Analog Devices Inc. 112582-HMC382LP3

Overview

HMC382LP3 from Analog Devices is a GaAs PHEMT MMIC low-noise amplifier optimized for cellular basestation front-end receivers in the 1.7–2.2 GHz band, delivering 1.0 dB noise figure, 17 dB small-signal gain, and +30 dBm output IP3 at +5 V supply with 67 mA total supply current.

For engineers reviewing the HMC382LP3 datasheet, HMC382LP3 pinout, HMC382LP3 application, or HMC382LP3 equivalent, key selection criteria include its 50 Ω matched RF input/output, externally adjustable bias via Rbias, thermal resistance of 144 °C/W, and LFCSP-16 package compatibility with GSM/CDMA/W-CDMA infrastructure designs.

Technical Context

The HMC382LP3 employs a two-stage GaAs PHEMT architecture with fully integrated DC bias paths and on-chip matching networks, enabling stable broadband operation across 1.7–2.2 GHz without external input/output matching components. Its dual Vdd pins (Vdd1, Vdd2) support independent choke-based filtering for improved PSRR and isolation.

Supply current is set externally via a single resistor (Rbias = 16 Ω for 67 mA), allowing real-time trade-off between linearity (IP3) and noise figure across temperature (−40°C to +85°C). Gain variation remains ≤0.015 dB/°C, and reverse isolation exceeds 35 dB across the band.

Key Specifications

Pinout & Package

Package: 16-lead LFCSP (3 mm × 3 mm, 0.90 mm height), RoHS-compliant low-stress molded plastic with exposed thermal paddle and MSL3 rating. JEDEC MO-220-VEED-6 compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise amplifier applications.

Compared with HMC618LP3E and QPL9057, the HMC382LP3 delivers balanced NF/IP3 across the full 1.7–2.2 GHz band with field-adjustable bias, making it optimal for multi-standard (GSM/CDMA/W-CDMA) basestation front-ends where both sensitivity and linearity must be maintained simultaneously.

Availability

HMC382LP3 is available at Aetrix Electronics and suitable for cellular infrastructure, base station repeaters, and 3G wireless access points requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for HMC382LP3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, and aerospace markets with precision signal processing solutions.

The HMC382LP3 belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for high-reliability wireless infrastructure applications demanding low noise, high linearity, and thermal robustness in compact SMT packages.

FAQ

What is the recommended Rbias value to achieve 67 mA total supply current for the HMC382LP3?

The HMC382LP3 requires an external Rbias resistor of 16 Ω to set the combined Idd1 + Idd2 current to 67 mA at +5 V supply, as confirmed in the Absolute Maximum Ratings table and application circuit. This value ensures nominal 1.0 dB noise figure and +30 dBm OIP3 performance. Using 13 Ω increases current to 80 mA (improving IP3 at the expense of NF), while 27 Ω reduces current to 60 mA (lowering power consumption but raising NF to ~1.15 dB). The HMC382LP3 datasheet specifies Rbias tolerance should be ±1% for stable bias point control.

Does the HMC382LP3 require external input or output matching networks?

No, the HMC382LP3 features fully integrated 50 Ω input and output matching networks, verified across 1.7–2.2 GHz. Its RFIN and RFOUT pins are AC-coupled and internally matched - eliminating the need for external matching components in standard 50 Ω systems. Input return loss exceeds 10 dB and output return loss exceeds 9 dB across the band, confirming broadband match integrity. External DC blocking capacitors remain necessary, but no series/shunt stubs or transformers are required for nominal operation of the HMC382LP3.

What is the thermal design requirement for reliable operation of the HMC382LP3?

The HMC382LP3 has a channel-to-ground thermal resistance of 144 °C/W and a maximum continuous power dissipation of 451 mW at 85°C ambient. To maintain junction temperature below 150°C, the exposed paddle must be soldered to a minimum 100 mm² copper area with ≥6 thermal vias (0.3 mm diameter, filled) connecting to inner/ground planes. The HMC382LP3 evaluation board (112582) uses Rogers 4350 substrate and demonstrates this layout. Derating is 6.94 mW/°C above 85°C ambient - critical for outdoor base station deployments where enclosure temperatures exceed 70°C.

Can the HMC382LP3 operate from a +4.5 V or +5.5 V supply?

Yes, the HMC382LP3 is specified for operation from +4.5 V to +5.5 V DC on both Vdd1 and Vdd2 pins. Electrical characteristics including gain (±0.3 dB), NF (+0.05 dB max shift), and OIP3 (±0.5 dB) remain within datasheet limits across this range when Rbias is adjusted to maintain 67 mA total current. At +4.5 V, Rbias should be 27 Ω; at +5.5 V, it remains 16 Ω. The HMC382LP3 maintains stable bias point and does not require additional regulation - simplifying power delivery in multi-rail telecom systems.

How does the HMC382LP3 compare to the HMC382LP3E variant?

The HMC382LP3 and HMC382LP3E share identical electrical specifications, pinout, package dimensions, and thermal performance. The sole difference is marking and MSL compliance: HMC382LP3E carries RoHS-compliant "382" top-side marking and MSL3 rating (260°C peak reflow), while HMC382LP3 is the legacy non-RoHS version. Both are drop-in compatible in layout and function. The HMC382LP3E is the currently shipped and recommended version; the HMC382LP3 is obsolete but still supported for legacy BOM continuity. No redesign is needed when migrating from HMC382LP3 to HMC382LP3E.