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Analog Devices Inc. 113589-HMC3587LP3B
- Part No.:
- 113589-HMC3587LP3B
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
113589-HMC3587LP3B.pdf
- Description:
- BOARD EVALUATION HMC3587LP3B
- Quantity:
- Payment:
- Shipping:
Inventory:3,437
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Product details
Overview
113589-HMC3587LP3B from Analog Devices is a GaAs HBT gain block MMIC amplifier operating from 4 GHz to 10 GHz, delivering 14.5 dB small-signal gain, +13 dBm P1dB output power, and 3.5 dB noise figure at +5 V supply. It serves as a cascadable RF/IF gain stage in 50 Ω systems for microwave radio, WLAN, and test equipment.
For engineers reviewing the 113589-HMC3587LP3B datasheet, 113589-HMC3587LP3B pinout, 113589-HMC3587LP3B application, or 113589-HMC3587LP3B equivalent, key selection criteria include its 4–10 GHz bandwidth, +25 dBm OIP3, single +5 V bias, 12-lead 3×3 mm LFCSP package, and thermal performance across –40°C to +85°C.
Technical Context
The 113589-HMC3587LP3B integrates a monolithic GaAs HBT amplifier core with on-chip matching networks for 50 Ω input and output impedance across 4–10 GHz. Its two independent bias inputs-Vcc (main supply) and Vpd (power-down control)-enable operational flexibility and power management in multi-stage RF chains.
Designed for high-linearity RF front-ends, the device exhibits stable gain variation of ≤0.012 dB/°C and maintains ≥12 dB input/output return loss over temperature and frequency. The exposed ground paddle ensures low thermal resistance (127 °C/W) and optimal RF grounding when soldered per CP-12-10 layout guidelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 4–10 GHz: Full-band operation without external tuning; supports cellular, WLAN, and microwave radio bands. |
| Small-Signal Gain | 14.5 dB typical: Enables single-stage amplification without cascading in compact RF designs. |
| Noise Figure | 3.5 dB typical: Critical for receiver sensitivity in low-SNR applications like DBS and test receivers. |
| OIP3 | +25 dBm typical: Supports high dynamic range in multi-tone environments such as CATV and fixed wireless. |
| P1dB Output Power | +13 dBm typical: Delivers usable linear output into 50 Ω loads without external matching. |
| Supply Voltage | +5 V DC: Simplifies system power architecture by eliminating negative or dual supplies. |
| Package | 12-lead 3×3 mm LFCSP (CP-12-10): Enables high-density RF PCB layouts with low parasitic inductance via exposed paddle grounding. |
Pinout & Package
12-lead Lead Frame Chip Scale Package (LFCSP), 3 mm × 3 mm body, 0.85 mm height, RoHS-compliant low-stress plastic with matte Sn finish and MSL1 rating. Exposed paddle must be soldered to RF/DC ground for thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 5, 6, 7, 9, 11 | NC | No internal connection; may be grounded for mechanical stability or EMI shielding without affecting RF performance. |
| 2 | RFIN | AC-coupled 50 Ω matched RF input; requires external DC blocking capacitor if driven from biased source. |
| 8 | RFOUT | AC-coupled 50 Ω matched RF output; designed for direct interface to filters, mixers, or antennas. |
| 10 | Vcc | Main +5 V supply rail; bypassing with 10 pF and 10,000 pF capacitors required for broadband decoupling. |
| 12 | Vpd | Power-down control pin; applying +5 V enables operation; 0 V disables amplifier with <5 mA standby current. |
| GND Paddle | GND | Thermal and RF ground reference; must be connected to solid ground plane using ≥6 thermal vias for <127 °C/W θJA. |
Key Features
| Feature | Design Value |
|---|---|
| High Linearity | +25 dBm OIP3 enables clean signal amplification in multi-carrier systems without distortion-induced intermodulation. |
| Single +5 V Operation | Eliminates need for negative or precision bias supplies, reducing BOM count and layout complexity in portable RF modules. |
| Integrated Bias Control | Dual-bias architecture (Vcc + Vpd) allows independent power-down sequencing and thermal management in multi-amplifier arrays. |
| Stable Broadband Match | ≥12 dB input/output return loss across 4–10 GHz ensures minimal reflection loss and predictable cascade gain without external tuning. |
| Low Thermal Resistance | 127 °C/W channel-to-paddle thermal resistance supports continuous operation at full power up to +85°C ambient. |
Applications
| Cellular / PCS / 3G Base Stations | Fixed Wireless Access (FWA) Radios |
|---|---|
Use Scenario: Amplifying uplink/downlink IF signals in macrocell transceivers operating at 1.9–2.2 GHz and 3.5 GHz licensed bands. IC Role / Device Role / Timing Role: Cascadable gain block in receive chain after LNA and before mixer; provides 14.5 dB gain with 3.5 dB NF to preserve SNR. Use Value: Enables higher receiver sensitivity without adding active stages, reducing system power and component count. | Use Scenario: Boosting transmit power in point-to-point 5 GHz and 6 GHz FWA radios compliant with FCC Part 101. IC Role / Device Role / Timing Role: Driver amplifier between DAC-based waveform generator and power amplifier; delivers +13 dBm P1dB into 50 Ω load. Use Value: Maintains EVM compliance under wide modulation bandwidths due to +25 dBm OIP3 and flat 4–10 GHz gain response. |
| WLAN 5 GHz/6 GHz Front-Ends | Microwave Test Equipment Signal Paths |
Use Scenario: Enhancing signal integrity in 802.11ac/ax access point RF front-ends requiring high linearity at 5.2–5.9 GHz and 5.925–7.125 GHz UNII bands. IC Role / Device Role / Timing Role: Intermediate gain stage between switch and PA; operates with 3.5 dB NF and 14.5 dB gain to improve overall receiver dynamic range. Use Value: Reduces adjacent-channel interference susceptibility in dense deployment environments through superior IP3 performance. | Use Scenario: Signal conditioning in benchtop spectrum analyzers and vector network analyzers where flat gain and low noise are critical across sweep ranges. IC Role / Device Role / Timing Role: Calibration path amplifier in internal reference signal routing; provides repeatable 14.5 dB gain with ±0.3 dB flatness from 4–10 GHz. Use Value: Improves measurement accuracy and trace stability by minimizing amplitude drift over temperature and frequency sweeps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF gain block applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC460LC4 | Narrower 5–12 GHz range; higher 16 dB gain but 4.0 dB NF; 4 mm × 4 mm SMT package. | Better suited for higher-frequency test equipment above 10 GHz; less optimal below 5 GHz. | Select when >15 dB gain and extended upper band coverage outweigh noise penalty and larger footprint. |
| QPL9547 | 4.5–6.0 GHz range only; 15.5 dB gain; 1.8 dB NF; 2×2 mm DFN package; integrated shutdown control. | Optimized for 5G NR sub-6 GHz infrastructure; not suitable for 8–10 GHz microwave links. | Prefer for compact, ultra-low-noise 5G base station designs where bandwidth is constrained to 6 GHz max. |
Compared with HMC460LC4 and QPL9547, the 113589-HMC3587LP3B offers the broadest 4–10 GHz coverage with balanced gain, noise, and linearity-making it uniquely suitable for multi-band microwave radios and general-purpose lab instrumentation where frequency agility matters.
