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Analog Devices Inc. 115556-HMC561LP3

Part No.:
115556-HMC561LP3
Manufacturer:
Analog Devices Inc.
Category:
RF, RFID, Wireless Evaluation Boards
Package:
Datasheet:
Aetrix115556-HMC561LP3.pdf
Description:
BOARD EVAL HMC561LP3E
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,646

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Product details

Overview

HMC561LP3 from Analog Devices (formerly Hittite Microwave) is a GaAs PHEMT-based x2 active frequency multiplier IC in a 3×3 mm RoHS-compliant SMT package, delivering +14 dBm typical output power across 8–21 GHz output range when driven by +5 dBm input at 4–10.5 GHz. It provides 15 dBc Fo/3Fo isolation at 16 GHz and -139 dBc/Hz SSB phase noise at 100 kHz offset, enabling high-fidelity LO multiplication in microwave radio front-ends.

For engineers reviewing the HMC561LP3 datasheet, HMC561LP3 pinout, HMC561LP3 application, or HMC561LP3 equivalent, key selection criteria include its 8–21 GHz output bandwidth, +14 dBm output power, 15 dBc fundamental suppression, -139 dBc/Hz phase noise at 100 kHz, and compatibility with surface-mount RF PCB assembly using 50 Ω AC-coupled I/O and dual-bias supply (Vdd = 5 V, Vgg adjustable).

Technical Context

The HMC561LP3 operates as a broadband ×2 active multiplier with fixed multiplication factor, requiring +5 dBm nominal input drive to achieve optimal output power and isolation. Its GaAs PHEMT architecture enables wideband operation from 4–10.5 GHz input while suppressing Fo, 3Fo, and 4Fo spurs via internal harmonic termination and impedance matching.

Biasing uses dual-supply configuration: Vdd = +5 V ± 0.5 V for drain supply and Vgg adjustable between -2.0 V and -1.2 V to set Idd = 98 mA. Input and output ports are AC-coupled and 50 Ω matched, eliminating external DC blocking requirements in standard RF layouts.

Key Specifications

Parameter Value and Actual Design Meaning
Output Frequency Range 8–21 GHz - supports full-band LO synthesis for X/Ku-band radios and test equipment without tuning.
Input Frequency Range 4–10.5 GHz - accepts common synthesizer outputs (e.g., 7–10.5 GHz VCOs) for clean doubling.
Typical Output Power +14 dBm @ +5 dBm drive - sufficient to drive mixers or cascaded multipliers without intermediate amplification.
Fo Isolation 15 dBc @ 16 GHz - reduces fundamental leakage into downstream components, easing filter design.
SSB Phase Noise -139 dBc/Hz @ 100 kHz offset - preserves EVM and adjacent-channel rejection in high-order modulation systems.
Supply Current (Idd) 98 mA @ Vdd = 5 V, Vgg tuned - enables stable bias with low thermal drift under RF load.
Package 3×3 mm leadless SMT (MSL1) - compatible with reflow soldering and RF ground-paddle mounting per Hittite land pattern.

Pinout & Package

Package: 3×3 mm leadless RoHS-compliant SMT package with exposed ground paddle; requires soldering of all ground leads and paddle to PCB RF ground per Hittite Application Note.

Pin/Terminal Circuit Role Design Meaning
1, 3, 10, 12 GND RF/DC ground terminals - must be connected to PCB ground plane; package bottom paddle also grounded.
2 RFIN 50 Ω AC-coupled RF input - accepts +5 dBm drive without external DC blocking or matching.
4–9, 14, 16 N/C No-connect pins - internally unconnected but specified for grounding to minimize parasitic coupling.
11 RFOUT 50 Ω AC-coupled RF output - delivers doubled-frequency signal directly to next stage or filter.
13 Vdd +5 V ± 0.5 V drain supply - requires 100 pF / 1 nF / 2.2 μF bypass network for RF stability.
15 Vgg Adjustable gate bias (-2.0 to -1.2 V) - sets operating current to 98 mA for optimal linearity and noise.

Key Features

Feature Design Value
High Output Power +14 dBm typical over full 8–21 GHz band - reduces need for post-multiplier gain stages in compact RF chains.
Low Drive Requirement Operates with 0 to +6 dBm input - compatible with low-power synthesizers and eliminates driver amplifier in many designs.
Fo/3Fo Suppression 15 dBc isolation at 16 GHz - simplifies output filtering and improves spectral purity in sensitive receiver paths.
Ultra-Low Phase Noise -139 dBc/Hz @ 100 kHz offset - maintains system-level noise figure in high-data-rate modems and radar LO chains.
RoHS SMT Package 3×3 mm leadless package with MSL1 rating - supports automated assembly and eliminates wire bonding in production.

Applications

Point-to-Point Radios VSAT Terminals

Use Scenario: Generating local oscillator signals for 18–22 GHz transceivers in licensed microwave backhaul links.

IC Role / Device Role / Timing Role: ×2 active frequency multiplier converting 9–11 GHz VCO output to final 18–22 GHz LO.

Use Value: Enables single-stage LO synthesis with +14 dBm output and -139 dBc/Hz phase noise, reducing component count vs. cascaded doubler+amplifier.

Use Scenario: Upconverting IF signals to Ku-band (12–18 GHz) in satellite ground station transmit chains.

IC Role / Device Role / Timing Role: Final-stage ×2 multiplier driving mixer LO port with high-isolation, low-phase-noise signal.

Use Value: 15 dBc Fo isolation minimizes spurious mixing products; 3×3 mm SMT footprint supports compact, thermally robust RF module layout.

Test Instrumentation Military Radar Systems

Use Scenario: Extending frequency coverage of signal generators and spectrum analyzers beyond 20 GHz.

