Analog Devices Inc. 108779-HMC264LC3B
- Part No.:
- 108779-HMC264LC3B
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
108779-HMC264LC3B.pdf
- Description:
- EVAL BOARD HMC264LC3B
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HMC264LC3B from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC sub-harmonically pumped (x2) mixer with integrated LO amplifier, operating from 21–31 GHz RF, 10.5–15.5 GHz LO, and DC–6 GHz IF. It delivers 30 dB 2LO-to-RF isolation, −4 to +4 dBm LO drive requirement, and 12-lead 3×3 mm SMT package-enabling surface-mount assembly in millimeter-wave radios and test equipment.
For engineers reviewing the HMC264LC3B datasheet, HMC264LC3B pinout, HMC264LC3B application, or HMC264LC3B equivalent, key selection criteria include its sub-harmonic x2 pumping architecture, integrated +3V/+4V single-bias LO amplifier, DC-blocked 50 Ω RF/LO ports, wide IF bandwidth, and high 2LO/RF isolation eliminating external filtering.
Technical Context
The HMC264LC3B implements a sub-harmonic (x2) mixing architecture where the LO frequency is half the RF frequency, reducing LO generation complexity in E-band systems. Its monolithic GaAs design integrates an LO amplifier and passive diode-based mixer core on a single die.
It operates as a downconverter by default (per datasheet note), with DC-coupled IF output requiring external series capacitor for DC blocking. The 12-lead alumina package uses ground paddle soldering and requires RF grounding of pins 2,3,4,6,7,9,10,12 plus the bottom paddle for optimal isolation and thermal performance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 21–31 GHz - supports E-band point-to-point radio links and VSAT uplinks. |
| LO Frequency Range | 10.5–15.5 GHz - enables use of lower-frequency, lower-cost synthesizers for x2 pumping. |
| IF Bandwidth | DC–6 GHz - accommodates wideband modulation schemes including OFDM and QAM up to 5G NR FR2. |
| 2LO-to-RF Isolation | 30 dB typical - eliminates need for external 2LO filter between LO source and RF port. |
| Conversion Loss | 9–12 dB - defines signal attenuation from RF to IF path; impacts system noise figure budget. |
| LO Drive Requirement | −4 to +4 dBm - low-power LO input simplifies driver stage design and reduces power consumption. |
| Supply Current (Idd) | 25–28 mA at +3V/+4V - determines bias network sizing and thermal management requirements. |
Pinout & Package
Package: 12-lead, 3×3 mm leadless Pb-free SMT package with alumina body and gold-over-nickel plating; MSL3 rated; requires soldering of ground paddle and all designated GND pins to PCB RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Vdd | LO amplifier power supply; requires local RF bypass capacitors (e.g., 100 pF + 1000 pF) near pin. |
| 2, 3 | N/C | No internal connection; may be grounded without performance impact. |
| 4, 6, 7, 9, 10, 12 | GND | RF/DC ground terminals; must be soldered to PCB ground plane for signal integrity and thermal dissipation. |
| 5 | LO | AC-coupled 50 Ω LO input port (10.5–15.5 GHz); no DC path required. |
| 8 | IF | DC-coupled IF output port; external series capacitor mandatory to block DC and pass DC–6 GHz. |
| 11 | RF | AC-coupled 50 Ω RF input port (21–31 GHz); matched for minimal reflection in E-band. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LO amplifier | Single +3V/+4V bias operation reduces external component count and board space vs. discrete LO+mixer solutions. |
| Sub-harmonic (x2) pumping | Enables RF output at double the LO frequency-simplifying LO synthesis for 24–30 GHz systems. |
| 30 dB 2LO-to-RF isolation | Prevents LO leakage from degrading RF chain linearity and eliminates need for external bandpass filter. |
| DC–6 GHz IF bandwidth | Supports baseband and low-IF architectures with wide instantaneous bandwidth for radar and comms applications. |
| Leadless 3×3 mm SMT package | Enables automated reflow assembly and eliminates wire bonding; ground paddle improves thermal resistance (397 °C/W). |
Applications
| Point-to-Point Radios | Test Equipment & Sensors |
|---|---|
Use Scenario: High-capacity backhaul links operating in 24–28 GHz licensed spectrum with tight size and power constraints. IC Role / Device Role / Timing Role: Downconverting received E-band RF signals to IF for digitization and demodulation. Use Value: Integrated LO amplifier and 30 dB 2LO/RF isolation reduce bill-of-materials and simplify RF front-end filtering. | Use Scenario: Vector network analyzer (VNA) receiver modules requiring broadband millimeter-wave signal analysis. IC Role / Device Role / Timing Role: Active mixer core in VNA IF section, accepting swept RF input and delivering wideband IF output. Use Value: DC–6 GHz IF bandwidth enables real-time capture of modulated waveforms across full IF range without switching. |
| Point-to-Multi-Point Radios & VSAT | Military End-Use |
Use Scenario: Subscriber unit transceivers in fixed wireless access networks using 26.5–29.5 GHz unlicensed bands. IC Role / Device Role / Timing Role: Sub-harmonic upconverter for transmit path, generating 26–30 GHz RF from 13–15 GHz LO. Use Value: −4 to +4 dBm LO drive tolerance allows compatibility with low-power PLL/VCO sources while maintaining conversion gain stability. | Use Scenario: Electronic warfare (EW) receivers needing rapid frequency agility and high dynamic range in contested environments. IC Role / Device Role / Timing Role: Front-end mixer in channelized receiver architecture, handling wide instantaneous bandwidth with low spurious generation. Use Value: Measured MxN spurious outputs ≤ −17 dBc (e.g., 2LO/RF) ensure clean spectral response under multi-tone interference conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sub-harmonic mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (17–32 GHz), higher IP3 (+14 dBm), but requires −10 to 0 dBm LO drive and no integrated LO amp. | Requires external LO buffer; better suited for high-linearity receive chains where LO power is readily available. | Select HMC1048LP3E when higher input-referred IP3 and broader RF coverage outweigh added LO drive complexity. |
| Qorvo QM11036 | Similar 21–32 GHz RF range and sub-harmonic architecture, but uses different package (4×4 mm QFN) and specifies 25 dB 2LO/RF isolation (vs. 30 dB). | Lower isolation may require additional filtering in sensitive receive paths; compatible with standard QFN reflow profiles. | Select QM11036 when footprint flexibility and QFN assembly infrastructure exist, and 5 dB lower isolation is acceptable. |
Compared with HMC264LC3B, HMC1048LP3E offers higher linearity but demands more LO power and lacks integration, while QM11036 provides comparable frequency coverage in a larger QFN package with reduced isolation-making HMC264LC3B optimal for compact, low-LO-power E-band designs requiring minimal external filtering.
