposed paddle soldered and via-stitched to inner ground planes. |
Pinout & Package
Package: 24-lead Lead Frame Chip Scale Package (LFCSP), 4 mm × 4 mm body, 0.85 mm height, RoHS-compliant matte Sn finish, MSL3 rating. Exposed paddle must be soldered to ground plane with ≥6 thermal vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–3, 5, 6, 8, 10–14, 18, 19, 21, 22, 24 | No Connect (N/C) | Internally unconnected; may be grounded for mechanical stability or EMI shielding. |
| 4 | RFIN | 50 Ω AC-coupled RF input; requires external DC blocking capacitor per application circuit. |
| 7 | Vpd | Analog power-down/control voltage; 0–5 V adjusts output power and Icq; 56 Ω series resistor recommended. |
| 9 | Vbias | DC bias supply for internal bias network; bypassed externally to minimize noise injection. |
| 15–17 | RFOUT | RF output and DC bias node for final stage; requires external matching and DC blocking. |
| 20 | Vcc2 | Power supply for second amplifier stage; requires local bypassing and choke isolation. |
| 23 | Vcc1 | Power supply for first amplifier stage; requires dedicated bypass capacitors per layout guidelines. |
| GND (exposed paddle) | Ground Reference | Primary RF and thermal ground; must be soldered and connected to system ground with ≥6 vias. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Vpd Control | Enables continuous RF output power and quiescent current adjustment from full-on to full-off without external switches or logic. |
| High Linearity (46 dBm IP3) | Supports wideband OFDM signals (e.g., WiMAX 802.16) with 2% EVM at +22 dBm, meeting spectral mask and adjacent channel leakage requirements. |
| Two-Stage Independent Biasing | Vcc1 and Vcc2 allow stage-specific optimization for gain flatness, power efficiency, and thermal distribution. |
| LFCSP Thermal Performance | 17.4 °C/W junction-to-paddle thermal resistance enables reliable operation up to +85 °C ambient when properly mounted. |
| Robust ESD Protection | HBM Class 1A (250 V) rating reduces handling sensitivity during assembly and test without requiring special precautions beyond standard ESD protocols. |
Applications
| WiMAX 802.16 Base Station | Fixed Wireless Access Transmitter |
|---|---|
Use Scenario: Outdoor subscriber unit or base station RF front-end operating in 3.5 GHz licensed band with OFDM modulation. IC Role / Device Role / Timing Role: Final-stage power amplifier delivering +32.5 dBm output with linearized 64-QAM signal integrity. Use Value: Meets WiMAX 802.16 spectral mask and EVM ≤2% at +22 dBm, eliminating need for external digital predistortion in cost-sensitive deployments. | Use Scenario: Point-to-multipoint wireless backhaul link operating at 3.6 GHz with 20 MHz channel bandwidth. IC Role / Device Role / Timing Role: High-efficiency RF PA driving antenna array with minimal thermal derating over industrial temperature range. Use Value: 40% PAE at Psat reduces power supply load and heatsink size; 0.04 dB/°C gain stability minimizes automatic gain control complexity. |
| Wireless Local Loop Terminal | ISM Band Infrastructure Amplifier |
Use Scenario: Indoor/outdoor CPE unit providing last-mile broadband connectivity in rural fixed-wireless networks. IC Role / Device Role / Timing Role: Compact, surface-mount PA replacing discrete transistor designs in space-constrained enclosures. Use Value: 4 mm × 4 mm LFCSP footprint and no external matching components beyond application circuit reduce BOM count and PCB area by >35% vs. hybrid alternatives. | Use Scenario: Licensed 3.5 GHz infrastructure equipment used in private LTE or neutral host small cell deployments. IC Role / Device Role / Timing Role: Linear driver amplifier supporting multi-carrier operation with high OIP3 and low gain ripple. Use Value: +46 dBm output IP3 and <1 dB gain variation across 3.3–3.8 GHz enable clean multi-tone transmission without intermodulation distortion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QPA9121 | 3.3–3.8 GHz, +33 dBm Psat, 32 dB gain, requires dual +5 V supplies; no integrated Vpd control. | Higher Psat but lacks analog power-down; needs external bias sequencing and control logic. | Select QPA9121 only if absolute maximum output power is prioritized over control flexibility and board space. |
| MACOM MAAP-010169 | 3.3–3.8 GHz, +31 dBm Psat, 30 dB gain, 38% PAE; uses 20-lead QFN, no Vpd pin, fixed bias. | Lower integration: no power control, higher thermal resistance (22 °C/W), requires more external components. | Choose MAAP-010169 only for legacy designs already using QFN packages and where analog power control is unnecessary. |
Compared with QPA9121 and MAAP-010169, the HMC409LP4E uniquely combines integrated Vpd control, 17.4 °C/W thermal resistance, and 2% EVM compliance in a single 24-lead LFCSP-enabling simplified RF front-end design for WiMAX and FWA systems without sacrificing linearity or thermal headroom.
