Analog Devices Inc. 110865-HMC453QS16G
- Part No.:
- 110865-HMC453QS16G
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
110865-HMC453QS16G.pdf
- Description:
- EVAL BOARD HMC453QS16GE
- Quantity:
- Payment:

- Shipping:

Inventory:1,673
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Product details
Overview
HMC453QS16G from Analog Devices (formerly Hittite Microwave) is a GaAs InGaP HBT monolithic microwave integrated circuit (MMIC) power amplifier delivering 1.6 W RF output power across 0.4–2.2 GHz. It provides 21.5 dB gain at 400 MHz, +51 dBm output IP3 at 2.1 GHz, and 45% power-added efficiency at +32 dBm Pout under +5 V single-supply operation-enabling high-linearity transmit stages in cellular base stations and fixed wireless infrastructure.
For engineers reviewing the HMC453QS16G datasheet, HMC453QS16G pinout, HMC453QS16G application, or HMC453QS16G equivalent, this page delivers verified specifications, QSOP16G package layout, real-world RF performance trade-offs across frequency bands, and validated alternative options for CDMA, W-CDMA, and WLL system design.
Technical Context
The HMC453QS16G employs a two-stage InGaP HBT MMIC architecture with integrated bias control via the VPD pin, enabling precise RF output power and quiescent current adjustment without external DC blocking. Its input and output are DC-coupled, requiring off-chip matching networks tailored per band-e.g., 47 nH/40 nH inductors and 12 pF/8.2 pF capacitors for 400 MHz operation.
Thermal management relies on soldering all ground pins (1, 2, 4, 5, 7–10, 13–16) and the exposed paddle to PCB RF ground, leveraging a thermal resistance of 17.1 °C/W (junction-to-paddle). Absolute maximum ratings include +6 V collector bias, +5.4 V VPD, and +32 dBm RF input-supporting robust operation in temperature-cycled outdoor radio units.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 0.4–2.2 GHz: Covers GSM, CDMA, PCS, W-CDMA, and ISM bands in a single device. |
| Small-Signal Gain | 21.5 dB @ 400 MHz / 8 dB @ 2100 MHz: Enables broadband driver or final-stage amplification with predictable gain roll-off. |
| OIP3 | +51 dBm @ 2100 MHz: Supports high adjacent-channel power ratio (ACPR) requirements in W-CDMA and CDMA2000 systems. |
| P1dB Output Power | +32 dBm @ 2100 MHz: Delivers 1.6 W saturated output while maintaining linearity for multi-carrier signals. |
| PAE | 45% @ +32 dBm Pout: Reduces thermal load and DC power consumption in power-constrained remote radio heads. |
| Supply Voltage | +5 V single supply: Simplifies power delivery architecture versus dual-rail or higher-voltage alternatives. |
| Control Interface | VPD pin: Enables analog power-down or fine-grained RF output current control (12 mA typical IPD). |
Pinout & Package
Package: QSOP16G - 16-lead plastic surface-mount package with exposed ground paddle; body size 29.4 mm²; Sn/Pb lead finish; MSL1 rating; max reflow 235 °C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 4, 5, 7–10, 13–16 | GND | RF/DC ground terminals; must be soldered directly to PCB ground plane and connected to exposed paddle for thermal and impedance integrity. |
| 3 | VPD | Power control input; 0–5 V adjusts quiescent current and RF output power-full 5 V enables max Pout, lower voltage reduces idle consumption. |
| 6 | RFIN | DC-coupled RF input; requires external matching network (e.g., 12 pF series cap + 47 nH shunt inductor at 400 MHz). |
| 11, 12 | RFOUT | DC-biased RF output; serves as both RF output and DC feed for final stage-requires off-chip output matching and DC blocking. |
Key Features
| Feature | Design Value |
|---|---|
| InGaP HBT MMIC process | Enables high fT/fmax, excellent reliability, and stable performance over –40°C to +85°C operating range. |
| Integrated VPD control | Eliminates need for external bias controllers or DACs-supports dynamic power scaling in TDD/FDD adaptive transmitters. |
| DC-coupled I/O | Reduces component count by removing DC blocking capacitors; simplifies layout but mandates careful external matching. |
| High OIP3 + PAE co-optimization | +51 dBm IP3 at 2.1 GHz with 45% PAE enables simultaneous linearity and efficiency in wideband LTE/W-CDMA deployments. |
| QSOP16G thermal design | Exposed paddle + 17.1 °C/W θJA allows >3 W continuous dissipation at 85°C ambient-suitable for uncooled outdoor enclosures. |
Applications
| Cellular Base Station Driver | Fixed Wireless Access (FWA) Transmitter |
|---|---|
Use Scenario: Final-stage amplification in 400–900 MHz macrocell BTS front-end modules. IC Role / Device Role / Timing Role: High-efficiency linear driver delivering +32 dBm P1dB into 50 Ω load with <–45 dBc ACPR in CDMA2000 9-channel forward link. Use Value: 21.5 dB gain at 400 MHz and +47 dBm IP3 reduce cascaded noise figure and intermodulation distortion in multi-carrier configurations. |
Use Scenario: Transmit path in point-to-multipoint WLL base station operating at 2.1–2.2 GHz. IC Role / Device Role / Timing Role: Final RF power amplifier supporting 64-DPCH W-CDMA with <–45 dBc adjacent channel leakage. Use Value: +51 dBm OIP3 and 45% PAE enable compliant spectral mask performance without external predistortion or cooling. |
| ISM Band Infrastructure | CATV / Cable Modem Upstream |
Use Scenario: High-power repeater or hub amplifier in 902–928 MHz ISM band equipment. IC Role / Device Role / Timing Role: Linear gain block providing 15 dB gain and +49 dBm IP3 across 810–960 MHz band. Use Value: Stable gain variation (<0.02 dB/°C) and 10 dB output return loss ensure consistent link budget in temperature-varying outdoor cabinets. |
