Analog Devices Inc. 112409-HMC814LC3B
- Part No.:
- 112409-HMC814LC3B
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
112409-HMC814LC3B.pdf
- Description:
- EVAL BOARD HMC814LC3B
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HMC814LC3B from Analog Devices (formerly Hittite Microwave) is a GaAs pHEMT-based x2 active broadband frequency multiplier IC designed for RF signal generation in LO chains. It delivers +17 dBm typical output power across 13–24.6 GHz output range when driven by +4 dBm at 6.5–12.3 GHz input, with >25 dBc Fo/3Fo isolation and -136 dBc/Hz SSB phase noise at 100 kHz offset - enabling high-fidelity clock synthesis in OC-192/STM-64 systems.
For engineers reviewing the HMC814LC3B datasheet, HMC814LC3B pinout, HMC814LC3B application, or HMC814LC3B equivalent, key selection criteria include its 12-lead 3×3 mm RoHS-compliant SMT package, single +5 V supply operation at 88 mA, 50 Ω AC-coupled I/O, and suitability for space-constrained microwave radio and test instrumentation designs requiring low additive phase noise and high harmonic suppression.
Technical Context
The HMC814LC3B implements a monolithic GaAs pHEMT MMIC architecture optimized for second-harmonic generation without external tuning elements. Its internal bias network supports stable operation across -40°C to +85°C with integrated thermal management via alumina substrate and soldered ground paddle.
It operates as a fixed-ratio (×2) active multiplier with no control inputs or programmability - input and output are both 50 Ω AC-coupled, and all unused pins (4–6, 11) must be grounded per RF layout guidelines. Supply pins Vdd1/Vdd2 accept +5 V ±0.5 V with recommended multi-value bypassing (100 pF / 1 nF / 2.2 µF).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Frequency Range | 13–24.6 GHz - covers full Ku-band and lower Ka-band for VSAT and point-to-point radios. |
| Input Frequency Range | 6.5–12.3 GHz - enables use with common X-band synthesizers and fundamental LO sources. |
| Typical Output Power | +17 dBm @ +4 dBm drive - sufficient to drive mixers or cascaded multipliers without intermediate amplification. |
| Fo & 3Fo Isolation | >25 dBc - suppresses fundamental and third-harmonic feedthrough to maintain spectral purity in sensitive receivers. |
| SSB Phase Noise | -136 dBc/Hz @ 100 kHz offset (input = 19 GHz) - preserves EVM in high-order QAM modulated links. |
| Supply Current | 88 mA @ +5 V - enables low-power LO chain design with minimal thermal load on PCB. |
| Operating Temperature | -40°C to +85°C - qualified for industrial and aerospace environments without derating. |
Pinout & Package
Package: 12-lead 3×3 mm leadless ceramic SMT package (alumina body, gold-over-nickel plating, MSL3), with exposed ground paddle requiring solder connection to PCB RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 7, 9 | GND | RF/DC ground terminals - must be soldered to top-layer ground pour and connected via multiple vias to internal ground plane. |
| 2 | RFIN | 50 Ω AC-coupled RF input - requires external DC blocking if source is not AC-coupled; matched for broadband 6.5–12.3 GHz drive. |
| 4–6, 11 | N/C | No internal connection - but measured data assumes these pins are grounded to minimize parasitic resonance. |
| 8 | RFOUT | 50 Ω AC-coupled RF output - delivers multiplied signal at 2× input frequency; requires external DC blocking for downstream stages. |
| 10, 12 | Vdd2, Vdd1 | +5 V supply inputs - each requires local decoupling (100 pF + 1 nF + 2.2 µF) to suppress supply-induced phase noise. |
Key Features
| Feature | Design Value |
|---|---|
| x2 Active Multiplication | Monolithic GaAs pHEMT implementation eliminates discrete diode or transistor staging, reducing size and assembly complexity in LO chains. |
| +17 dBm Output Power | Enables direct drive of passive mixers or low-gain IF amplifiers without intermediate gain stages - simplifying board layout and BOM. |
| -136 dBc/Hz Phase Noise | Preserves system-level SNR in high-data-rate wireless links (e.g., 10G Ethernet over RF, E-band backhaul) where LO purity dictates error vector magnitude. |
| RoHS-Compliant SMT Package | Leadless 3×3 mm ceramic package supports reflow assembly and eliminates wire bonding - improving reliability and yield in automated production. |
| 25 dBc Harmonic Suppression | Reduces filtering requirements at RFOUT, allowing smaller, lower-cost bandpass filters or enabling direct connection to wideband receivers. |
Applications
| SONET OC-192 Clock Synthesis | Point-to-Point Microwave Radios |
|---|---|
|
Use Scenario: Generating 9.953 GHz or 10.709 GHz clock signals for OC-192/STM-64 line cards using a lower-frequency synthesizer. IC Role / Device Role / Timing Role: Second-harmonic multiplier converting 4.9765 GHz or 5.3545 GHz fundamental to precise optical line rate clocks. Use Value: Eliminates need for high-frequency VCOs or complex PLLs operating above 10 GHz - improving jitter margin and reducing design risk. |
Use Scenario: Building compact, high-efficiency LO chains for 23–24.6 GHz transceivers in licensed microwave backhaul links. IC Role / Device Role / Timing Role: Final-stage ×2 multiplier delivering clean, high-power LO signal to up/down-conversion mixers. Use Value: Achieves >+17 dBm output with <−136 dBc/Hz phase noise - meeting ETSI Class 4 spectral mask and adjacent channel interference limits. |
| Test Instrumentation Signal Sources | Military Radar Sensors |
|
Use Scenario: Extending frequency coverage of benchtop signal generators into Ku/Ka-band for component characterization and receiver testing. IC Role / Device Role / Timing Role: Active multiplier module in modular RF source architecture, driven by synthesized 10 GHz reference. Use Value: Delivers calibrated, repeatable +17 dBm output with known phase noise floor - enabling traceable measurement uncertainty budgets. |