Availability
113589-HMC3587LP3B is available at Aetrix Electronics and suitable for microwave radio, WLAN infrastructure, and test equipment applications requiring stable component supply, consistent RF performance, and long-term production continuity.
Supply support for 113589-HMC3587LP3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, automotive, and aerospace markets with precision signal processing solutions.
The HMC series of GaAs MMIC amplifiers-including the 113589-HMC3587LP3B-is engineered for broadband RF gain applications in microwave infrastructure, defense EW systems, and automated test equipment where reliability and repeatability are mission-critical.
FAQ
What is the operating temperature range for the 113589-HMC3587LP3B?
The 113589-HMC3587LP3B is specified for continuous operation from –40°C to +85°C ambient. Its thermal resistance (127 °C/W) and channel temperature limit of 150°C ensure reliable performance within this range when the exposed paddle is properly soldered to a thermally robust ground plane with ≥6 thermal vias. Derating applies above +85°C ambient per the 7.87 mW/°C specification.
Does the 113589-HMC3587LP3B require external matching components?
No, the 113589-HMC3587LP3B features fully integrated 50 Ω input and output matching networks across 4–10 GHz. Only external DC blocking capacitors at RFIN and RFOUT are required-typically 10 pF for broadband coupling-along with proper Vcc/Vpd decoupling (10 pF + 10,000 pF). No baluns, transformers, or stubs are needed for nominal operation.
How is power-down controlled on the 113589-HMC3587LP3B?
Power-down is controlled via the Vpd pin (Pin 12): applying 0 V disables the amplifier, reducing supply current to <5 mA while maintaining RF port isolation. Applying +5 V enables full operation. This feature allows dynamic power management in battery-powered or thermally sensitive systems without altering the Vcc rail or requiring external switches.
What is the absolute maximum RF input power rating for the 113589-HMC3587LP3B?
The absolute maximum RF input power for the 113589-HMC3587LP3B is +12 dBm, as defined in the Absolute Maximum Ratings table. Exceeding this level risks permanent damage to the HBT transistor structure, even for brief durations. For reliable operation, input drive should remain ≤+5 dBm to maintain linearity and avoid compression or intermodulation distortion.
Is the 113589-HMC3587LP3B RoHS-compliant and MSL-rated?
Yes, the 113589-HMC3587LP3B uses RoHS-compliant low-stress injection-molded plastic packaging with 100% matte tin lead finish and carries an MSL1 rating-meaning it can withstand reflow peak temperatures up to 260°C without floor-life limitations. The package marking "3587" and CP-12-10 outline drawing confirm full compliance with JEDEC J-STD-020D and IPC/JEDEC J-STD-033 standards.
113589-HMC3587LP3B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Amplifier
- Frequency:
- 4GHz ~ 10GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC3587LP3B
113589-HMC3587LP3B FAQ
1.How can I place an order for 113589-HMC3587LP3B through Aetrix?
Please submit a Request for Quotation (RFQ) for 113589-HMC3587LP3B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 113589-HMC3587LP3B reliable?
The price and inventory of 113589-HMC3587LP3B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 113589-HMC3587LP3B is usually 5 days.
3.What payment methods are accepted for 113589-HMC3587LP3B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 113589-HMC3587LP3B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 113589-HMC3587LP3B?
113589-HMC3587LP3B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 113589-HMC3587LP3B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 113589-HMC3587LP3B?
For technical support, including 113589-HMC3587LP3B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 113589-HMC3587LP3B requirements.
6.How does Aetrix verify that 113589-HMC3587LP3B is sourced from the original manufacturer or authorized distributors?
All 113589-HMC3587LP3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 113589-HMC3587LP3B meets industry standards.
7.What is the process for return or replacement of 113589-HMC3587LP3B?
All 113589-HMC3587LP3B units undergo pre-shipment inspection (PSI). If there is an issue with 113589-HMC3587LP3B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 113589-HMC3587LP3B part is unused and in its original packaging.
Return procedure for 113589-HMC3587LP3B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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