My Inquiry
My Account
Analog Devices Inc. 117156-HMC606LC5
- Part No.:
- 117156-HMC606LC5
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
117156-HMC606LC5.pdf
- Description:
- EVAL BOARD HMC606LC5
- Quantity:
- Payment:
- Shipping:
Inventory:2,606
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
117156-HMC606LC5 from Analog Devices is a GaAs/InGaP HBT MMIC distributed amplifier operating from 2 GHz to 18 GHz, delivering 13.5 dB typical gain, −160 dBc/Hz phase noise at 10 kHz offset, and 15 dBm P1dB output power. It serves as a broadband RF gain block in radar front-ends and EW signal chains where ultralow phase noise and wideband linearity are critical.
For engineers reviewing the 117156-HMC606LC5 datasheet, 117156-HMC606LC5 pinout, 117156-HMC606LC5 application, or 117156-HMC606LC5 equivalent, this page provides verified package mapping, terminal-level functional roles, temperature-stable RF performance data across 2–18 GHz, and validated alternatives for military-grade microwave amplification.
Technical Context
The 117156-HMC606LC5 implements a distributed amplifier architecture using GaAs/InGaP HBT technology, enabling flat gain response (±1.0 dB) and stable noise figure (5 dB typ.) over its full 2–18 GHz bandwidth. Its dual 5.0 V supply rails (VCC1/VCC2) independently bias cascaded gain stages, supporting high IP3 (27 dBm typ.) and low additive phase noise.
All RF ports are internally matched to 50 Ω and dc-blocked; input return loss exceeds 20 dB and output return loss exceeds 15 dB across 2–12 GHz. The exposed thermal pad must be soldered to RF/dc ground to maintain channel temperature ≤85°C under continuous operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2–18 GHz full-band operation; usable for Ka-band radar and test instrumentation up to 18 GHz. |
| Small Signal Gain | 13.5 dB typical (2–12 GHz); ensures minimal cascaded stage loss in multi-stage receiver chains. |
| P1dB Output Power | 15 dBm typical (2–12 GHz); supports linear amplification of medium-power IF/RF signals without compression. |
| Output IP3 | 27 dBm typical (2–12 GHz); enables high dynamic range in dense spectral environments like ECM. |
| Phase Noise | −160 dBc/Hz at 10 kHz offset (12 GHz carrier); meets stringent spectral purity requirements for coherent radar systems. |
| Supply Current | 64 mA typical at 5.0 V; total power dissipation ≈320 mW, requiring thermal management via exposed pad grounding. |
| Input/Output Impedance | 50 Ω matched, dc-blocked; eliminates need for external matching networks in 50 Ω system designs. |
Pinout & Package
32-terminal ceramic leadless chip carrier (LCC), 5.05 mm × 5.05 mm body, 3.60 mm × 3.60 mm exposed thermal pad, RoHS-compliant E-32-1 package. Requires solder reflow per MSL3 (260°C peak).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 5 | RFIN | Ac-coupled 50 Ω RF input; no external dc blocking required; connects directly to preceding stage's 50 Ω output. |
| 21 | RFOUT | Ac-coupled 50 Ω RF output; delivers amplified signal with <1 dB gain ripple to next stage or antenna interface. |
| 2, 16 | VCC1, VCC2 | Independent 5.0 V supply inputs; decoupling capacitors must be placed near each pin to suppress supply noise. |
| 4, 6, 20, 22 | GND | RF/dc ground terminals; must be low-inductance connected to solid ground plane to ensure stability and noise control. |
| EPAD | Exposed Pad | Thermal and electrical ground path; mandatory connection to PCB ground plane via multiple vias for thermal reliability. |
Key Features
| Feature | Design Value |
|---|---|
| Ultralow phase noise | −160 dBc/Hz at 10 kHz offset enables coherent processing in pulsed-Doppler radar and precision EW receivers. |
| Dual independent supply rails | VCC1/VCC2 allow staged bias optimization and improved power supply rejection ratio (PSRR) over single-rail designs. |
| Internally matched 50 Ω I/O | Eliminates discrete matching components, reducing board area and insertion loss in high-frequency layouts. |
| Thermally enhanced LCC package | 92°C/W channel-to-ground thermal resistance supports continuous operation at +85°C ambient with proper heatsinking. |
| ESD robustness | Class 0 HBM rating (100 V) requires handling per ESD-sensitive device protocols but enables field-deployable reliability. |
Applications
| Radar Front-Ends | Electronic Warfare Receivers |
|---|---|
|
Use Scenario: Low-noise amplification of 8–12 GHz received pulses in airborne fire-control radar. IC Role / Device Role / Timing Role: First-stage LNA in receive chain, preserving SNR before downconversion. Use Value: −160 dBc/Hz phase noise prevents reciprocal mixing with local oscillator leakage, maintaining target resolution. |
Use Scenario: Wideband signal acquisition across 2–18 GHz in tactical SIGINT platforms. IC Role / Device Role / Timing Role: Broadband gain block in channelized receiver front-end prior to ADC sampling. Use Value: 27 dBm IP3 ensures minimal intermodulation distortion when capturing multiple simultaneous emitters. |
| Microwave Test Instrumentation | Fiber Optic RF-over-Fiber Links |
|
Use Scenario: Driver amplifier in vector network analyzer (VNA) source module covering 2–18 GHz. IC Role / Device Role / Timing Role: High-linearity output stage delivering calibrated stimulus power to DUT. Use Value: Flat 13.5 dB gain ±1.0 dB simplifies amplitude correction algorithms and improves measurement repeatability. |
Use Scenario: RF modulator driver in 1550 nm analog fiber links transmitting 2–12 GHz satellite IF signals. IC Role / Device Role / Timing Role: Linear gain stage boosting baseband-modulated RF before laser diode bias tee. Use Value: 15 dBm P1dB enables high optical modulation depth while maintaining CNR >50 dB over 20 km fiber. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar broadband microwave amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC606LC4 | Same die, 24-pin LCC package; reduced pin count limits thermal dissipation and RF grounding options. | Limited to lower-power 2–12 GHz applications; not rated for 18 GHz operation or high-duty-cycle radar pulses. | Select only if footprint constraints prohibit 32-pin LCC and full 18 GHz bandwidth is unnecessary. |
| HMC998LP5E | GaAs pHEMT-based; higher gain (18 dB) but worse phase noise (−148 dBc/Hz @10 kHz) and narrower 0.1–20 GHz bandwidth. | Better for wideband gain where phase noise is secondary; unsuitable for coherent radar or low-jitter LO distribution. | Choose when maximum small-signal gain is prioritized over spectral purity in non-coherent detection systems. |
Compared with HMC606LC4 and HMC998LP5E, the 117156-HMC606LC5 uniquely balances ultralow phase noise, 18 GHz bandwidth, and thermally robust 32-pin LCC packaging-making it the only option qualified for high-reliability radar and space-qualified EW systems requiring both spectral fidelity and thermal margin.
