Analog Devices Inc. 117198-HMC630LP3
- Part No.:
- 117198-HMC630LP3
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
117198-HMC630LP3.pdf
- Description:
- BOARD EVAL HMC630LP3E
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HMC630LP3 from Analog Devices (formerly Hittite Microwave) is a GaAs HBT monolithic vector modulator IC designed for RF predistortion and feed-forward linearization in wireless infrastructure transceivers. It operates from 700–1000 MHz, delivers ±360° continuous phase control and 40 dB gain range, and achieves +34 dBm input IP3 and –162 dBm/Hz output noise floor at max gain - enabling high-fidelity amplitude/phase correction in cellular base station HPAs.
For engineers reviewing the HMC630LP3 datasheet, HMC630LP3 pinout, HMC630LP3 application, or HMC630LP3 equivalent, this page provides verified functional context, validated pin roles, confirmed RF performance metrics across temperature and supply voltage, and real-world design implications for beamforming and error-correction circuits.
Technical Context
The HMC630LP3 implements a differential I/Q architecture using GaAs HBT technology to enable simultaneous, independent analog control of RF signal amplitude and phase via two DC-coupled voltage inputs (I and Q). Its internal balun supports 100 Ω differential RF input impedance and requires external DC blocking on IN/IN pins.
Control port bandwidth is specified at 180 MHz (–3 dB), with 1.45 kΩ input impedance and 0.22 pF capacitance per I/Q terminal, enabling fast modulation response while maintaining stable biasing. Gain flatness is ≤0.10 dB over any 60 MHz bandwidth, and group delay variation remains under 20 ps across that same span.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 700–1000 MHz - fully characterized operating band for linear vector modulation; not extrapolated. |
| Phase Control Range | ±360° continuous - enables full quadrature synthesis without phase discontinuity or dead zones. |
| Gain Control Range | 40 dB - supports deep amplitude nulling and precise gain scaling in adaptive cancellation loops. |
| Input IP3 | +34 dBm typical - ensures linearity in high-power predistortion paths before power amplifiers. |
| Output Noise Floor | –162 dBm/Hz at max gain - critical for maintaining SNR in low-level feedback receivers. |
| Control Bandwidth | 180 MHz (–3 dB) - supports wideband envelope tracking and dynamic linearization up to LTE-A CA bands. |
| Supply Current | 92 mA at Vcc = +8 V - defines thermal load and bypass capacitor sizing for stable RF operation. |
Pinout & Package
16-lead 3×3 mm SMT package (9 mm² footprint) with exposed ground paddle; RoHS-compliant Sn finish on HMC630LP3E variant; MSL1 rating; thermal resistance 29.6 °C/W (junction-to-paddle).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 10–12 | No Connection | Internally unconnected; may be tied to RF ground without performance impact. |
| 2, 3 | RF Input (Differential) | 100 Ω differential (50 Ω each to ground); requires external DC blocking capacitors. |
| 5, 15 | I Control Input | Redundant analog voltage inputs (0.5–2.5 Vdc); either pin fully controls in-phase component. |
| 6, 16 | Q Control Input | Redundant analog voltage inputs (0.5–2.5 Vdc); either pin fully controls quadrature component. |
| 7, 8, 13, 14 | Vcc Supply | DC-connected on-chip; only one needs powering, but all four require local RF bypassing. |
| 9 | RF Output | Single-ended RFOUT; requires external DC blocking capacitor before downstream stage. |
| GND Paddle | Ground Reference | Exposed metal paddle must be soldered to PCB RF/DC ground plane with multiple vias. |
Key Features
| Feature | Design Value |
|---|---|
| Continuous vector modulation | Enables real-time, closed-loop amplitude/phase correction without digital interpolation or lookup tables. |
| +34 dBm input IP3 | Supports integration directly after high-linearity LNAs or before final PA stages without signal degradation. |
| –162 dBm/Hz output noise floor | Preserves dynamic range in feedback paths used for adaptive predistortion algorithms. |
| 180 MHz control bandwidth | Meets timing requirements for wideband LTE-Advanced carrier aggregation and 5G NR sub-6 GHz waveforms. |
| 16-pin 3×3 mm SMT package | Minimizes board area while enabling robust thermal dissipation via exposed ground paddle. |
Applications
| Wireless Infrastructure HPA Linearization | Feed-Forward Error Correction |
|---|---|
|
Use Scenario: Integrated into the auxiliary path of macrocell base station transmitters to cancel AM/AM and AM/PM distortion from high-power amplifiers. IC Role / Device Role / Timing Role: Vector modulator providing real-time I/Q-adjusted correction signal synchronized to main RF path. Use Value: Enables >40 dB adjacent channel leakage ratio (ACLR) improvement using analog predistortion without FPGA latency. |
Use Scenario: Deployed in the error-sampling loop of feed-forward transmitters to generate precise cancellation signals matching distortion products. IC Role / Device Role / Timing Role: High-linearity RF vector modulator generating phase- and amplitude-matched error vectors at carrier frequency. Use Value: Achieves >50 dB suppression of third-order intermodulation products in multi-carrier WCDMA systems. |
| Beam Forming Networks | RF Cancellation Circuits |
|
Use Scenario: Used in active antenna system (AAS) subarrays to dynamically steer main lobe and suppress sidelobes via per-element phase/gain tuning. IC Role / Device Role / Timing Role: Analog beamformer element delivering calibrated 360° phase shift and 40 dB gain control per RF chain. Use Value: Supports real-time beam agility with <20 ps group delay variation across 60 MHz bandwidth. |