Availability
HMC264LC3B is available at Aetrix Electronics and suitable for point-to-point radios, test equipment, and military communications systems requiring stable component supply across extended temperature ranges (−40°C to +85°C) and high-frequency reliability.
Supply support for HMC264LC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF IC portfolio, specializing in microwave/mmWave components for defense, communications, and instrumentation.
The HMC264LC3B belongs to Hittite's legacy GaAs MMIC mixer family, designed specifically for E-band sub-harmonic mixing applications where LO simplification, integration, and surface-mount manufacturability are critical.
FAQ
What is the recommended LO drive level for optimal performance of the HMC264LC3B?
The HMC264LC3B is specified for −4 to +4 dBm LO drive at Vdd = +3V or +4V. At −4 dBm, typical conversion loss is 9 dB and 2LO-to-RF isolation reaches 30 dB. Increasing LO drive beyond +4 dBm does not improve performance and risks exceeding absolute maximum ratings. The HMC264LC3B's integrated LO amplifier ensures stable gain across this range without external buffering.
Does the HMC264LC3B support both upconversion and downconversion?
Yes, the HMC264LC3B supports both modes. Datasheet measurements are performed as a downconverter by default (IF = 1 GHz), but upconverter performance is characterized in Section 4, showing usable conversion gain across DC–6 GHz IF with RF = 30 GHz and LO = 13.5 GHz. Port definitions remain fixed: RF (21–31 GHz), LO (10.5–15.5 GHz), IF (DC–6 GHz).
How should the IF port of the HMC264LC3B be interfaced in a circuit?
The IF port (Pin 8) is DC-coupled and must be externally DC-blocked using a series capacitor sized for the target IF bandwidth (e.g., 100 pF for >1 GHz). Applying any DC voltage to Pin 8 will cause die non-function or permanent failure. The capacitor value must maintain impedance <5 Ω across DC–6 GHz; multilayer ceramic types with low ESL are recommended.
What thermal management is required for continuous operation of the HMC264LC3B?
The HMC264LC3B has a junction-to-ground-paddle thermal resistance of 397 °C/W and max continuous power dissipation of 227 mW at Ta = 85 °C. To sustain full performance over −40°C to +85°C ambient, the exposed ground paddle must be soldered to a thermally robust PCB ground plane with ≥6 thermal vias (0.3 mm diameter) connecting to inner/outer ground layers. No heatsink is required for typical 25–28 mA Idd operation.
Is the HMC264LC3B pin-compatible with other Hittite mixer packages like the HMC263LC3B?
No, the HMC264LC3B is not pin-compatible with HMC263LC3B. Although both use 12-lead 3×3 mm packages, pin functions differ: HMC264LC3B assigns Pin 8 to IF and Pin 11 to RF, whereas HMC263LC3B uses Pin 8 for RF and Pin 11 for IF. Swapping them without layout revision will result in functional failure. Always verify pin mapping against the respective datasheet schematic.
108779-HMC264LC3B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Mixer
- Frequency:
- 21GHz ~ 31GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC264LC3B
108779-HMC264LC3B FAQ
1.How can I place an order for 108779-HMC264LC3B through Aetrix?
Please submit a Request for Quotation (RFQ) for 108779-HMC264LC3B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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5.How can I obtain technical support or documentation for 108779-HMC264LC3B?
For technical support, including 108779-HMC264LC3B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 108779-HMC264LC3B requirements.
6.How does Aetrix verify that 108779-HMC264LC3B is sourced from the original manufacturer or authorized distributors?
All 108779-HMC264LC3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 108779-HMC264LC3B meets industry standards.
7.What is the process for return or replacement of 108779-HMC264LC3B?
All 108779-HMC264LC3B units undergo pre-shipment inspection (PSI). If there is an issue with 108779-HMC264LC3B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 108779-HMC264LC3B part is unused and in its original packaging.
Return procedure for 108779-HMC264LC3B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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