IC Role / Device Role / Timing Role: Active multiplier module providing calibrated, broadband 8–21 GHz output with known gain and noise floor.

Use Value: +14 dBm output power ensures adequate signal level for calibration reference paths; RoHS SMT allows integration into modular instrument backplanes.

Use Scenario: LO generation in airborne radar T/R modules requiring wide temperature operation (-40 to +85 °C).

IC Role / Device Role / Timing Role: High-reliability ×2 multiplier in hardened RF front-end, leveraging GaAs PHEMT process for radiation tolerance.

Use Value: Stable 98 mA Idd and 15 dBc spur suppression maintain radar coherence across temperature; exposed paddle aids thermal dissipation in conduction-cooled assemblies.

Equivalent & Alternatives

The following parts are listed as comparable options for similar active frequency multiplier applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC562LP3E ×3 multiplier with 5–12 GHz input / 15–36 GHz output; +12 dBm output; higher phase noise (-134 dBc/Hz). Targets higher-frequency bands (K/Ka-band); requires higher input drive (+7 dBm) and yields broader output spurs. Select when 3× multiplication and Ka-band coverage outweigh lower output power and reduced phase noise performance.
Qorvo QM11020 ×2 GaAs MMIC multiplier, 6–12 GHz input / 12–24 GHz output; +13 dBm output; 12 dBc Fo isolation; -136 dBc/Hz phase noise. Offers wider input range but lower isolation and higher current draw (115 mA); non-RoHS option available. Consider for cost-sensitive industrial designs where 3 dB lower isolation and 3 dB worse phase noise are acceptable trade-offs.

Compared with HMC561LP3, HMC562LP3E extends upper frequency reach but sacrifices output power and phase noise, while QM11020 offers broader input bandwidth at the cost of spur suppression and thermal efficiency-making HMC561LP3 optimal for X/Ku-band LO chains demanding best-in-class noise and isolation.

Availability

HMC561LP3 is available at Aetrix Electronics and suitable for point-to-point radios, VSAT terminals, and test instrumentation requiring stable component supply, consistent RF performance across temperature, and RoHS-compliant SMT manufacturability.

Supply support for HMC561LP3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into precision analog and RF solutions for communications, defense, and instrumentation markets.

The HMC561LP3 belongs to Hittite's active frequency multiplier product line, designed specifically for high-efficiency, low-phase-noise LO generation in microwave wireless infrastructure and aerospace systems.

FAQ

What is the recommended input drive level for optimal performance of the HMC561LP3?

The HMC561LP3 achieves peak output power (+14 dBm), best Fo isolation (15 dBc), and lowest phase noise (-139 dBc/Hz) when driven with +5 dBm input power across its 4–10.5 GHz input band. Operation is supported from 0 to +6 dBm, but deviation outside ±1 dB of +5 dBm reduces output flatness and increases harmonic content. The HMC561LP3 datasheet specifies +5 dBm as the nominal drive condition for all typical electrical specifications.

Does the HMC561LP3 require external DC blocking capacitors on RFIN or RFOUT?

No, the HMC561LP3 does not require external DC blocking capacitors on RFIN or RFOUT because both ports are internally AC-coupled and 50 Ω matched. Pin 2 (RFIN) and Pin 11 (RFOUT) are designed for direct connection to 50 Ω transmission lines. External blocking is unnecessary and may degrade broadband match or introduce parasitic resonances in the 8–21 GHz band.

How is gate bias (Vgg) adjusted for the HMC561LP3, and what is its function?

Vgg on Pin 15 controls the GaAs PHEMT's operating point to set Idd at 98 mA. It must be adjusted between -2.0 V and -1.2 V using a precision voltage source or resistor divider, per the "MMIC Amplifier Biasing Procedure" application note. Correct Vgg tuning ensures stable gain, optimal phase noise, and minimal thermal drift - critical for repeatable HMC561LP3 performance across temperature and unit-to-unit variation.

What is the thermal resistance and maximum power dissipation of the HMC561LP3?

The HMC561LP3 has a channel-to-ground-paddle thermal resistance of 102 °C/W. At 85 °C case temperature, its continuous power dissipation is rated at 635 mW, derating by 9.8 mW/°C above that. With 5 V × 98 mA = 490 mW typical power consumption, the HMC561LP3 operates well within thermal limits when the exposed paddle is soldered to a solid RF ground plane with ≥6 thermal vias, as specified in the HMC561LP3 evaluation board layout guidelines.

Is the HMC561LP3 pin-compatible with the non-RoHS HMC561LP3 variant?

Yes, the HMC561LP3 (Sn/Pb) and HMC561LP3E (100% matte Sn) share identical pinout, package dimensions, land pattern, and electrical specifications. The only differences are lead finish and peak reflow temperature (235 °C vs. 260 °C). No PCB layout changes are required when migrating between them, though solder paste and profile must be adjusted to match the respective MSL1 reflow specification for each variant.

115556-HMC561LP3 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Packaging:
Box
Product Status:
Active
Type:
Multiplier
Frequency:
4GHz ~ 10.5GHz
Contents:
Board(s)
Utilized IC / Part:
HMC561LP3

115556-HMC561LP3 FAQ

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Please submit a Request for Quotation (RFQ) for 115556-HMC561LP3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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6.How does Aetrix verify that 115556-HMC561LP3 is sourced from the original manufacturer or authorized distributors?

All 115556-HMC561LP3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 115556-HMC561LP3 meets industry standards.

7.What is the process for return or replacement of 115556-HMC561LP3?

All 115556-HMC561LP3 units undergo pre-shipment inspection (PSI). If there is an issue with 115556-HMC561LP3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 115556-HMC561LP3 part is unused and in its original packaging.

Return procedure for 115556-HMC561LP3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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