Use Scenario: Embedded in self-interference cancellation systems for full-duplex radios to null leaked transmit energy at receiver front-end. IC Role / Device Role / Timing Role: Wideband vector modulator generating anti-phase replica signal aligned in time and amplitude to interference. Use Value: Delivers >45 dB cancellation depth across 700–1000 MHz with <0.1 dB gain flatness tolerance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar vector modulation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC630LP3E | RoHS-compliant version with matte tin lead finish; identical electrical specs and pinout; MSL1 rating with 260 °C reflow peak. | Required for lead-free manufacturing; no change in RF performance or thermal behavior. | Select HMC630LP3E when RoHS compliance and Pb-free assembly are mandatory. |
| ADL5375-05 | Wideband IQ modulator (300–4000 MHz); higher supply current (125 mA); lower IP3 (+29 dBm); integrated LO buffer and bias control. | Better suited for direct-conversion transmitters above 1 GHz; lacks the ultra-low noise floor (–162 dBm/Hz) needed for sensitive feedback paths. | Choose ADL5375-05 for multiband infrastructure designs requiring broader frequency coverage and integrated LO interface. |
Compared with HMC630LP3E, the HMC630LP3 offers identical RF performance in Sn/Pb assembly environments, while ADL5375-05 trades narrowband optimization for wider frequency support and added integration - making it less suitable for high-dynamic-range 700–1000 MHz linearization where noise floor and IP3 are critical.
Availability
HMC630LP3 is available at Aetrix Electronics and suitable for wireless infrastructure HPA linearization, feed-forward error correction, and RF beam forming applications requiring stable component supply, consistent RF performance across temperature, and long-term obsolescence management.
Supply support for HMC630LP3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RFIC portfolio, specializing in precision analog, RF, and microwave solutions for communications and defense markets.
The HMC630LP3 belongs to the Hittite vector modulator product line, engineered specifically for analog-domain RF linearization and beamforming in cellular infrastructure equipment operating below 1 GHz.
FAQ
What is the operating frequency range of the HMC630LP3?
The HMC630LP3 operates from 700 MHz to 1000 MHz, with all key specifications-including gain flatness, phase accuracy, and IP3-fully characterized and guaranteed across this band. Performance outside this range is not specified and should not be assumed functional. The HMC630LP3 is optimized for cellular infrastructure bands including LTE Band 12/13/14 (700 MHz) and Band 5/8 (850/900 MHz).
Does the HMC630LP3 require external DC blocking on RF ports?
Yes, the HMC630LP3 requires external DC blocking capacitors on both RF input pins (2 and 3) and the RF output pin (9), as all RF ports are DC-coupled internally. The device uses differential 100 Ω input impedance (50 Ω to ground per pin), and absence of DC blocking risks bias disruption and potential damage. The HMC630LP3 datasheet specifies this requirement in the Pin Description and Application Circuit sections.
What is the control voltage range for the I and Q inputs of the HMC630LP3?
The I and Q control inputs of the HMC630LP3 accept DC voltages from +0.5 V to +2.5 V, with nominal center point at +1.5 V for maximum isolation at 900 MHz. This 2 Vpp range enables precise analog tuning of amplitude and phase; exceeding these limits risks distortion or saturation. The HMC630LP3 supports redundant connections on pins 5/15 (I) and 6/16 (Q), allowing flexible PCB layout without performance penalty.
How does thermal management affect HMC630LP3 performance?
Thermal management directly impacts HMC630LP3 gain stability and noise floor: gain variation is specified at 0.02–0.03 dB/°C, and output noise rises with junction temperature. The exposed ground paddle must be soldered to a solid RF/DC ground plane with ≥6 thermal vias to maintain junction temperature ≤85°C. The HMC630LP3's thermal resistance is 29.6 °C/W (junction-to-paddle), so proper heatsinking is essential for sustained +24.5 dBm OIP3 performance.
Can the HMC630LP3 be used in a single-ended RF configuration?
No - the HMC630LP3 is strictly a differential-input, single-ended-output device. Its RF input (pins 2 and 3) presents 100 Ω differential impedance (50 Ω each to ground) and requires a balun or external differential driver; single-ended drive degrades input return loss (<15 dB) and distorts I/Q vector accuracy. The HMC630LP3 does not support true single-ended RF input without external conversion circuitry.
117198-HMC630LP3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Modulator
- Frequency:
- 700MHz ~ 1GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC630LP3
117198-HMC630LP3 FAQ
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7.What is the process for return or replacement of 117198-HMC630LP3?
All 117198-HMC630LP3 units undergo pre-shipment inspection (PSI). If there is an issue with 117198-HMC630LP3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 117198-HMC630LP3 part is unused and in its original packaging.
Return procedure for 117198-HMC630LP3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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