Analog Devices Inc. 123794-HMC752LC4

Overview

HMC752LC4 from Analog Devices is a GaAs HEMT MMIC low-noise amplifier operating at 24–28 GHz, delivering 25 dB small-signal gain, 2.5 dB noise figure, and +13 dBm P1dB output power with +3 V / 70 mA supply. It serves as an RF front-end LNA or LO driver in millimeter-wave radios and instrumentation.

For engineers reviewing the HMC752LC4 datasheet, HMC752LC4 pinout, HMC752LC4 application, or HMC752LC4 equivalent, key selection criteria include its 24–28 GHz bandwidth, 50 Ω matched I/O, DC-blocked terminals, thermal resistance of 148 °C/W, and MSL3 packaging for reflow compatibility.

Technical Context

The HMC752LC4 employs a monolithic GaAs HEMT process to achieve low-noise amplification across the Ka-band. Its three independent gate bias terminals (Vgg1–Vgg3) enable precise current tuning, while dual drain supplies (Vdd1/Vdd2) support stable high-frequency operation under thermal stress.

All RF ports are internally matched to 50 Ω and AC-coupled; the exposed paddle must be soldered to ground for optimal RF performance and thermal dissipation. Gain variation is specified at ±0.02 dB/°C, supporting stable operation from –40 °C to +85 °C.

Key Specifications

Pinout & Package

24-terminal ceramic leadless chip carrier (LCC), 4×4 mm body, alumina substrate, gold-over-nickel finish, MSL3 rated, with exposed thermal paddle requiring direct connection to RF/DC ground.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise amplifier applications.

Compared with HMC752LC4, HMC1099LP3E offers wider bandwidth and higher gain at slightly elevated noise, while QPL9057 trades gain and power for miniaturization and lower current-making HMC752LC4 the balanced choice for fixed 24–28 GHz infrastructure with thermal headroom.

Availability

HMC752LC4 is available at Aetrix Electronics and suitable for point-to-point radios, test instrumentation, and military/space communications requiring stable component supply and full traceability through production lifecycles.

Supply support for HMC752LC4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global semiconductor company specializing in high-performance analog, mixed-signal, and RF technologies for precision signal processing.

The HMC752LC4 belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for millimeter-wave infrastructure including 5G, satellite, defense, and test equipment where Ka-band LNA performance and reliability are critical.

FAQ

What is the recommended gate bias voltage range for stable operation of the HMC752LC4?

The HMC752LC4 requires gate bias voltages between –1 V and +0.3 V across Vgg1–Vgg3 to achieve nominal 70 mA supply current. Typical operation uses –0.3 V at all three terminals. Adjusting Vgg within this range allows fine-tuning of gain, noise figure, and linearity - the HMC752LC4 datasheet specifies that Vgg must be set prior to applying Vdd to avoid device damage.

Does the HMC752LC4 require external matching components at RF input and output?

No, the HMC752LC4 features internally matched 50 Ω AC-coupled input (RFIN) and output (RFOUT) ports. External DC blocking is unnecessary, and no series/shunt matching elements are needed for standard 24–28 GHz operation - however, external decoupling capacitors (C1–C15 per application circuit) are mandatory for stable biasing and RF isolation.

What is the maximum allowable RF input power for the HMC752LC4 without risk of damage?

The absolute maximum RF input power for the HMC752LC4 is +12 dBm, as defined in the Absolute Maximum Ratings table. Exceeding this level risks permanent degradation of the GaAs HEMT transistor. For reliable linear operation, input power should remain ≤ –10 dBm (typical small-signal condition); higher levels require careful compression and IP3 characterization per the HMC752LC4 datasheet.

How should the exposed thermal paddle on the HMC752LC4 package be connected on the PCB?

The exposed paddle on the HMC752LC4 must be soldered directly to a solid, low-impedance RF/DC ground plane using multiple thermal vias (≥8, 0.3 mm diameter). This connection is essential for both thermal management (148 °C/W rating depends on it) and RF return path integrity. Failure to properly attach the paddle results in degraded gain, increased noise figure, and potential thermal runaway during continuous operation.

Is the HMC752LC4 suitable for use as an LO driver in image-reject mixer configurations?

Yes, the HMC752LC4 is explicitly qualified as an LO driver for balanced, I/Q, and image-reject mixers due to its +13 dBm P1dB output power and excellent 50 Ω match. Its 24–28 GHz bandwidth and low 2.5 dB noise figure ensure clean, high-power LO injection with minimal phase noise contribution - making the HMC752LC4 ideal for architectures requiring high-side or low-side LO synthesis in Ka-band transceivers.