Analog Devices Inc. 110416-HMC452ST89
- Part No.:
- 110416-HMC452ST89
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
110416-HMC452ST89.pdf
- Description:
- BOARD EVAL HMC452ST89E 470MHZ
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HMC452ST89 from Analog Devices (formerly Hittite Microwave) is a GaAs InGaP HBT 1 W MMIC power amplifier operating from 0.4 to 2.2 GHz in an SOT-89 package. It delivers +31 dBm P1dB output, +49 dBm OIP3 at 2.1 GHz, 50% PAE, and 9 dB gain at 2100 MHz - optimized for cellular infrastructure and fixed wireless transmitters requiring high linearity and efficiency under +5 V single-supply operation.
For engineers reviewing the HMC452ST89 datasheet, HMC452ST89 pinout, HMC452ST89 application, or HMC452ST89 equivalent, this page provides verified RF performance data, thermal and absolute maximum ratings, SOT-89 terminal mapping, and validated alternatives for CDMA2000, W-CDMA, and PCS band power amplification stages.
Technical Context
The HMC452ST89 uses a monolithic GaAs InGaP HBT process with integrated bias network and DC-coupled RFIN/RFOUT ports. Its two-stage architecture enables broadband operation across five discrete frequency bands (400–410, 450–496, 810–960, 1710–1990, and 2010–2170 MHz), each with dedicated external matching per application circuit.
Thermal design relies on direct soldering of pins 2 and 4 plus the exposed paddle to PCB ground plane, with junction-to-ground-paddle thermal resistance of 24.1 °C/W. Operation is specified from –40 °C to +85 °C, with ESD rating Class 1A (HBM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 0.4–2.2 GHz; covers GSM, CDMA, W-CDMA, PCS, and Fixed Wireless bands in five defined sub-bands. |
| P1dB Output Power | +31.5 dBm max at 2100 MHz; enables linear drive of final stage in 3G/4G base station transceivers. |
| OIP3 | +49 dBm at 2100 MHz; supports low ACPR in W-CDMA (–45 dBc) and CDMA2000 channel power (+25 dBm). |
| Power Added Efficiency | 50% at +31 dBm Pout; reduces thermal load and supply current demand in compact RF modules. |
| Supply Voltage & Current | +5 V DC, 510 mA quiescent; single-rail operation simplifies power management vs. dual-supply alternatives. |
| Noise Figure | 6.5 dB typical at 400 MHz; suitable as driver stage but not front-end LNA due to NF >6 dB. |
| Gain | 21 dB at 400 MHz, 9 dB at 2100 MHz; flatness managed via external matching networks per band. |
Pinout & Package
SOT-89 package with exposed thermal paddle; requires soldering of pins 2 and 4 plus paddle to RF/DC ground plane for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | RFIN | DC-coupled RF input; requires off-chip matching (e.g., C1=12 pF, L3=4.3 nH) per application circuit. |
| 2 | GND | RF/DC ground; must be soldered to PCB ground plane with multiple vias for low-inductance path. |
| 3 | RFOUT | RF output and DC bias injection point for output stage; requires off-chip matching (e.g., C5=39 pF, L4=5.1 nH). |
| 4 | GND | RF/DC ground; symmetric with Pin 2; both pins and paddle form primary thermal conduction path. |
Key Features
| Feature | Design Value |
|---|---|
| InGaP HBT Process | Enables high breakdown voltage (>6 V), robust ESD tolerance (Class 1A), and stable performance over temperature. |
| Broadband Matching Support | Validated application circuits for 400, 470, 900, 1900, and 2100 MHz bands reduce RF design risk and time-to-test. |
| +5 V Single-Supply Operation | Eliminates need for negative or dual rails; compatible with standard telecom power architectures. |
| High Linearity at High Power | +49 dBm OIP3 at 2100 MHz ensures compliance with W-CDMA ACPR (–45 dBc) and CDMA2000 spectral mask requirements. |
| Thermally Optimized Package | 24.1 °C/W junction-to-paddle resistance allows 2.7 W continuous dissipation at +85 °C ambient with proper PCB layout. |
Applications
| Cellular Base Station Driver | Fixed Wireless Access Transmitter |
|---|---|
Use Scenario: Final driver stage in 2.1 GHz W-CDMA macrocell BTS before Doherty PA. IC Role / Device Role / Timing Role: Linear power amplifier delivering +31 dBm P1dB and +49 dBm OIP3 into 50 Ω load. Use Value: Enables –45 dBc adjacent channel power ratio at 64 DPCH without digital predistortion overhead. | Use Scenario: Transmit chain in 450 MHz licensed fixed wireless CPE unit. IC Role / Device Role / Timing Role: High-efficiency RF power amplifier operating at +5 V with 50% PAE. Use Value: Reduces thermal footprint and extends outdoor unit lifetime in uncooled enclosures. |
| CDMA2000 Infrastructure | PCS Band Repeaters |
Use Scenario: Forward link amplifier in 1.96 GHz CDMA2000 base station sector module. IC Role / Device Role / Timing Role: High-dynamic-range power amplifier supporting +25 dBm channel power. Use Value: Meets IS-2000 spectral emission masks with margin using analog bias tuning. | Use Scenario: Bidirectional repeater uplink amplifier in 1900 MHz PCS band. IC Role / Device Role / Timing Role: Low-noise, high-gain driver (12 dB @ 1900 MHz) preceding final PA stage. Use Value: Provides sufficient gain and IP3 headroom to suppress intermodulation from co-located transmitters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QPA2210 | 0.7–2.7 GHz range, +33 dBm P1dB, +50 dBm OIP3, 5 V/450 mA, QFN-16 package. | Wider bandwidth and higher output; requires different PCB layout and thermal interface. | Preferred for new designs needing extended upper-band coverage beyond 2.2 GHz. |
| Analog Devices HMC451ST89 | Same SOT-89 package, 0.4–1.2 GHz range, +30 dBm P1dB, +47 dBm OIP3, 5 V/480 mA. | Narrower frequency support; optimized for 400–900 MHz only. | Drop-in replacement where 2.1 GHz operation is not required and lower cost is prioritized. |
Compared with QPA2210 and HMC451ST89, the HMC452ST89 uniquely balances 2.2 GHz upper-band capability, SOT-89 manufacturability, and proven 50% PAE at +31 dBm - making it optimal for cost-sensitive, thermally constrained PCS and W-CDMA repeater designs.