Availability
117156-HMC606LC5 is available at Aetrix Electronics and suitable for radar front-ends, electronic warfare receivers, and microwave test instrumentation requiring stable component supply, traceable lot history, and long-term obsolescence management.
Supply support for 117156-HMC606LC5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving aerospace, defense, communications, and industrial markets with precision signal processing solutions.
The HMC606LC5 belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for demanding microwave applications requiring broadband gain, ultralow phase noise, and ruggedized packaging for military and space environments.
FAQ
What is the operating temperature range for the 117156-HMC606LC5?
The 117156-HMC606LC5 is specified for continuous operation from −40°C to +85°C ambient temperature. Its GaAs/InGaP HBT process and thermally optimized LCC package enable stable gain and phase noise performance across this full industrial/military range, with derating applied above 85°C per the 10.9 mW/°C thermal dissipation limit.
Does the 117156-HMC606LC5 require external input/output matching networks?
No-the 117156-HMC606LC5 features fully integrated 50 Ω input and output matching with internal dc blocking. RFIN and RFOUT pins connect directly to 50 Ω transmission lines without external matching components, simplifying layout and preserving bandwidth in microwave PCB designs.
How is thermal management implemented for the 117156-HMC606LC5?
Thermal management for the 117156-HMC606LC5 relies on soldering its exposed thermal pad (EPAD) directly to a solid RF/dc ground plane using multiple thermal vias. This achieves the specified 92°C/W channel-to-ground thermal resistance and prevents junction temperatures from exceeding 175°C under maximum continuous power dissipation.
What is the absolute maximum RF input power rating for the 117156-HMC606LC5?
The absolute maximum RF input power for the 117156-HMC606LC5 is 15 dBm, as defined in the Absolute Maximum Ratings table. Exceeding this level risks permanent damage to the HBT transistors, even for short-duration pulses, due to gate or collector breakdown mechanisms inherent to the GaAs/InGaP process.
Is the 117156-HMC606LC5 pin-compatible with other HMC606 variants?
No-the 117156-HMC606LC5 uses a 32-terminal LCC package (E-32-1), while variants like HMC606LC4 use a 24-pin LCC. Pin count, pin spacing, and thermal pad geometry differ; direct PCB replacement is not possible without layout revision and thermal validation.
117156-HMC606LC5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Amplifier
- Frequency:
- 2GHz ~ 18GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC606LC5
117156-HMC606LC5 FAQ
1.How can I place an order for 117156-HMC606LC5 through Aetrix?
Please submit a Request for Quotation (RFQ) for 117156-HMC606LC5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 117156-HMC606LC5 reliable?
The price and inventory of 117156-HMC606LC5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 117156-HMC606LC5 is usually 5 days.
3.What payment methods are accepted for 117156-HMC606LC5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 117156-HMC606LC5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 117156-HMC606LC5?
117156-HMC606LC5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 117156-HMC606LC5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 117156-HMC606LC5?
For technical support, including 117156-HMC606LC5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 117156-HMC606LC5 requirements.
6.How does Aetrix verify that 117156-HMC606LC5 is sourced from the original manufacturer or authorized distributors?
All 117156-HMC606LC5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 117156-HMC606LC5 meets industry standards.
7.What is the process for return or replacement of 117156-HMC606LC5?
All 117156-HMC606LC5 units undergo pre-shipment inspection (PSI). If there is an issue with 117156-HMC606LC5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 117156-HMC606LC5 part is unused and in its original packaging.
Return procedure for 117156-HMC606LC5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
117156-HMC606LC5 Tags
-
113991054
Seeed Technology Co., Ltd
-
SC0918
Raspberry Pi
-
113991114
Seeed Technology Co., Ltd
-
ESP32-C6-DEVKITM-1-N4
Espressif Systems
-
ESP32-DEVKITM-1
Espressif Systems
-
C008
M5Stack Technology Co., Ltd.
-
ESP32-C3-DEVKITC-02
Espressif Systems
-
ESP32-C6-DEVKITC-1-N8
Espressif Systems
-
DFR0478
DFRobot
-
102010448
Seeed Technology Co., Ltd
-
ESP32-DEVKITC-32E
Espressif Systems
-
ESP32-DEVKITC-32UE
Espressif Systems
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