Use Scenario: LO generation in airborne or ground-based radar front-ends requiring radiation-tolerant, high-reliability RF components. IC Role / Device Role / Timing Role: Stable ×2 multiplier in coherent T/R module LO distribution network, operating across military temperature range. Use Value: Maintains >25 dBc harmonic rejection and -40°C to +85°C performance without recalibration - supporting mission-critical uptime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar active frequency multiplier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1084LP3E | ×2 multiplier, 10–20 GHz output, +15 dBm output power, -132 dBc/Hz phase noise @ 100 kHz, same 3×3 mm package. | Narrower bandwidth limits use in 23–24.6 GHz VSAT bands; lower output power may require driver stage. | Select when targeting 10–20 GHz only and cost sensitivity outweighs 2 dB output/power efficiency trade-off. |
| Qorvo QPL9057 | ×2 multiplier, 13–22 GHz output, +16 dBm output, -134 dBc/Hz phase noise, 2.5×2.5 mm QFN package. | Smaller footprint but lower Fo isolation (20 dBc) and no specified 3Fo suppression; not rated for -40°C operation. | Consider for commercial-grade, space-constrained designs below 22 GHz where extended temperature range is not required. |
Compared with HMC814LC3B, HMC1084LP3E offers narrower bandwidth and reduced output, while QPL9057 trades thermal robustness and harmonic suppression for footprint reduction - making HMC814LC3B the preferred choice for wideband, high-reliability microwave systems demanding consistent 13–24.6 GHz performance and military-grade environmental tolerance.
Availability
HMC814LC3B is available at Aetrix Electronics and suitable for SONET OC-192 clock generation, point-to-point microwave radios, and military radar sensor systems requiring stable component supply, long-term lifecycle support, and guaranteed RoHS-compliant sourcing.
Supply support for HMC814LC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF product portfolio, specializing in GaAs, GaN, and SiGe MMIC solutions for defense, communications, and instrumentation markets.
The HMC814LC3B belongs to Hittite's legacy active frequency multiplier family, engineered specifically for high-isolation, low-phase-noise LO multiplication in microwave radio and optical transport systems - emphasizing broadband performance, surface-mount manufacturability, and ruggedized thermal design.
FAQ
What is the recommended input drive level for optimal performance of the HMC814LC3B?
The HMC814LC3B achieves best-in-class output power and phase noise at +4 dBm input drive, as validated in the datasheet's electrical specifications table. Operation between 0 and +6 dBm is supported, but output power rolls off below +2 dBm and compression begins above +5 dBm. For HMC814LC3B, maintaining +4 dBm ensures +17 dBm typical output and -136 dBc/Hz phase noise at 100 kHz offset - critical for OC-192 timing and radar LO applications.
Does the HMC814LC3B require external bias sequencing or power-up timing control?
No - the HMC814LC3B has no bias sequencing requirement. Both Vdd1 and Vdd2 pins accept +5 V ±0.5 V simultaneously, and the device powers up fully functional within nanoseconds of supply application. The HMC814LC3B integrates internal bias networks and requires only standard multilayer decoupling (100 pF, 1 nF, 2.2 µF) per supply pin - eliminating need for sequencers or delay circuits in LO chain designs.
Can the HMC814LC3B be used for subharmonic pumping or non-×2 multiplication?
No - the HMC814LC3B is a fixed-ratio ×2 active multiplier with no provision for subharmonic injection or alternative multiplication factors. Its GaAs pHEMT core and matching networks are optimized exclusively for second-harmonic generation from 6.5–12.3 GHz input to 13–24.6 GHz output. Using HMC814LC3B outside this configuration yields unpredictable conversion loss, poor isolation, and degraded phase noise - violating its specified operating conditions.
What is the thermal resistance and maximum channel temperature specification for the HMC814LC3B?
The HMC814LC3B has a channel-to-ground-paddle thermal resistance of 121 °C/W and a maximum channel temperature rating of 175 °C. At 88 mA and +5 V, it dissipates ~440 mW - well below the 743 mW continuous dissipation limit at 85 °C ambient. For reliable operation, the HMC814LC3B's exposed paddle must be soldered to a thermally robust ground plane with ≥6 vias to inner layers, per the manufacturer's layout guidelines.
Is the HMC814LC3B pin-compatible with other Hittite ×2 multipliers like the HMC1084LP3E?
No - although both HMC814LC3B and HMC1084LP3E use 3×3 mm packages, their pinouts differ: HMC814LC3B assigns Vdd to pins 10/12 and RFIN/RFOUT to pins 2/8, while HMC1084LP3E places Vdd on pins 1/12 and RFIN/RFOUT on pins 3/11. PCB redesign is required to substitute HMC814LC3B for HMC1084LP3E - confirming that HMC814LC3B is not a drop-in replacement despite shared package footprint.
112409-HMC814LC3B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Multiplier
- Frequency:
- 13GHz ~ 24.6GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC814LC3B
112409-HMC814LC3B FAQ
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7.What is the process for return or replacement of 112409-HMC814LC3B?
All 112409-HMC814LC3B units undergo pre-shipment inspection (PSI). If there is an issue with 112409-HMC814LC3B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 112409-HMC814LC3B part is unused and in its original packaging.
Return procedure for 112409-HMC814LC3B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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