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Analog Devices Inc. 113722-HMC552LP4

Part No.:
113722-HMC552LP4
Manufacturer:
Analog Devices Inc.
Category:
RF, RFID, Wireless Evaluation Boards
Package:
Datasheet:
Aetrix113722-HMC552LP4.pdf
Description:
BOARD EVAL HMC552LP4E
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,738

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Product details

Overview

HMC552LP4 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced mixer with integrated LO amplifier, operating from 1.6–3.0 GHz RF/LO and DC–1.0 GHz IF. It delivers +25 dBm input IP3, 8 dB typical conversion loss, 30 dB LO-to-RF isolation, and operates from a single +5 V supply drawing 62 mA - ideal for PCS/3G base station up/downconverters.

For engineers reviewing the HMC552LP4 datasheet, HMC552LP4 pinout, HMC552LP4 application, or HMC552LP4 equivalent, key selection criteria include its integrated LO amplifier eliminating external driver stages, robust Class 1C ESD rating, 4×4 mm QFN package with exposed ground paddle, and compatibility with low-LO-drive systems requiring -4 to +4 dBm.

Technical Context

The HMC552LP4 integrates a high-linearity double-balanced passive mixer core with a monolithic GaAs LO amplifier, enabling direct drive from low-power LO sources without external amplification. Its architecture supports both upconversion and downconversion with DC-coupled RF, LO, and IF ports - all matched to 50 Ω and requiring only external DC blocking capacitors on MIX LO, LO, and RF pins.

It features internal biasing for the LO amplifier via Pin 3 (BIAS), requiring an external 18 Ω resistor and three bypass capacitors for stable operation. The device achieves 8 dB noise figure (SSB) and maintains ≥25 dB LO-to-RF isolation across its full 1.6–3.0 GHz band, with thermal resistance of 105.6 °C/W to the ground paddle.

Key Specifications

Parameter Value and Actual Design Meaning
RF/LO Frequency Range1.6–3.0 GHz - enables direct use in PCS (1.85–1.99 GHz) and WiMAX (2.3–2.7 GHz) infrastructure bands
IF Frequency RangeDC–1.0 GHz - supports zero-IF and low-IF architectures without external IF transformers or baluns
Conversion Loss8 dB typical - reduces required gain in subsequent IF amplification stages and lowers system noise figure
Input IP3+25 dBm - ensures high dynamic range in multi-carrier base station receivers handling strong adjacent-channel interferers
LO Drive Level-4 to +4 dBm - eliminates need for dedicated LO buffer amplifiers, simplifying signal chain design
LO-to-RF Isolation30 dB minimum - minimizes LO leakage into antenna paths, easing filtering requirements in transceiver front-ends
Supply Current62 mA @ +5 V - enables efficient power budgeting in thermally constrained RF modules

Pinout & Package

Package: 24-lead 4×4 mm leadless QFN (LCC) with exposed ground paddle; RoHS-compliant Sn finish on HMC552LP4E variant, Sn/Pb on HMC552LP4; MSL1 rating; thermal pad must be soldered to PCB ground plane per Hittite land pattern guidelines.

Pin/Terminal Circuit Role Design Meaning
1MIX LODC-coupled LO input to mixer core; requires external DC blocking capacitor; 50 Ω matched
3BIASLO amplifier bias supply node; requires external 18 Ω resistor and three bypass capacitors for stable operation
4GNDGround reference; connects to exposed backside paddle - must be soldered to PCB ground plane
5LODC-coupled LO amplifier output; requires external DC blocking capacitor; 50 Ω matched
10IFDC-coupled IF port; supports true DC operation but limited to ±18 mA current sourcing/sinking
18RFDC-coupled RF port; requires external DC blocking capacitor; 50 Ω matched
2, 6–9, 11–17, 19–24N/CNo-connect pins; may be tied to RF ground without performance impact

Key Features

Feature Design Value
Integrated LO amplifierEliminates discrete LO buffer stage, reducing BOM count and board area while maintaining -4 to +4 dBm drive tolerance
Double-balanced mixer topologyProvides inherent suppression of LO×2, RF×2, and LO+RF spurs, easing post-mixer filtering requirements
Class 1C ESD protectionWithstands 1,000 V HBM - enables safe handling during assembly and improves field reliability in unshielded environments
DC-coupled RF/LO/IF portsSupports zero-IF and complex I/Q architectures without external baluns or transformers, reducing insertion loss and phase error
Exposed thermal paddleEnables efficient heat dissipation (105.6 °C/W) for continuous operation at +85°C ambient in compact RF modules

Applications

PCS Base Station Transceivers WiMAX/WiBro Fixed Wireless Units

Use Scenario: Downconverting 1.9 GHz PCS receive signals to 70–140 MHz IF in macrocell BTS radios.

IC Role / Device Role / Timing Role: Double-balanced mixer with integrated LO amplifier serving as first-stage RF-to-IF converter.

Use Value: +25 dBm IP3 prevents intermodulation distortion from co-located carriers; 30 dB LO-to-RF isolation reduces need for external LO filtering.

Use Scenario: Upconverting 2.5 GHz WiMAX baseband signals to RF in outdoor customer premises equipment (CPE).

IC Role / Device Role / Timing Role: High-linearity upconverter with DC-coupled IF interface supporting complex modulation schemes.

Use Value: 8 dB conversion loss preserves SNR in transmit chain; -4 to +4 dBm LO drive accommodates low-power synthesizers.

ISM Band Repeaters 3G Femtocell Front-Ends

Use Scenario: Bidirectional signal translation in 2.4 GHz ISM-band repeaters for enterprise coverage extension.