Availability
HMC409LP4E is available at Aetrix Electronics and suitable for WiMAX 802.16 base stations, fixed wireless access transmitters, and wireless local loop terminals requiring stable component supply, consistent RF performance, and long-term industrial availability.
Supply support for HMC409LP4E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, automotive, and aerospace markets with precision signal processing solutions.
The HMC409LP4E belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for high-efficiency, high-linearity RF power amplification in licensed 3.3–3.8 GHz infrastructure applications.
FAQ
What is the operating frequency range of the HMC409LP4E?
The HMC409LP4E operates across 3.3–3.8 GHz with guaranteed gain, output power, and linearity specifications throughout this band. Its broadband design eliminates the need for external tuning components in WiMAX 802.16 and fixed wireless access applications. Frequency-dependent parameters such as gain variation (<0.05 dB/°C) and return loss (>10 dB input, >13 dB output) are characterized across the full range in the official datasheet.
Does the HMC409LP4E require external matching components?
Yes, the HMC409LP4E requires external matching per the application circuit: RFIN and RFOUT are internally matched to 50 Ω but need DC blocking capacitors (C1, C9–C10), bias chokes (L1–L3), and bypass capacitors (C11, C6–C7). The recommended layout uses Rogers 4350 substrate with precise microstrip lengths (e.g., TL1 = 0.068″ @ 12° electrical length) to maintain impedance integrity and maximize power transfer.
How does the Vpd pin function on the HMC409LP4E?
The Vpd pin on the HMC409LP4E provides analog control of RF output power and quiescent current. At +5 V, the device operates at full power (+32.5 dBm Psat); reducing Vpd lowers both output power and Icq linearly. A 56 Ω series resistor is recommended to limit control current (Ipd = 4 mA at +5 V), and switching speed is 20 ns for fast on/off transitions. This eliminates need for external power-down switches or complex bias sequencing circuits.
What thermal management is required for the HMC409LP4E?
The HMC409LP4E has a junction-to-paddle thermal resistance of 17.4 °C/W and must be mounted with its exposed paddle soldered directly to a solid copper ground plane using ≥6 thermal vias. Continuous power dissipation is rated at 3.74 W at +85 °C ambient, derating 57.5 mW/°C above that. Failure to implement proper thermal vias and ground stitching results in junction temperature exceeding 150 °C, triggering permanent degradation or failure.
Is the HMC409LP4E pin-compatible with other Hittite MMIC amplifiers?
No, the HMC409LP4E uses a proprietary 24-lead LFCSP (CP-24-16) package with unique pin assignments-including dedicated Vpd, Vbias, Vcc1, and Vcc2 terminals-not shared with earlier Hittite amplifiers like HMC408LP3 or HMC407LP3. Its pinout is defined in the "Pin Descriptions" section of the datasheet and must be followed exactly; misrouting Vcc1/Vcc2 or omitting Vpd termination will cause functional failure or damage.
108355-HMC409LP4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Amplifier
- Frequency:
- 3.3GHz ~ 3.8GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC409LP4
108355-HMC409LP4 FAQ
1.How can I place an order for 108355-HMC409LP4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 108355-HMC409LP4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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5.How can I obtain technical support or documentation for 108355-HMC409LP4?
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6.How does Aetrix verify that 108355-HMC409LP4 is sourced from the original manufacturer or authorized distributors?
All 108355-HMC409LP4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 108355-HMC409LP4 meets industry standards.
7.What is the process for return or replacement of 108355-HMC409LP4?
All 108355-HMC409LP4 units undergo pre-shipment inspection (PSI). If there is an issue with 108355-HMC409LP4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 108355-HMC409LP4 part is unused and in its original packaging.
Return procedure for 108355-HMC409LP4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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