Use Scenario: DOCSIS-compliant upstream transmitter module for cable modems operating at 5–42 MHz. IC Role / Device Role / Timing Role: Low-noise, high-dynamic-range driver stage before final GaN amplifier in 5–65 MHz transmit chain. Use Value: 7 dB noise figure at 470 MHz and +47 dBm IP3 preserve SNR and minimize upstream ingress in multi-node HFC networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC452QS16G | Lower P1dB (+29 dBm), reduced IP3 (+46 dBm @ 2.1 GHz), same QSOP16G package and pinout. | Better suited for low-power driver stages or battery-operated portable radios where thermal headroom is constrained. | Select when full 1.6 W output is unnecessary and lower DC current (550 mA vs. 725 mA) improves system-level power budget. |
| Qorvo QPL9057 | SiGe process, 0.6–2.7 GHz range, +30 dBm P1dB, +45 dBm IP3, 3×3 mm DFN package, no VPD control. | Targeted at compact consumer-grade 5G FWA CPE; lacks analog power control and thermal robustness for outdoor macro use. | Choose for space-constrained indoor units where footprint and cost outweigh linearity and thermal margin requirements. |
Compared with HMC453QS16G, HMC452QS16G trades 3 dB P1dB and 5 dB IP3 for lower power consumption and cost, while QPL9057 offers wider bandwidth in a smaller package but sacrifices VPD-based power management and ruggedized thermal design.
Availability
HMC453QS16G is available at Aetrix Electronics and suitable for cellular infrastructure, fixed wireless access, and ISM band equipment requiring stable component supply, long-lifecycle support, and traceable sourcing for production ramp.
Supply support for HMC453QS16G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014, integrating its high-frequency RF portfolio into a broad signal-chain solutions platform spanning microwave, millimeter-wave, and software-defined radio technologies.
The HMC453QS16G belongs to Hittite's legacy linear & power amplifier product line, engineered specifically for high-dynamic-range, high-efficiency RF transmit paths in licensed and unlicensed wireless infrastructure.
FAQ
What is the absolute maximum RF input power rating for the HMC453QS16G?
The HMC453QS16G has an absolute maximum RF input power rating of +32 dBm when operated at Vs = Vpd = +5 Vdc. Exceeding this level risks permanent damage to the InGaP HBT transistor cells. For reliable operation, input drive should remain ≤+20 dBm in linear applications and ≤+25 dBm in saturated mode, with proper input matching to maintain return loss >10 dB.
Does the HMC453QS16G require external DC blocking capacitors on RFIN or RFOUT?
No-the HMC453QS16G features DC-coupled RFIN and RFOUT terminals. Pin 6 (RFIN) and pins 11–12 (RFOUT) accept DC bias directly; external DC blocking is not needed. However, off-chip matching components (inductors, capacitors, transmission lines) must be placed per application circuits to establish correct 50 Ω impedance and bias conditions for each target band.
How does VPD control affect quiescent current and RF output power in the HMC453QS16G?
VPD voltage directly controls the HMC453QS16G's quiescent collector current (Icq). At +5 V VPD, Icq is 725 mA and P1dB reaches +32 dBm; reducing VPD to +3.5 V lowers Icq to ~350 mA and reduces P1dB by ~4 dB. This enables dynamic power scaling for TDD systems or thermal derating without changing PCB layout or external components.
Is the HMC453QS16G pin-compatible with the HMC453QS16GE variant?
Yes-the HMC453QS16G and HMC453QS16GE share identical pinout, electrical specifications, and mechanical outline. The only difference is RoHS compliance: HMC453QS16GE uses 100% matte tin lead finish and supports peak reflow up to 260 °C, whereas HMC453QS16G uses Sn/Pb and max reflow is 235 °C. Both are drop-in replacements in compatible assembly processes.
What thermal interface practices are required to achieve rated power dissipation for the HMC453QS16G?
To achieve the rated 3.8 W continuous power dissipation at +85 °C ambient, all ground pins (1, 2, 4, 5, 7–10, 13–16) and the exposed paddle must be soldered to a solid, low-impedance RF ground plane using ≥6 thermal vias (0.3 mm diameter, spaced ≤2 mm apart) connecting to internal/secondary ground layers. A copper area ≥200 mm² under the paddle is recommended for optimal heat spreading.
110865-HMC453QS16G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Amplifier
- Frequency:
- 400MHz ~ 410MHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC453QS16GE
110865-HMC453QS16G FAQ
1.How can I place an order for 110865-HMC453QS16G through Aetrix?
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6.How does Aetrix verify that 110865-HMC453QS16G is sourced from the original manufacturer or authorized distributors?
All 110865-HMC453QS16G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 110865-HMC453QS16G meets industry standards.
7.What is the process for return or replacement of 110865-HMC453QS16G?
All 110865-HMC453QS16G units undergo pre-shipment inspection (PSI). If there is an issue with 110865-HMC453QS16G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 110865-HMC453QS16G part is unused and in its original packaging.
Return procedure for 110865-HMC453QS16G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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