Availability
HMC452ST89 is available at Aetrix Electronics and suitable for cellular infrastructure, fixed wireless access, and repeater systems requiring stable component supply, RoHS-compliant sourcing, and long-term lifecycle support.
Supply support for HMC452ST89 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF product portfolio for communications, defense, and instrumentation markets.
The HMC452ST89 belongs to the Hittite Microwave MMIC power amplifier family, designed specifically for high-linearity, high-efficiency transmitter stages in licensed spectrum wireless infrastructure.
FAQ
What is the absolute maximum RF input power rating for the HMC452ST89?
The HMC452ST89 has an absolute maximum RF input power rating of +31 dBm at +5 V supply, as specified in the Absolute Maximum Ratings table. Exceeding this level risks permanent damage to the InGaP HBT transistor cells. For reliable operation, input power should remain ≤+10 dBm in linear regions, with compression managed via external attenuators or AGC loops when driving near P1dB.
Does the HMC452ST89 require external DC blocking capacitors on RFIN or RFOUT?
No - the HMC452ST89 features DC-coupled RFIN and RFOUT ports, eliminating the need for external DC blocking capacitors. However, off-chip matching components (e.g., C1, L3 for RFIN; C5, L4 for RFOUT) are mandatory per the 400 MHz application circuit. The absence of internal blocking caps allows simplified bias tee integration in active antenna systems.
Can the HMC452ST89 operate at supply voltages other than +5 V?
Yes - the HMC452ST89 is characterized from +4.5 V to +5.5 V. Gain, P1dB, Psat, and OIP3 vary measurably across this range (e.g., +49 dBm OIP3 at +5 V drops to +47 dBm at +4.5 V). Stable operation outside this window is not guaranteed; exceeding +6.0 V violates absolute maximum ratings and may cause catastrophic failure.
Is the HMC452ST89 pin-compatible with the HMC452ST89E variant?
Yes - the HMC452ST89 and HMC452ST89E share identical pinout, package dimensions, and electrical specifications. The sole difference is lead finish: Sn/Pb for HMC452ST89 and 100% matte Sn (RoHS-compliant) for HMC452ST89E. Both are MSL1 rated and compatible with the same PCB layout and reflow profile (235 °C peak for ST89, 260 °C for ST89E).
What thermal management practices are required for sustained +31 dBm operation of the HMC452ST89?
Sustained +31 dBm operation requires soldering pins 2 and 4 plus the exposed thermal paddle directly to a multilayer PCB ground plane with ≥6 thermal vias (0.3 mm diameter) under the paddle. Ambient temperature must not exceed +85 °C, and board-level copper area should be ≥250 mm² to maintain junction temperature ≤125 °C. Derating is required above 85 °C ambient at 41.5 mW/°C.
110416-HMC452ST89 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Amplifier
- Frequency:
- 470MHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC452ST89
110416-HMC452ST89 FAQ
1.How can I place an order for 110416-HMC452ST89 through Aetrix?
Please submit a Request for Quotation (RFQ) for 110416-HMC452ST89 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 110416-HMC452ST89 reliable?
The price and inventory of 110416-HMC452ST89 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 110416-HMC452ST89 is usually 5 days.
3.What payment methods are accepted for 110416-HMC452ST89?
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110416-HMC452ST89 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 110416-HMC452ST89 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 110416-HMC452ST89?
For technical support, including 110416-HMC452ST89 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 110416-HMC452ST89 requirements.
6.How does Aetrix verify that 110416-HMC452ST89 is sourced from the original manufacturer or authorized distributors?
All 110416-HMC452ST89 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 110416-HMC452ST89 meets industry standards.
7.What is the process for return or replacement of 110416-HMC452ST89?
All 110416-HMC452ST89 units undergo pre-shipment inspection (PSI). If there is an issue with 110416-HMC452ST89, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 110416-HMC452ST89 part is unused and in its original packaging.
Return procedure for 110416-HMC452ST89:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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