IC Role / Device Role / Timing Role: Dual-role mixer used in both uplink and downlink paths with shared LO distribution.

Use Value: Pin-compatible with HMC551LP4 allows reuse of layout across frequency bands; 4×4 mm footprint saves space in compact enclosures.

Use Scenario: Low-power downconversion in residential 3G femtocell units operating at 2.1 GHz UMTS band.

IC Role / Device Role / Timing Role: IF-output mixer feeding ADC in highly integrated transceiver IC.

Use Value: DC–1 GHz IF bandwidth supports wideband digital predistortion feedback; +5 V single-supply simplifies power management.

Equivalent & Alternatives

The following parts are listed as comparable options for similar mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC551LP4Same 24-pin 4×4 mm QFN package and pinout; operates at 0.8–1.2 GHz RF/LO instead of 1.6–3.0 GHzTargeted for GSM/UMTS lower-band infrastructure; not suitable for PCS or WiMAX frequenciesSelect HMC551LP4 only when operating below 1.2 GHz; verify LO drive and IP3 specs match system requirements
Qorvo QM110363.3 V operation, 1.7–2.7 GHz RF range, +22 dBm IP3, 9.5 dB conversion loss; no integrated LO amplifierRequires external LO buffer; optimized for LTE small cells with tighter power constraintsChoose QM11036 when lower supply voltage and smaller RF bandwidth suffice, and LO buffering is already present

Compared with HMC552LP4, HMC551LP4 offers identical mechanical and electrical interface but narrower frequency coverage, while QM11036 trades integrated LO drive and higher IP3 for lower voltage operation and reduced integration - impacting bill-of-materials and layout complexity.

Availability

HMC552LP4 is available at Aetrix Electronics and suitable for wireless infrastructure, base station transceivers, and fixed wireless access equipment requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for HMC552LP4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014, integrating its high-frequency RF/Microwave portfolio into ADI's broader signal chain solutions for communications, defense, and instrumentation.

The HMC552LP4 belongs to Hittite's GaAs MMIC mixer family designed specifically for high-linearity, broadband wireless infrastructure applications where integrated LO amplification, low conversion loss, and robust ESD performance are critical.

FAQ

What is the maximum RF input power rating for the HMC552LP4?

The HMC552LP4 has an absolute maximum RF/IF input rating of +31 dBm. However, for linear operation, the 1 dB compression point is typically +16 dBm at 1.9 GHz. Exceeding this level causes measurable gain compression and increased distortion, so system-level design should maintain RF input ≤ +13 dBm to preserve +25 dBm IP3 performance. Always refer to the HMC552LP4 datasheet's "Electrical Specifications" table for temperature-derated limits.

Does the HMC552LP4 require external baluns for operation?

No, the HMC552LP4 does not require external baluns. Its double-balanced architecture and 50 Ω DC-coupled RF, LO, and IF ports enable direct connection to single-ended 50 Ω sources and loads. External DC blocking capacitors are required on Pins 1 (MIX LO), 5 (LO), and 18 (RF), and the IF port (Pin 10) may require series capacitance if DC coupling is not needed. This eliminates balun-related insertion loss and phase imbalance.

How is the LO amplifier biased in the HMC552LP4?

The LO amplifier in the HMC552LP4 is biased through Pin 3 (BIAS), which requires an external 18 Ω resistor connected to +5 V and three bypass capacitors (100 pF, 1000 pF, and 2.2 µF) to ground as shown in the application circuit. This configuration sets the 62 mA supply current and ensures stable LO amplifier operation across temperature. Deviating from the recommended R1 value affects Icc and may degrade conversion loss or IP3.

Can the HMC552LP4 operate with IF frequencies down to DC?

Yes, the HMC552LP4 supports true DC-coupled IF operation on Pin 10. However, the IF port must not source or sink more than ±18 mA to avoid die malfunction or permanent damage. For AC-coupled IF applications, a series capacitor sized for the lowest IF frequency (e.g., 100 nF for 10 MHz) is recommended. DC coupling enables zero-IF receiver designs without transformer-based IF interfaces.

What is the thermal management requirement for the HMC552LP4?

The HMC552LP4 features an exposed ground paddle with a thermal resistance of 105.6 °C/W (junction-to-paddle). To maintain junction temperature ≤150°C at +85°C ambient, the paddle must be fully soldered to a multilayer PCB ground plane using ≥6 thermal vias (0.3 mm diameter) under the pad. Insufficient grounding causes thermal runaway and accelerated degradation of conversion loss and IP3 over time.

113722-HMC552LP4 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Packaging:
Box
Product Status:
Obsolete
Type:
Mixer
Frequency:
1.6GHz ~ 3GHz
Contents:
Board(s)
Utilized IC / Part:
HMC552LP4

113722-HMC552LP4 FAQ

1.How can I place an order for 113722-HMC552LP4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 113722-HMC552LP4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 113722-HMC552LP4 reliable?

The price and inventory of 113722-HMC552LP4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 113722-HMC552LP4 is usually 5 days.

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113722-HMC552LP4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 113722-HMC552LP4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 113722-HMC552LP4?

For technical support, including 113722-HMC552LP4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 113722-HMC552LP4 requirements.

6.How does Aetrix verify that 113722-HMC552LP4 is sourced from the original manufacturer or authorized distributors?

All 113722-HMC552LP4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 113722-HMC552LP4 meets industry standards.

7.What is the process for return or replacement of 113722-HMC552LP4?

All 113722-HMC552LP4 units undergo pre-shipment inspection (PSI). If there is an issue with 113722-HMC552LP4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 113722-HMC552LP4 part is unused and in its original packaging.

Return procedure for 113722-HMC552LP4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

113722-HMC552LP4 Tags

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